Used ASM SIPLACE X2 S mounter with two gantries, up to 75,000 CPH, 160 feeder slots and configurable placement heads.
The ASM SIPLACE X2 S placement machine is a modular two-gantry SMT mounter designed for high-volume production, mixed-component PCB assembly and flexible end-of-line placement. Depending on the installed placement heads, the same machine platform can be configured for high-speed chip placement, medium-sized IC processing or large and odd-shaped component handling.
Later SIPLACE X2 S configurations provide benchmark placement performance of up to 75,000 components per hour and support up to 160 positions for standard 8 mm SIPLACE X feeders. Earlier machines may have different published performance values because of differences in placement-head generation, machine software and test standards.
GEEKVALUE supplies available used, inspected and refurbished X2S machines according to the required head combination, PCB conveyor, feeder package, software version and machine condition. Explore the complete ASM SIPLACE X S / XS Series to compare X2S, X3S, X4S and X4i S placement configurations.
The SIPLACE X2 S uses two independently controlled placement gantries. Each gantry carries one placement head, allowing the machine to use two identical heads or two heads with different production functions.
A machine equipped with two high-speed heads can be used for volume placement of small passive components. A mixed configuration with one high-speed head and one flexible or TwinStar head can process a broader component range within the same placement module.
Two independently operating placement gantries
One placement head installed on each gantry
Later benchmark performance up to 75,000 CPH
Later IPC performance up to 65,000 CPH
Earlier theoretical performance up to 85,250 CPH
SpeedStar or CP20P high-speed head option
MultiStar or CPP flexible head option
TwinStar or TH precision placement-head option
Up to 160 feeder positions for 8 mm SIPLACE X feeders
Single-conveyor and flexible dual-conveyor options
Support for very small chips, IC packages, tray-fed parts and selected odd-shaped components
Suitable for high-volume and mixed-component SMT production
| Specification | Typical SIPLACE X2 S Configuration |
|---|---|
| Machine type | Modular two-gantry SMT placement machine |
| Number of gantries | 2 |
| Placement heads | SpeedStar/CP20P, MultiStar/CPP and TwinStar/TH, depending on machine generation |
| Later benchmark placement rate | Up to approximately 75,000 CPH |
| Later IPC placement rate | Up to approximately 65,000 CPH |
| Earlier theoretical placement rate | Up to approximately 85,250 CPH |
| Earlier benchmark placement rate | Up to approximately 65,500 CPH |
| Earlier IPC placement rate | Up to approximately 52,000 CPH |
| Overall platform component range | Approximately 0201 metric to 200 × 125 × 25 mm, depending on installed heads |
| Best published placement accuracy | Up to approximately 22 μm at 3 sigma with the relevant TwinStar configuration |
| Feeder capacity | Up to 160 positions for 8 mm SIPLACE X feeders |
| Minimum PCB size | Approximately 50 × 50 mm |
| Earlier standard single-conveyor capacity | Up to approximately 450 × 560 mm |
| Earlier long-board capacity | Up to approximately 850 × 560 mm with the required extension |
| Later maximum platform PCB capacity | Up to approximately 850 × 685 mm with the applicable conveyor options |
| PCB thickness | Approximately 0.3–4.5 mm; other thicknesses require confirmation |
| PCB conveyor | Single conveyor or flexible dual conveyor |
| Machine dimensions | Approximately 1.9 × 2.6 × 1.6 m |
| Component supply | X feeders, trays, waffle packs, stick magazines, bulk feeders and application-specific modules |
| Typical production role | High-speed chip placement, mixed-component assembly or flexible end-of-line placement |
Configuration notice: The SIPLACE X2 S was produced across different placement-head, software and conveyor generations. The actual speed, smallest component, maximum PCB size and component range of a used machine must be confirmed from its nameplate, installed hardware and powered-on inspection.
Different SIPLACE X2 S brochures show different placement-speed figures. These values were published for different machine generations and performance-test methods and should not be combined as though they describe one fixed configuration.
| Documentation Generation | Performance Type | Published X2 S Value |
|---|---|---|
| Earlier X-Series S documentation | Theoretical rating | Up to 85,250 CPH |
| Earlier X-Series S documentation | SIPLACE benchmark | Up to 65,500 CPH |
| Earlier X-Series S documentation | IPC rating | Up to 52,000 CPH |
| Later ASM X S documentation | SIPLACE benchmark | Up to 75,000 CPH |
| Later ASM X S documentation | IPC rating | Up to 65,000 CPH |
| Actual factory production | Real PCB output | Application- and machine-dependent |
The original product page’s 102,300 CPH figure should not be reused unless documentation for a specific upgraded machine can verify that value. For a general X2 S product page, 75,000 CPH should be used as the later SIPLACE benchmark rating rather than as guaranteed actual production output.
Placement head installed on each gantry
Number of placements on each PCB
Distribution of components between the two gantries
Feeder locations and tape widths
PCB dimensions and panel format
Component dimensions and required rotation
Nozzle-change frequency
Tray access and special component-supply time
Component vision and coplanarity inspection
Conveyor loading and unloading cycle
Pickup retries and component rejection rate
Placement-head, nozzle and feeder condition
Production-program and complete line optimization
A realistic production estimate should be calculated from the PCB BOM, component coordinates, feeder arrangement and target cycle time instead of the maximum published CPH value alone.
The two-gantry architecture allows the X2 S to be configured for several different production roles. Each gantry can carry a head selected according to component size, placement output, accuracy and placement-force requirements.
Common head combinations may include:
Two SpeedStar or CP20P heads for maximum small-component output
SpeedStar plus MultiStar for high-speed and mixed IC production
SpeedStar plus TwinStar for chips, large ICs and connectors
Two MultiStar heads for high-mix production
MultiStar plus TwinStar for flexible end-of-line placement
Two TwinStar heads for large, precision and odd-shaped components
A machine with two high-speed heads has a different production capability from an X2 S equipped with MultiStar and TwinStar heads. The complete head combination must therefore be stated in every quotation.
The SpeedStar, also described in later documentation as a CP20P high-speed placement head, uses twenty nozzle segments to collect multiple components before moving to the PCB.
This head is optimized for high-volume placement of small standard SMD components. Components are collected from the stationary feeder area, inspected by the digital vision system and placed onto the stationary PCB.
| Typical component range | Approximately 0201 metric to 8.2 × 8.2 × 4 mm on later configurations |
|---|---|
| Earlier published maximum size | Approximately 6 × 6 × 4 mm |
| Maximum head performance | Up to approximately 43,000 CPH per head in later published specifications |
| Typical component types | Resistors, capacitors, small diodes, transistors, arrays and small IC packages |
| Production priority | Maximum small-component placement output |
A two-SpeedStar configuration normally provides the highest X2 S placement rate. It is best suited to boards dominated by small tape-fed components.
Chip resistors
Multilayer ceramic capacitors
Small diodes
SOT transistors
Resistor and capacitor arrays
Small-outline IC packages
Small CSP and BGA packages
LED components
High-density telecommunications-board components
The MultiStar or CPP head is designed for PCB programs containing both small standard components and medium-sized integrated circuits. It can switch between different placement modes through the production software.
Depending on the machine and head generation, available modes can include:
Collect & Place operation for smaller components
Pick & Place operation for larger packages
Mixed placement mode for a combination of component types
| Typical component range | Very small components to approximately 50 × 40 mm |
|---|---|
| Maximum component height | Up to approximately 15.5 mm on later configurations |
| Maximum component weight | Up to approximately 20 g |
| Placement function | Software-selectable Collect & Place, Pick & Place or mixed operation |
| Production priority | Balanced speed and component flexibility |
A MultiStar-equipped X2 S can process a wider component mix without requiring frequent physical head changes. This makes it suitable for high-mix production and product families containing both passive components and medium-sized IC packages.
The TwinStar or TH head is intended for large, heavy, fine-pitch, delicate and odd-shaped components. It processes components individually and may use vacuum nozzles, component-specific adapters or mechanical grippers.
| Maximum component dimensions | Selected components up to approximately 200 × 125 mm |
|---|---|
| Maximum component height | Up to approximately 25 mm |
| Maximum component weight | Up to approximately 160 g on later published configurations |
| Best published placement accuracy | Approximately 22 μm at 3 sigma with the relevant configuration |
| Special functions | Programmable placement force, snap-in detection and special gripper support |
| Production priority | Precision placement of large and complex components |
The maximum component dimensions describe the capability of the complete head and machine platform under suitable conditions. Not every component measuring 200 × 125 mm can automatically be processed.
Component compatibility also depends on:
Component weight
Component height
Pickup surface
Center of gravity
Required placement force
Required nozzle or gripper
Camera field of view
Tray, tape or special feeder presentation
Available clearance around the PCB placement position
The overall X2 S platform range can extend from very small metric chips to selected components measuring approximately 200 × 125 × 25 mm. However, this complete spectrum requires different placement heads.
| Placement Head | Primary Component Range | Typical Production Role |
|---|---|---|
| SpeedStar / CP20P | Very small chips to small IC packages | High-speed volume placement |
| MultiStar / CPP | Small chips to medium-sized IC packages | Flexible mixed-component production |
| TwinStar / TH | Large, heavy, fine-pitch and odd-shaped components | Precision and end-of-line placement |
Before confirming a machine, provide the smallest component, largest component, maximum height, maximum weight and required placement accuracy. This allows the installed head combination to be matched to the real production requirement.
The X2 S can be configured for high-volume placement of very small components, but stable production requires the correct head, nozzle, feeder, software and process conditions.
A complete small-component process may require:
Compatible SpeedStar or CP20P placement head
High-resolution digital component camera
Correct micro-component nozzles
Suitable low-force nozzle sleeves
Calibrated 8 mm SIPLACE X feeders
Compatible station and programming software
Accurate feeder pickup-position calibration
Suitable tape-pocket dimensions and component packaging
Stable PCB clamping and support
Accurate solder-paste printing
Controlled factory temperature and humidity
When the machine is being purchased specifically for 0201 metric or another very small package, request a representative pickup and placement test before shipment.
The SIPLACE X2 S can provide up to 160 feeder positions when calculated using standard 8 mm SIPLACE X feeders. This capacity supports complex PCB programs containing many component part numbers.
Wider tape feeders occupy several 8 mm positions. The actual number of installed feeder units therefore depends on the required combination of tape widths.
8 mm SIPLACE X feeders
12 mm and 16 mm tape feeders
24 mm, 32 mm and wider tape feeders
SIPLACE component carts
Matrix Tray Changer
Waffle Pack Changer
Stick and vibratory feeders
Bulk-case feeders
Application-specific OEM component modules
Automatic feeder identification
Transfer of feeder and component information
Setup verification
Feeder status display
Controlled tape indexing
Feeder replacement during suitable production conditions
Reduced setup and product-change time
Improved component traceability
Number of component carts included
Number of 8 mm feeders included
Quantity and width of larger feeders
Feeder model and part numbers
Feeder firmware compatibility
Feeder calibration condition
Component-cart communication condition
Cart docking and locking mechanism
Reel holders and waste-tape containers
Required spare feeder quantity
Feeders and component carts are not automatically included with every used X2 S. The quotation should clearly separate the machine, heads, carts, feeders, nozzles and tray equipment.
An X2 S configured with a MultiStar or TwinStar head may be used for tray-fed ICs, large packages and special components.
Available component-supply systems may include:
SIPLACE Matrix Tray Changer
Waffle Pack Changer
Manual tray holders
Stick magazine feeders
Vibratory component feeders
Bulk-case feeders
Customer-specific component-supply modules
Before ordering a machine for tray production, confirm:
Tray-system model and part number
Supported tray dimensions
Number of tray levels or magazines
Tray elevator and transfer operation
Machine-software communication
Pickup-position calibration
Required nozzles or mechanical grippers
Available clearance around the machine
The SIPLACE X2 S may be fitted with a single conveyor or flexible dual conveyor. The actual conveyor configuration determines the maximum PCB width, line operating mode and compatibility with surrounding machines.
Earlier standard X-Series S specifications commonly list single-conveyor PCB capacity of approximately 450 × 560 mm. A long-board option can extend the board length to approximately 850 mm.
Later platform documentation lists maximum PCB dimensions up to approximately 850 × 685 mm when the applicable conveyor and input/output extensions are installed.
A flexible dual conveyor can process two PCB lanes and reduce non-productive transport time. Depending on the installed configuration, the machine may support:
Synchronous dual-lane production
Asynchronous dual-lane production
The same product on both lanes
Different products on separate lanes
Dual conveyor used as one wider single lane
Long-board operation with suitable extensions
Minimum PCB length and width
Maximum PCB or panel dimensions
PCB thickness
Maximum assembled-board weight
Single-lane or dual-lane production requirement
Same or different product on each lane
Required transport direction
Fixed conveyor-rail position
Required production-line height
PCB edge-clearance requirement
Long-board or wide-board requirement
PCB support and warpage-control requirement
Communication interface with surrounding machines
The maximum PCB size should not be confirmed from the X2 S model name alone. Request actual conveyor measurements, option records and a powered-on board-transport test.
The SIPLACE X S platform combines digital vision, sensors and software-controlled correction to support stable placement at high machine speeds.
Depending on the installed options, process-control functions may include:
Component-presence detection
Vacuum monitoring during pickup and placement
Component position and rotation correction
Programmable placement-force monitoring
PCB fiducial recognition
PCB warpage measurement and compensation
Bad-board and bad-panel recognition
Barcode-controlled feeder setup
Component traceability
Coplanarity inspection for selected packages
Snap-in detection with the appropriate placement head
Closed-loop pickup-position correction
These functions depend on installed hardware, cameras, scanners, sensors and software licenses. They should be demonstrated on the actual used machine rather than assumed from the model designation.
The X2 S is suitable for production lines that require the capabilities of the X S platform but do not need three or four placement gantries.
Telecommunications and 5G equipment
Server and data-center hardware
Network and computer products
Automotive electronic modules
Industrial control equipment
Consumer electronic products
Medical electronic assemblies
LED and display-control boards
High-mix EMS production
Large IC and connector placement
Existing X S line expansion
Replacement of an installed X2 S machine
A two-SpeedStar configuration is suitable for boards dominated by small tape-fed components. A SpeedStar and MultiStar combination provides a broader component range, while an X2 S with TwinStar can operate as a flexible end-of-line machine.
| Comparison | SIPLACE X2 S | Original SIPLACE X2 |
|---|---|---|
| Platform generation | Later SIPLACE X-Series S platform | Original modular SIPLACE X Series |
| Number of gantries | 2 | 2 |
| Head terminology | SpeedStar, MultiStar and TwinStar; later CP20P, CPP and TH terminology | C&P20, C&P12, C&P6 and TwinHead |
| Later benchmark performance | Up to approximately 75,000 CPH | Up to approximately 49,000 CPH with two C&P20 heads |
| Original theoretical performance | Earlier X2 S rating up to approximately 85,250 CPH | Up to approximately 62,000 CPH |
| Feeder capacity | Up to 160 × 8 mm X feeder positions | Configuration-dependent X or legacy feeder-table system |
| Identification requirement | Nameplate should confirm X2 S | Nameplate should confirm X2 without the S designation |
The original SIPLACE X2 and SIPLACE X2 S are not the same machine generation. Specifications from the two platforms should not be mixed on one product page.
| Comparison | SIPLACE X2 S | SIPLACE X3 S | SIPLACE X4 S |
|---|---|---|---|
| Number of gantries | 2 | 3 | 4 |
| Later benchmark speed | Up to 75,000 CPH | Up to 112,500 CPH | Up to 150,000 CPH |
| Later IPC speed | Up to 65,000 CPH | Up to 97,050 CPH | Up to 130,000 CPH |
| Maximum 8 mm feeder positions | Up to 160 | Up to 160 | Up to 160 |
| Head positions | 2 configurable heads | 3 configurable heads | 4 configurable heads |
| Typical production positioning | Flexible capacity or end-of-line placement | Balanced output and flexibility | Maximum standard X S platform output |
The X2 S is often selected when two gantries provide sufficient output, when the machine is intended for flexible component placement or when the factory needs to replace an existing X2 S without changing the complete line layout.
The SIPLACE X2 S can operate as a standalone placement machine or as part of a multi-machine X S production line.
A typical line may include:
PCB loader
Solder paste printer
Solder paste inspection system
SIPLACE X4 S or X3 S high-speed placement machine
SIPLACE X2 S flexible placement machine
Reflow oven
Automatic optical inspection system
PCB unloader
In this arrangement, the higher-gantry machine places most small components, while the X2 S completes larger ICs, tray-fed devices, connectors and selected odd-shaped components.
The X2 S can also be equipped with two high-speed heads and used to add small-component capacity to an existing line.
A used X2 S should be evaluated according to its complete hardware and intended production role. A successful power-on test alone does not confirm that the machine can maintain placement speed, accuracy and process stability.
Complete machine model
X2 S designation confirmation
Machine serial number
Manufacturing year
Total operating hours
Total placement counter
Original factory configuration
Current installed configuration
Station-software version
Programming-software compatibility
Head installed on gantry one
Head installed on gantry two
Head model and part number
Head serial number
Individual operating hours
Individual placement counters
Component-camera type
Nozzle-changer configuration
Head maintenance and repair history
Movement of both gantries
X-axis and Y-axis noise
Vibration during acceleration
Machine homing and reference operation
Linear-drive condition
Encoder and position-feedback condition
Axis-drive alarm history
Cable-chain and trailing-cable condition
Gantry calibration and alignment
Nozzle-segment and sleeve wear
Z-axis movement
Rotational-axis movement
Vacuum pressure and leakage
Component-sensor operation
Force-sensor operation
Nozzle-changer operation
Pickup and placement repeatability
Special gripper operation where installed
Snap-in detection where required
Component camera on both gantries
High-resolution camera availability
PCB-camera image quality
Lighting-level operation
Component-shape recognition
Fiducial recognition
Pickup-position correction
PCB warpage measurement
Coplanarity option where required
Camera calibration status
Single or flexible dual conveyor
Synchronous and asynchronous operation
Automatic width adjustment
Conveyor belts and pulleys
PCB entrance and exit sensors
Board clamping and PCB support
Long-board or wide-board extensions
Dual conveyor used as a wider single lane
Communication with surrounding SMT equipment
Number of included component carts
Number and type of included feeders
Feeder tape-width combinations
Feeder firmware and machine compatibility
Feeder indexing and pickup performance
Contactless power and data interface
Cart docking and locking condition
Communication-unit operation
Reel holders and waste-tape containers
Setup-verification functions
Matrix Tray Changer availability
Waffle Pack Changer availability
Tray elevator and transfer operation
Pickup-position calibration
Stick or vibratory feeder availability
Application-specific component modules
Special nozzles and grippers
Station computers and monitors
Machine-software backups
Product and configuration files
Nozzles and nozzle magazines
Component carts and feeders
Tray systems
Transformer or voltage-conversion equipment
Operating and maintenance manuals
Calibration tools
Included spare parts
A complete inspection video should show machine startup, homing, both gantries, every installed placement head, feeder pickup, component recognition, nozzle changing, PCB transport and an actual sample placement program.
The X2 S operates with high acceleration and frequent placement cycles. Preventive maintenance is necessary to maintain its production performance and placement quality.
SpeedStar or CP20P placement-head segments
MultiStar or CPP head assemblies
TwinStar or TH Z-axis and rotational assemblies
Nozzle sleeves and nozzle holders
Nozzles and automatic nozzle changers
Vacuum valves, filters and generators
Force sensors and component sensors
Component cameras and lighting modules
PCB camera and fiducial lighting
Linear motors and encoders
Axis drives and control boards
Trailing cables and cable chains
Cooling fans and machine filters
Conveyor belts, pulleys and sensors
PCB support and warpage systems
Component-cart docking interfaces
SIPLACE X feeder modules
Station computers and storage devices
Recommended maintenance includes placement-head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, axis inspection, conveyor adjustment, filter replacement and verification of machine-software backups.
A used X2 S may be suitable for manufacturers that already operate compatible SIPLACE X S equipment and need additional placement capacity, a flexible end-of-line machine or a direct replacement.
The machine may be practical when:
Two placement gantries provide sufficient line capacity
The PCB contains both small components and larger IC packages
The factory already owns compatible SIPLACE X feeders
The existing line uses X2 S, X3 S or X4 S equipment
Existing technicians understand X-Series S operation
Replacement heads and spare parts are available
A failed X2 S must be replaced without redesigning the line
A lower used-equipment investment is preferred
A newer platform may be more appropriate when the project requires the latest factory-software integration, current manufacturer lifecycle support, newer feeder technology or capabilities not available on the inspected machine.
Provide the following information so the available machine can be matched accurately:
Required machine quantity
Preferred manufacturing year
Preferred machine condition
Required placement-head combination
Target production output
Minimum component package
Maximum component dimensions
Maximum component height and weight
Required placement accuracy
PCB dimensions and thickness
Single- or dual-conveyor requirement
Long-board or wide-board requirement
Required feeder quantities and tape widths
Existing SIPLACE X feeder inventory
Tray or special component-supply requirement
Existing SIPLACE production-line configuration
Factory voltage and frequency
Compressed-air availability
Destination country
Required delivery schedule
Customers who need a cycle-time assessment may send the PCB BOM, placement file, component list, panel dimensions and target output for preliminary machine matching.
The SIPLACE X2 S is a two-gantry SMT placement machine used for high-speed chip placement, mixed-component production and flexible placement of ICs, connectors and selected odd-shaped parts.
The X2 S has two independently controlled placement gantries. Each gantry carries one placement head.
Later ASM documentation lists up to approximately 75,000 CPH SIPLACE benchmark performance and 65,000 CPH IPC performance. Earlier documentation lists 85,250 CPH theoretical, 65,500 CPH benchmark and 52,000 CPH IPC performance.
The standard X2 S specifications reviewed for this platform do not list 102,300 CPH. Machine performance should be quoted according to the verified generation, installed heads and official equipment documentation.
Depending on machine generation, the X2 S can use SpeedStar or CP20P, MultiStar or CPP, and TwinStar or TH placement heads.
The overall platform component spectrum can extend from approximately 0201 metric to selected components around 200 × 125 × 25 mm. The actual range depends on the two installed placement heads.
The machine supports up to approximately 160 positions for standard 8 mm SIPLACE X feeders. Wider tape feeders occupy multiple positions and reduce the total feeder quantity.
Yes. Depending on configuration, the machine can work with Matrix Tray Changers, Waffle Pack Changers, manual trays and other special component-supply systems.
Yes. Machines may have a flexible dual conveyor that supports synchronous, asynchronous or wider single-lane operation. The installed conveyor must be confirmed on the actual machine.
PCB capacity depends on the conveyor and installed extensions. Earlier standard specifications list approximately 450 × 560 mm, while later fully configured platform specifications extend to approximately 850 × 685 mm.
The original X2 belongs to the earlier SIPLACE X Series and uses different placement-head and performance specifications. The X2 S belongs to the later X-Series S platform.
The main difference is the number of gantries. The X2 S has two, the X3 S has three and the X4 S has four. More gantries generally provide higher placement capacity.
Not automatically. Feeders, component carts, tray systems, nozzles and spare parts may be included or quoted separately. Every included item should be listed clearly in the quotation.
Test both gantries, every installed placement head, component cameras, PCB camera, vacuum and force sensors, nozzle changers, conveyor, feeders, component carts, station computers and required software functions. A sample placement test is strongly recommended.
Send your required placement-head combination, PCB dimensions, component range, target output, feeder requirement, conveyor type and destination country. GEEKVALUE will check available ASM SIPLACE X2 S machines and confirm the model, serial number, manufacturing year, installed heads, conveyor, software, included accessories, inspection scope and delivery arrangement.
View the complete ASM SIPLACE X S / XS Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
