The ASM SIPLACE CA Series was created for production lines where a conventional SMT placement machine alone is no longer enough. Modern SiP modules and advanced electronic products often combine standard SMD components with unpackaged semiconductor dies taken directly from a wafer. Producing these assemblies traditionally requires separate SMT placement and die-bonding equipment. SIPLACE CA machines bring these processes together by handling feeder-supplied components, die attach and flip-chip placement within an integrated production platform, helping manufacturers simplify complex assembly flows while maintaining the precision and traceability required for advanced packaging.
Compare the two CA Series models by process requirements, material supply, installed modules and production goals. Final equipment selection should be based on the exact machine configuration and the application to be assembled.
SIPLACE CA2 combines conventional SMD placement with direct die processing from sawn wafers. Depending on the configuration, it can support die attach, flip-chip placement, inspection, dipping, traceability and mixed-component assembly.
SIPLACE CA4 equipment should be evaluated by the installed placement system, wafer-handling modules, conveyor, software, inspection functions and process options. Available units may differ significantly in production capability and included accessories.
Explore available CA2 and CA4 equipment with machine condition, manufacturing year, installed heads, wafer system, conveyor arrangement, software, inspection options and included accessories.
ASM SIPLACE CA4 is a specialized CA-series placement machine for production environments that require more than conventi...
ASM SIPLACE CA View Details
ASM SIPLACE CA2 combines SMT placement, die attach and flip-chip processing with direct wafer handling for advanced pack...
ASM SIPLACE CA View DetailsThe CA Series is designed for production environments that may combine standard SMDs, bare dies, wafer-supplied material, substrates, panels and high-accuracy assembly requirements within one manufacturing flow.
Machine configuration may include wafer handling, die pickup, buffering, inspection, dipping and traceability functions for die-attach or flip-chip applications.
Depending on the machine setup, standard components can be supplied through compatible feeders, trays and configured material-handling systems.
CA2 and CA4 equipment should be compared by process capability, installed modules, material-handling method, accuracy requirements and the production configuration of the available machine.
| Comparison Item | SIPLACE CA2 | SIPLACE CA4 |
|---|---|---|
| Production focus | Hybrid SMT placement, die attach and flip-chip assembly | Specialized CA Series placement according to the installed machine configuration |
| SMT placement | Supported with configured SMT feeders and material supply | Confirm the installed heads, feeder interfaces and supported component range |
| Die attach / flip chip | Direct-wafer die attach and flip-chip capability | Confirm the installed wafer system, process heads, software and options |
| Nominal performance | Up to 76,000 CPH SMT, 54,000 CPH die attach and 51,000 CPH flip chip | Depends on the machine version, installed modules and selected process |
| Accuracy | Available CA2 classes include 20 µm, 15 µm and up to 10 µm @ 3σ | Confirm the accuracy class and supported work area of the available machine |
| Material handling | Wafer system, feeders, trays and configured conveyor options | Confirm wafer capacity, feeder interfaces, tray handling and conveyor setup |
| Selection basis | Process mix, output target, wafer type, die size and substrate requirements | Nameplate, installed heads, wafer modules, software, condition and accessories |
Nominal CA2 performance varies with die size, component mix, substrate design, inspection steps, dipping process, feeder setup, conveyor mode and line balance.
Nominal placement speed for configured SMT production.
Nominal die-attach speed for direct-wafer processing.
Nominal flip-chip placement speed for direct-wafer processing.
Available CA2 accuracy option at 3 sigma for the applicable work area.
Available SIPLACE CA4 machines may use different placement heads, wafer-handling modules, conveyors, software versions, inspection functions and process options. The exact configuration determines the supported component range, wafer format, substrate size, accuracy and production capability.
Before quotation, confirm the machine nameplate, manufacturing year, installed modules, placement system, wafer equipment, conveyor arrangement, software and included accessories. This helps match the machine to the intended die attach, flip-chip or mixed-placement process.
Send your wafer format, die dimensions, substrate size, target accuracy, production output and preferred machine condition for configuration matching.
Request Configuration ReviewApplication suitability depends on the selected model and installed configuration. Match the equipment to the material source, substrate, accuracy, inspection and production-flow requirements.
Mixed assemblies that combine bare dies, passive components and packaged ICs in compact modules.
High-accuracy processes involving direct die handling, inspection and traceability requirements.
Large substrates or panels that require careful conveyor, work-area and warpage evaluation.
Placement of dies and components into embedded PCB or advanced substrate structures.
Applications requiring controlled die handling, material inspection and process-specific accuracy.
Production flows that benefit from combining conventional component supply with bare-die processing.
Process-control functions must be checked on the specific machine. For CA2, available functions include component inspection, die-level traceability and common SMT or semiconductor communication interfaces; CA4 functions depend on the installed system and selected options.
Check die-crack, chipping, component sensing, flux inspection and on-board inspection options.
Review wafer-map data, die identity, pickup position, placement position and production-record integration.
Confirm the software version and required line interfaces before integrating the machine into an existing factory.
Specialized placement equipment should be selected by process and installed configuration, not by model name alone.
Confirm die, component, wafer, substrate, accuracy, inspection and target-output requirements.
Compare CA2 and CA4, then identify the required machine generation and installed options.
Review labels, photographs, heads, wafer system, conveyor, software, condition and test details.
Confirm included accessories, export packing, destination, shipment terms and installation planning.
Match replacement parts by the original part number, module label, machine serial information, installed position and clear photographs. Model name alone may not be enough for correct matching.
Common questions about CA Series models, hybrid placement, direct-wafer processing, machine selection, equipment supply and parts support.
Availability may include SIPLACE CA2 and CA4 machines. Each unit should be checked by manufacturing year, condition, installed heads, wafer system, conveyor, software and included accessories.
CA2 is a hybrid platform for SMT placement, die attach and flip-chip applications. CA4 capability depends on the machine generation and installed placement, wafer-handling, conveyor and software configuration.
Yes. SIPLACE CA2 can combine conventional SMT component supply with die attach and flip-chip placement directly from sawn wafers.
Nominal rates are up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach and 51,000 components per hour for flip-chip placement. Actual output depends on the application and machine setup.
Check the nameplate, serial number, manufacturing year, installed heads, wafer modules, conveyor, software, inspection functions and available machine records.
Applications may include System-in-Package, wafer-level packaging, panel-level packaging, embedded electronics, power semiconductor assembly and mixed SMT plus bare-die production.
Check the model, serial number, year, condition, installed heads, wafer system, conveyor, software, accuracy option, inspection functions, accessories, test information and destination requirements.
Feeders, heads, nozzles, boards, motors, sensors, cables and other parts can be matched using the machine model, original part number, module label and installed-position photographs.
Yes. Provide the wafer format, die and component sizes, substrate dimensions, placement process, accuracy target, output requirement and existing line conditions for configuration review.
Provide the required model, intended process, die and component sizes, wafer type, substrate dimensions, accuracy target, production output, preferred condition, inspection requirements and destination country.
Send the required model, wafer and die information, substrate size, placement process, accuracy target, production requirement, preferred machine condition and destination country.
