Used ASM SIPLACE X4 S mounter with four gantries, 150,000 CPH, 160 feeder slots and configurable placement heads.
The ASM SIPLACE X4 S placement machine is a four-gantry SMT mounter developed for demanding high-volume electronics production. With later-generation benchmark placement performance of up to 150,000 components per hour, the X4 S combines high small-component output, 160 feeder positions and configurable placement heads within one modular production platform.
Depending on the installed head combination, the SIPLACE X4 S can operate as an ultra-high-speed chip placer, a flexible mixed-component mounter or a placement system for selected large and odd-shaped components. Machines equipped with four CP20 high-speed heads have a very different production role from X4 S configurations using CPP or TWIN heads.
GEEKVALUE supplies available used, inspected and refurbished SIPLACE X4 S machines according to the manufacturing year, head configuration, conveyor system, feeder package, software version and equipment condition. Explore the complete ASM SIPLACE X S / XS Series to compare X2S, X3 S, X4 S and X4i S placement platforms.
The SIPLACE X4 S is the standard four-gantry model within the X-Series S platform. Each gantry carries one placement head, giving the machine four independently controlled head positions.
A maximum-output configuration can use four CP20 or earlier SpeedStar heads for rapid placement of small standard components. Other machines may combine CP20, CPP and TWIN heads to process a broader component spectrum.
Four independently controlled placement gantries
One placement head installed on each gantry
Later benchmark placement speed up to 150,000 CPH
Later IPC placement speed up to 130,000 CPH
Earlier theoretical rating up to 170,500 CPH
CP20, CPP and TWIN placement-head options
Earlier SpeedStar, MultiStar and TwinHead terminology
Up to 160 positions for 8 mm SIPLACE X feeders
Single-conveyor and flexible dual-conveyor options
Support for small chips, ICs, tray-fed parts and selected odd-shaped components
Digital component vision and automated PCB warpage compensation
Suitable for high-volume telecommunications, server, automotive and EMS production
| Specification | Typical Later SIPLACE X4 S Configuration |
|---|---|
| Machine type | Four-gantry high-speed and flexible SMT placement machine |
| Number of gantries | 4 |
| Placement heads | CP20, CPP and TWIN, depending on machine generation and configuration |
| Earlier head names | SpeedStar, MultiStar and TwinHead |
| Later SIPLACE benchmark speed | Up to approximately 150,000 CPH |
| Later IPC placement speed | Up to approximately 130,000 CPH |
| Earlier theoretical speed | Up to approximately 170,500 CPH |
| Earlier SIPLACE benchmark speed | Up to approximately 125,000 CPH |
| Earlier IPC placement speed | Up to approximately 105,000 CPH |
| Standard platform component spectrum | Approximately 0201 metric to 200 × 110 × 25 mm, depending on installed heads |
| Later TWIN capability | Selected components up to approximately 200 × 150 × 25 mm, depending on head version |
| Best platform placement accuracy | Head- and generation-dependent; up to approximately 22–26 μm at 3 sigma with a suitable TWIN configuration |
| Feeder capacity | Up to 160 positions for standard 8 mm SIPLACE X feeders |
| Minimum PCB size | Approximately 50 × 50 mm |
| Single-conveyor PCB size | Up to approximately 450 × 685 mm on current standard configurations |
| Dual-conveyor PCB size | Up to approximately 450 × 320 mm per lane |
| Dual conveyor as single lane | Up to approximately 450 × 600 mm |
| Long-board capability | Up to approximately 800 mm on current configurations; earlier documentation lists up to 850 mm with LBO |
| Maximum optional PCB width | Approximately 680–685 mm, depending on conveyor generation |
| Machine dimensions | Approximately 1,948 × 2,647 × 1,630 mm |
| Conveyor options | Single conveyor and flexible dual conveyor |
| Typical production role | High-volume placement of small components with configurable mixed-component capability |
Configuration notice: SIPLACE X4 S machines were produced across several placement-head, software and conveyor generations. The speed, component spectrum, PCB dimensions, accuracy and optional functions of a used machine must be verified from its original nameplate, head labels, software version and powered-on inspection.
Earlier and later X4 S brochures use different speed values because the platform was updated with newer placement heads, cameras, software and machine-performance standards.
| Specification Generation | Performance Type | Published X4 S Value |
|---|---|---|
| Earlier X-Series S documentation | Theoretical speed | Up to 170,500 CPH |
| Earlier X-Series S documentation | SIPLACE benchmark | Up to 125,000 CPH |
| Earlier X-Series S documentation | IPC speed | Up to 105,000 CPH |
| Later ASMPT documentation | SIPLACE benchmark | Up to 150,000 CPH |
| Later ASMPT documentation | IPC speed | Up to 130,000 CPH |
| Actual factory production | Real PCB output | Application- and machine-dependent |
The earlier 170,500 CPH figure is a theoretical rating. It should not be described as the guaranteed production output of every X4 S.
The later 150,000 CPH value is a SIPLACE benchmark rating associated with a suitable later-generation configuration. A used machine must have its head generation and software checked before this value is assigned to it.
Placement head installed on each of the four gantries
Total component placements per PCB
Distribution of placements between the four heads
Feeder positions and component tape widths
PCB dimensions and panel format
Component size and required rotation
Number of nozzle changes
Tray or special component-supply time
Component inspection requirements
PCB warpage compensation
Conveyor loading and unloading cycle
Pickup retries and component rejection rate
Placement-head, nozzle and feeder condition
Production-program optimization
Complete SMT line balance
A realistic capacity assessment should be calculated from the PCB BOM, placement file, feeder layout and required cycle time instead of using the highest published CPH number alone.
The four-gantry design gives the X4 S significantly more placement capacity than the two-gantry X2 S or three-gantry X3 S. Each gantry moves independently and carries one placement head.
The production software distributes components between the four gantries according to:
Placement-head capability
Component feeder position
Component dimensions
Required nozzle or gripper
Placement accuracy
Placement force
PCB coordinates
Head travel distance
Estimated cycle time
A correctly optimized program allows all four heads to complete their work at approximately the same time. If one gantry is assigned substantially more placements or longer travel distances, the other heads may wait and machine utilization will decrease.
Four CP20 heads for maximum small-component output
Three CP20 heads plus one CPP head
Two CP20 heads plus two CPP heads
CP20, CPP and TWIN mixed configurations
Multiple CPP heads for high-mix production
TWIN-equipped configurations for large or odd-shaped components
The model name “X4 S” identifies the number of gantries but does not identify the head installed on each gantry. Clear photographs of all four head labels should be requested before quotation.
The CP20 is a 20-segment Collect & Place head developed for high-speed placement of small standard surface-mount components. Earlier X4 S equipment documentation may identify the equivalent production role as SpeedStar.
The head collects multiple components from the stationary feeder area, checks their position and orientation through the digital vision system and then places them onto the stationary PCB.
| Typical component spectrum | Approximately 0201 metric to 8.2 × 8.2 × 4 mm |
|---|---|
| Maximum published head speed | Up to approximately 43,000 CPH |
| Current published accuracy | Up to approximately ±34 μm at 3 sigma |
| Placement force | Approximately 0.5 N to 4.5 N |
| Operating principle | 20-segment Collect & Place |
| Primary production role | High-volume placement of small standard components |
Chip resistors
Multilayer ceramic capacitors
Small diodes
SOT transistors
Resistor and capacitor arrays
Small-outline integrated circuits
Small CSP and BGA packages
LED components
Other high-volume tape-fed SMD packages
An X4 S fitted with four CP20 or SpeedStar heads is designed primarily for maximum chip-placement output. It does not have the same large-component capability as a machine equipped with CPP or TWIN heads.
The CPP head is designed for production programs containing small passive components and medium-sized IC packages. Earlier equipment documentation may use the name MultiStar for this flexible placement role.
The CPP can switch through software between:
Collect & Place mode
Pick & Place mode
Mixed placement mode
| Typical component spectrum | Approximately 01005 to 50 × 40 × 15.5 mm |
|---|---|
| Maximum published head speed | Up to approximately 23,500 CPH on current specifications |
| Published accuracy | Up to approximately ±30 μm at 3 sigma |
| Maximum component weight | Approximately 20 g |
| Placement modes | Collect & Place, Pick & Place and mixed mode |
| Primary production role | Flexible mixed-component placement |
Small passive components
QFP and BGA packages
CSP devices
Medium-sized IC packages
Components requiring controlled placement force
Products with frequent component-mix changes
Automotive and industrial PCB assemblies
High-mix EMS production
Adding one or more CPP heads reduces the maximum small-component rating but can improve complete line balance when the PCB includes a broader component spectrum.
The TWIN head is intended for large, heavy, tall, precision or odd-shaped components. Earlier X4 S documentation may identify this head family as TwinHead or TwinStar.
The TWIN processes components individually and may use vacuum nozzles, special adapters or mechanical grippers.
| Standard platform component spectrum | Approximately 0201 metric to 200 × 110 × 25 mm |
|---|---|
| Later published capability | Selected components up to approximately 200 × 150 × 25 mm |
| Maximum published head speed | Up to approximately 5,500 CPH |
| Current published accuracy | Up to approximately ±26 μm at 3 sigma |
| Placement force | Approximately 1 N to 30 N |
| Component weight | Head-generation dependent; later TWIN VHF configurations may support up to approximately 300 g |
| Additional functions | Snap-in detection and real-time 3D measurement on suitable configurations |
Large BGA and QFP packages
Large connectors
Power electronic devices
Sockets and switches
Coils and transformers
Tray-fed processors and controllers
Mechanical electronic components
Parts requiring controlled insertion force
Selected odd-shaped components
The largest published dimensions do not mean that every component of that size can be placed. Compatibility also depends on component weight, pickup surface, centre of gravity, gripper design, camera field, feeder presentation and available PCB clearance.
| Placement Head | Typical Component Spectrum | Main Production Role |
|---|---|---|
| CP20 / SpeedStar | Very small components to approximately 8.2 × 8.2 × 4 mm | Maximum small-component output |
| CPP / MultiStar | Small components to approximately 50 × 40 × 15.5 mm | Flexible mixed-component placement |
| TWIN / TwinHead | Large, heavy and odd-shaped components up to the supported platform limits | Precision and end-of-line placement |
Before selecting a used X4 S, provide:
Smallest component package
Largest component dimensions
Maximum component height
Maximum component weight
Component pickup surface
Required placement accuracy
Required placement force
Tape, tray or special feeder presentation
Required nozzles or grippers
The X-Series S platform is designed for high-volume placement of very small components. However, stable production depends on the complete machine and process package.
A suitable small-component configuration may require:
Compatible CP20 or SpeedStar placement heads
High-resolution digital component cameras
Correct micro-component nozzles
Suitable low-force nozzle sleeves
Compatible and calibrated SIPLACE X feeders
Correct machine and programming software
Accurate feeder pickup-position calibration
Consistent carrier-tape pocket quality
Stable PCB support
Accurate solder-paste printing
Controlled factory temperature and humidity
When the X4 S is being purchased specifically for very small components, request a pickup and placement test using a representative package before shipment.
The SIPLACE X4 S provides up to 160 positions for standard 8 mm SIPLACE X feeders. The large feeder capacity supports component-dense PCBs and products containing many separate material part numbers.
Wider tape feeders occupy multiple positions. The actual number of physical feeder units therefore depends on the combination of 8 mm, 12 mm, 16 mm, 24 mm, 32 mm and wider component tapes.
8 mm SIPLACE X or Xi feeders
12 mm and 16 mm tape feeders
24 mm, 32 mm and wider tape feeders
Waffle Pack Changer
Matrix Tray Changer
Manual tray holders
Stick and vibratory feeders
Bulk-case feeders
Glue Feeder
Linear Dipping Unit
PowerConnector and application-specific systems
Number of component trolleys supplied
Number of included 8 mm feeders
Quantity and width of larger feeders
Feeder model, part number and generation
Feeder firmware and machine-software compatibility
Feeder calibration status
Pickup and tape-indexing performance
Component-trolley communication condition
Trolley docking and locking condition
Reel holders and waste-tape containers
Required spare feeder quantity
Feeders, component trolleys and tray systems are not automatically included with every used X4 S. Every included item should be identified clearly in the quotation.
An X4 S equipped with CPP or TWIN heads can process tray-fed ICs, large processors, power devices and other components that cannot be supplied through standard tape feeders.
Possible tray options include:
WPC5 or WPC6 Waffle Pack Changer
Matrix Tray Changer
Manual JEDEC tray holders
Application-specific tray systems
Before ordering a machine for tray-fed production, confirm:
Tray-system model and part number
Supported tray dimensions
Number of tray levels or magazines
Non-stop refill capability
Tray elevator and transfer operation
Software communication with the machine
Component pickup-position calibration
Required nozzles or grippers
The X4 S can be configured with a single conveyor or flexible dual conveyor. The actual transport system determines PCB width, production mode and compatibility with surrounding equipment.
Current standard data lists a single-conveyor format up to approximately 450 × 685 mm. The optional conveyor width and support package must be present on the actual machine.
A current dual-conveyor configuration supports boards up to approximately 450 × 320 mm per lane.
Depending on the installed software and conveyor generation, the two lanes may support:
Synchronous production
Asynchronous production
The same product on both lanes
Different products on separate lanes
Reduced non-productive PCB transfer time
The flexible dual conveyor can be operated as one wider lane on suitable configurations, supporting PCB formats up to approximately 450 × 600 mm.
Current platform data lists a long-board option up to approximately 800 mm. Earlier X4 S documentation lists PCB lengths up to approximately 850 mm with the relevant Long Board Option.
This difference reflects conveyor and documentation generation. The actual maximum should be confirmed through physical measurements and a powered-on board-transfer test.
Minimum and maximum PCB dimensions
PCB thickness
Maximum assembled-board weight
Single-lane or dual-lane requirement
Same or different product on each lane
Required PCB transport direction
Fixed conveyor-rail position
Required production-line height
PCB edge-clearance requirement
Long-board or wide-board requirement
PCB support and warpage-control requirement
Interface with upstream and downstream equipment
The SIPLACE X S platform combines digital vision, smart sensors, linear drives and software-controlled correction to support stable production at high placement speeds.
Depending on machine generation and installed options, available functions may include:
Component-presence detection
Vacuum monitoring during pickup and placement
Component-position and rotation correction
Programmable placement-force monitoring
PCB fiducial recognition
Automatic PCB warpage detection and compensation
Closed-loop component-pickup correction
Bad-board and bad-panel recognition
Automatic feeder-setup verification
Barcode-controlled production
Component traceability
3D coplanarity inspection
Smart nozzle identification
On-board PCB inspection
Predictive and preventive maintenance functions
The X4 S model designation does not prove that every optional camera, sensor, scanner or software license is installed. Required functions should be demonstrated on the actual machine.
Large, thin or component-dense PCBs may deform during printing and placement. PCB warpage can change the distance between the component nozzle and board surface, affecting placement stability.
Depending on configuration, the X4 S may use:
Automatic PCB warpage measurement
Z-height compensation during placement
Smart Pin Support
Programmable board-support positions
Support-pin setup verification
Product-specific board-support programs
These functions are particularly relevant for server boards, telecommunications assemblies and wide industrial PCBs.
The X4 S is intended primarily for high-volume products that require high component counts, consistent placement quality and large material setup capacity.
Telecommunications and 5G equipment
Server and data-centre hardware
Network infrastructure products
High-performance computing boards
Automotive electronic modules
Industrial control electronics
Consumer electronic products
Medical electronic assemblies
LED and display-control boards
High-volume EMS production
Large and component-dense PCBs
Mixed-component volume production
A four-CP20 configuration is suitable for products dominated by small components. Mixed CP20 and CPP configurations provide more IC flexibility, while machines with TWIN heads can handle larger and special components.
| Comparison | SIPLACE X4 S | SIPLACE X4i S |
|---|---|---|
| Number of gantries | 4 | 4 |
| Later benchmark speed | Up to 150,000 CPH | Up to 172,000 CPH |
| Later IPC speed | Up to 130,000 CPH | Up to 146,000 CPH |
| Maximum 8 mm feeder positions | Up to 160 | Up to 148 |
| Primary positioning | High output with maximum standard feeder capacity | Highest-output X-Series S configuration |
| Head options | CP20, CPP and TWIN | CP20, CPP and TWIN, depending on generation |
| Critical verification | Machine generation, heads, conveyor and software | Complete model label, performance generation and transport configuration |
The X4i S provides higher published output, while the X4 S provides up to 160 feeder positions. The better machine depends on the PCB program, feeder demand, actual machine condition and required line balance.
| Comparison | SIPLACE X2 S | SIPLACE X3 S | SIPLACE X4 S |
|---|---|---|---|
| Number of gantries | 2 | 3 | 4 |
| Later benchmark speed | Up to 75,000 CPH | Up to 112,500 CPH | Up to 150,000 CPH |
| Later IPC speed | Up to 65,000 CPH | Up to 97,050 CPH | Up to 130,000 CPH |
| Maximum 8 mm feeder positions | Up to 160 | Up to 160 | Up to 160 |
| Configurable head positions | 2 | 3 | 4 |
| Typical positioning | Flexible two-head production | Balanced output and flexibility | Maximum standard X S platform output |
Additional gantries generally provide more placement capacity, but a correctly configured X3 S can outperform an unsuitable X4 S on a mixed-component PCB. Head combination and line balance remain critical.
The original SIPLACE X4 and the later SIPLACE X4 S belong to different platform generations.
| Comparison | SIPLACE X4 S | Original SIPLACE X4 |
|---|---|---|
| Platform family | Later X-Series S platform | Original modular X Series |
| Common head terminology | SpeedStar, MultiStar, TwinHead or later CP20, CPP and TWIN | C&P20, C&P12, C&P6 and TwinHead |
| Published performance | Later benchmark up to 150,000 CPH | Original head-combination-dependent performance |
| Correct series page | SIPLACE X S / XS Series | Original SIPLACE X Series |
| Model verification | Nameplate should identify X4 S | Nameplate should identify X4 without S |
Used-equipment listings sometimes omit the letter “S.” The machine nameplate must be checked before X4 S specifications are applied.
The X4 S can serve as the main high-speed placement section of a complete SMT line. It may also handle mixed components when equipped with CPP or TWIN heads.
A typical line may include:
PCB loader
Solder paste printer
3D solder paste inspection system
SIPLACE X4 S high-speed placement machine
X2 S, SX or TX flexible placement machine where required
Reflow oven
Automatic optical inspection system
PCB unloader
The total line output is determined by its slowest process. Installing an X4 S will not increase complete line output when the printer, flexible placement stage, reflow oven or inspection system remains the main bottleneck.
A used X4 S should be evaluated as a complete production system. A successful startup or clean exterior does not confirm that all four gantries can maintain stable output and placement accuracy.
Complete machine model
X4 S or X4i S confirmation
Machine item and serial numbers
Manufacturing year
Total operating hours
Total placement counter
Original factory configuration
Current installed configuration
Station-software version
Programming-software compatibility
Head installed on each of the four gantries
CP20, CPP or TWIN confirmation
Earlier SpeedStar, MultiStar or TwinHead identification
Head part and serial numbers
Individual head operating hours
Individual placement counters
Installed component-camera type
Nozzle-changer configuration
Head maintenance and repair history
Movement of all four gantries
X-axis and Y-axis noise
Vibration during acceleration and deceleration
Machine homing and reference operation
Linear-motor condition
Encoder and position-feedback condition
Axis-drive alarm history
Cable-chain and trailing-cable condition
Gantry calibration and alignment
Nozzle-segment and sleeve wear
Z-axis movement
Rotational-axis movement
Vacuum pressure and leakage
Component-sensor operation
Placement-force monitoring
Nozzle-changer operation
Pickup and placement repeatability
Special nozzle or gripper operation
Snap-in detection where required
Component camera on all four gantries
High-resolution camera availability
PCB-camera image quality
Lighting-level operation
Component-shape recognition
Fiducial recognition
Pickup-position correction
PCB warpage measurement
3D coplanarity option where required
Camera calibration status
Single or flexible dual conveyor
Synchronous and asynchronous operation
Automatic width adjustment
Conveyor belts and pulleys
PCB entrance and exit sensors
Board clamping and support
Dual conveyor used as a single lane
Long-board and wide-board options
Maximum measured PCB dimensions
Communication with surrounding equipment
Number of included component trolleys
Number and type of included feeders
Feeder tape-width combinations
Feeder generation and part numbers
Feeder firmware and machine compatibility
Feeder indexing and pickup performance
Wireless or contactless interface condition
Trolley docking and locking condition
Communication-unit operation
Reel holders and waste-tape containers
Waffle Pack Changer availability
Matrix Tray Changer availability
Tray elevator and transfer operation
Glue Feeder availability
Linear Dipping Unit availability
MeasuringFeeder availability
PowerConnector or OSC package
Special nozzles and grippers
Station computers and monitors
Machine-software backups
Product and configuration files
Nozzles and nozzle magazines
Component trolleys and feeders
Tray and special component systems
Transformer or voltage-conversion equipment
Operating and maintenance manuals
Calibration tools
Included spare parts
A complete inspection video should show startup, homing, operation of all four gantries, every installed head, feeder pickup, component recognition, nozzle changing, PCB transport and an actual sample placement program.
The X4 S operates with high acceleration and continuous placement cycles. Preventive maintenance is necessary to maintain speed, placement accuracy and process stability.
CP20 or SpeedStar placement-head segments
CPP or MultiStar head assemblies
TWIN or TwinHead Z-axis assemblies
Nozzle sleeves and nozzle holders
Nozzles and automatic nozzle changers
Vacuum valves, generators and filters
Placement-force and component sensors
Component cameras and lighting modules
PCB camera and fiducial lighting
Linear motors and encoders
Axis drives and control boards
Trailing cables and cable chains
Cooling fans and machine filters
Conveyor belts, pulleys and sensors
PCB support and warpage systems
Component-trolley docking interfaces
SIPLACE X and Xi feeder modules
Station computers and storage devices
Recommended maintenance includes placement-head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, conveyor adjustment, axis inspection, filter replacement and verification of current software backups.
A used X4 S may be suitable for manufacturers that require high-volume placement capacity or need to expand or replace equipment in an existing X-Series S production line.
The machine may be practical when:
The PCB contains a high number of small components
Four placement gantries are required for the target output
The factory already owns compatible SIPLACE X feeders
The existing line uses X2 S, X3 S, X4 S or X4i S machines
The production program requires up to 160 feeder positions
Existing technicians understand X-Series S operation
Replacement heads and spare parts are available
A failed X4 S must be replaced without redesigning the line
A used-machine investment is preferred over a new platform
A different platform may be more suitable when the required PCB, component, software or automation functions are not installed on the available used machine.
X4 S or X4i S model requirement
Required machine quantity
Preferred manufacturing year
Preferred machine condition
Required placement-head combination
Target production output
Minimum component package
Maximum component dimensions
Maximum component height and weight
Required placement accuracy
Required placement force
PCB dimensions and thickness
Single- or dual-conveyor requirement
Long-board or wide-board requirement
Required feeder quantities and tape widths
Tray or special component-supply requirement
Existing SIPLACE machines and feeders
Factory voltage and frequency
Compressed-air availability
Destination country
Required delivery schedule
Customers who need a cycle-time assessment may send the PCB BOM, placement file, component list, panel dimensions and target hourly output for preliminary machine matching.
The SIPLACE X4 S is a four-gantry SMT placement machine used primarily for high-volume small-component placement. With CPP or TWIN heads, it can also process ICs, tray-fed parts and selected odd-shaped components.
The X4 S has four independently controlled placement gantries. Each gantry carries one placement head.
Later ASMPT specifications list up to approximately 150,000 CPH SIPLACE benchmark performance and 130,000 CPH IPC performance.
The 170,500 CPH value is an earlier theoretical rating. The same earlier documentation lists 125,000 CPH benchmark performance and 105,000 CPH IPC performance.
No. It is a theoretical rating under favorable test conditions. Actual production depends on the head configuration, PCB program, feeder layout, machine condition and complete line balance.
Later machines may use CP20, CPP and TWIN heads. Earlier X4 S documentation may use SpeedStar, MultiStar and TwinHead terminology.
The complete component spectrum depends on the installed heads. The platform can cover small metric components through selected large components around 200 × 110 or 200 × 150 mm.
The X4 S supports up to 160 positions for standard 8 mm SIPLACE X feeders. Wider tape feeders occupy multiple positions and reduce the total feeder quantity.
Yes. Suitable machines may use a Waffle Pack Changer, Matrix Tray Changer or another tray-supply system with compatible CPP or TWIN heads.
Yes. The flexible dual conveyor supports two PCB lanes and may operate synchronously or asynchronously, depending on the installed configuration.
Current standard specifications list up to approximately 450 × 685 mm with a single conveyor and 450 × 320 mm per lane with a dual conveyor. Long-board capability depends on the installed option.
The X4 S is rated at up to 150,000 CPH benchmark output and provides up to 160 feeder positions. The X4i S is rated at up to 172,000 CPH but provides up to 148 feeder positions.
No. The X4 S belongs to the later X-Series S generation. The original X4 uses different head terminology, software and performance specifications.
Not automatically. Feeders, component trolleys, tray systems, nozzles and spare parts may be included or quoted separately. Every included item should be listed clearly.
Test all four gantries, every installed placement head, component cameras, PCB camera, sensors, nozzle changers, conveyor, feeders, component trolleys, station computers and required software functions.
Send your required placement-head combination, PCB dimensions, component range, target output, feeder requirement, conveyor configuration and destination country. GEEKVALUE will check available ASM SIPLACE X4 S machines and confirm the model, serial number, manufacturing year, installed heads, conveyor, software, included accessories, inspection scope and delivery arrangement.
View the complete ASM SIPLACE X S / XS Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
