Used ASM SIPLACE X4i S mounter with four gantries, up to 172,000 CPH, 148 feeder slots and verified head configuration.
The ASM SIPLACE X4i S placement machine is a four-gantry, ultra-high-output SMT mounter developed for demanding volume-production lines. Depending on its machine generation, installed placement heads and software configuration, the platform can combine very high small-component output with flexible placement of ICs, large packages and selected odd-shaped components.
The model is commonly shortened to “SIPLACE X4i” in equipment records and used-machine listings. However, the complete model is generally identified as SIPLACE X4i S. Machine identification should always be based on the original nameplate, serial number, manufacturing year, installed heads and station-software information.
GEEKVALUE supplies available used, inspected and refurbished SIPLACE X4i S machines according to the required placement-head configuration, conveyor arrangement, feeder package, machine condition and production application. Explore the complete ASM SIPLACE X S / XS Series to compare X4i S, X4S, X3S and X2S platform configurations.
The SIPLACE X4i S is positioned as the highest-output four-gantry configuration within the SIPLACE X-Series S platform. It was designed for production environments where placement speed, component accuracy, feeder capacity and continuous material supply must work together.
Four independent placement gantries divide the component program across the machine. A high-speed configuration normally uses four 20-segment Collect & Place heads, while other head combinations may be used where the production line requires greater component flexibility.
Four independently operating placement gantries
Ultra-high-output SMT placement platform
Later published SIPLACE benchmark performance up to 172,000 CPH
Later published IPC performance up to 146,000 CPH
Historical published theoretical performance up to 200,000 CPH
Up to 148 positions for 8 mm SIPLACE X feeders
High-speed, flexible and odd-shaped component head options
Single-conveyor and flexible dual-conveyor configurations
High-volume 0201 metric component capability
Large-PCB handling dependent on conveyor and extension options
Digital vision, vacuum sensing and placement-force monitoring
| Specification | Typical SIPLACE X4i S Configuration |
|---|---|
| Machine type | Four-gantry high-speed SMT placement machine |
| Complete model designation | ASM SIPLACE X4i S |
| Common shortened description | SIPLACE X4i or ASM X4i placement machine |
| Number of gantries | 4 |
| Later placement-head options | CP20, CPP and TWIN, depending on machine generation and configuration |
| Earlier placement-head descriptions | SpeedStar, MultiStar and TwinStar or TwinHead, depending on documentation generation |
| Later SIPLACE benchmark rating | Up to approximately 172,000 CPH |
| Later IPC rating | Up to approximately 146,000 CPH |
| Historical published benchmark rating | Up to approximately 150,000 CPH |
| Historical theoretical rating | Up to approximately 200,000 CPH |
| Overall component spectrum | Approximately 0201 metric to 200 × 110/125 mm, depending on installed heads and machine generation |
| Maximum published component height | Up to approximately 25 mm in common X4i S platform specifications |
| Best published placement accuracy | Up to approximately 22 μm at 3 sigma with the relevant precision-head configuration |
| Feeder capacity | Up to 148 positions for 8 mm SIPLACE X feeders |
| Conveyor options | Single conveyor or flexible dual conveyor |
| Transport modes | Single-lane, synchronous dual-lane, asynchronous dual-lane and configuration-dependent i-Placement operation |
| Standard minimum PCB size | Approximately 50 × 50 mm |
| Historical maximum PCB format | Approximately 610 × 560 mm, depending on conveyor configuration |
| Later extended PCB capability | Up to approximately 850 × 685 mm with the applicable conveyor and extension options |
| PCB thickness | Approximately 0.3–4.5 mm; other thicknesses require configuration review |
| PCB weight | Configuration-dependent; commonly up to approximately 3 kg on earlier platform specifications |
| Machine dimensions | Approximately 1.9 × 2.6 × 1.6 m for later specifications; earlier documentation may describe a shorter basic-machine body |
| Typical production role | Ultra-high-volume SMT placement for telecommunications, servers, computing, consumer and industrial electronics |
Configuration notice: SIPLACE X4i S specifications changed across machine generations, head versions and software releases. Published historical and later ratings should not be combined as though they describe the same acceptance test. Final machine matching must be based on the actual nameplate, installed heads, conveyor, feeder system, software version and powered-on test results.
The names SIPLACE X4, SIPLACE X4 S and SIPLACE X4i S describe different platform generations or configurations. They should not be treated as interchangeable product names.
SIPLACE X4: Original four-gantry X Series platform with C&P20, C&P12, C&P6 and TwinHead configuration possibilities.
SIPLACE X4 S: Later X-Series S four-gantry model for high-speed and flexible production.
SIPLACE X4i S: Highest-output X-Series S configuration with specialized transport and performance features.
Some used-equipment listings omit the letter “S” and describe the machine only as an X4i. This shorthand should not be used to confirm the exact equipment generation.
Before quotation, request:
Complete machine-nameplate photograph
Machine serial number
Manufacturing year
Original model designation
Station-software version
Installed placement-head labels
Conveyor configuration photographs
Feeder-table and docking-unit photographs
Different X4i S brochures show different placement-speed figures. This does not necessarily mean one specification is incorrect. The figures may describe different machine generations, placement-head versions and performance-test methods.
| Performance Description | Published Value | How It Should Be Interpreted |
|---|---|---|
| Later ASMPT benchmark rating | Up to 172,000 CPH | Later published SIPLACE benchmark performance using the corresponding machine and placement-head generation. |
| Later IPC rating | Up to 146,000 CPH | Performance evaluated according to the applicable IPC test method. |
| Historical benchmark rating | Up to 150,000 CPH | Earlier published machine benchmark for the corresponding X4i S generation. |
| Historical theoretical value | Up to 200,000 CPH | Calculated maximum under highly favorable component, feeder, travel and machine conditions. |
| Actual production performance | Application-dependent | Determined by the real PCB, component mix, feeder layout, conveyor cycle and equipment condition. |
The 200,000 CPH figure should not be described as the guaranteed production output of every X4i S. It is a historical theoretical value. A realistic capacity estimate should be calculated from the customer’s actual PCB program.
Total component placements per PCB
Distribution of components between the four gantries
Installed placement-head types
Feeder locations and tape widths
PCB dimensions and panel layout
Component pickup and vision-inspection time
Required component rotations
Nozzle-change frequency
Conveyor loading and unloading cycle
Dual-lane production balance
Pickup retries and component rejection rate
Machine calibration and maintenance condition
Programming and line optimization
The X4i S uses four placement gantries to divide the PCB placement program into several simultaneously optimized production tasks. Each gantry collects components from its assigned material area and completes a calculated group of placements.
The production software attempts to balance the workload so that all four gantries finish their assigned work at approximately the same time. When one gantry has significantly more placements or longer travel distances, the other gantries may wait and total machine output will decrease.
Effective line optimization therefore involves more than selecting the fastest machine. It also requires:
Balancing component quantities between gantries
Locating high-volume feeders near suitable pickup areas
Reducing unnecessary head travel
Minimizing nozzle changes
Separating components according to head capability
Balancing top-side and bottom-side production where applicable
Matching the X4i S output to the printer, reflow oven and inspection equipment
The installed placement heads determine the component range, output, placement force and production role of an individual X4i S. The model name alone does not confirm which heads are installed.
Earlier equipment records may use the names SpeedStar, MultiStar and TwinStar. Later ASMPT documentation commonly uses CP20, CPP and TWIN. The physical head labels and part numbers must be reviewed before replacement heads, nozzles or repair parts are selected.
The high-speed 20-segment Collect & Place head is designed for rapid placement of small standard components. It collects multiple components before moving to the PCB, allowing a large number of placements to be completed with reduced travel.
Historical SpeedStar documentation commonly lists a component range from 0201 metric to approximately 6 × 6 mm. Later CP20 specifications may support components up to approximately 8.2 × 8.2 mm, depending on machine and head generation.
Typical applications include:
Small chip resistors
Multilayer ceramic capacitors
Small diodes
Small transistors
Resistor and capacitor arrays
Small standard IC packages
High-density communication-board components
High-volume server and computing-board components
The presence of four high-speed 20-segment heads normally provides the highest machine output. However, this configuration is not intended to place every large, heavy or odd-shaped component.
The flexible placement head is designed to cover a broader component spectrum. Depending on generation, it can switch between Collect & Place, Pick & Place and mixed operating modes through the production software.
This allows the head to process small standard components efficiently while also handling larger IC packages that require individual pickup or more controlled placement.
Later CPP specifications include:
Collect & Place operating mode
Pick & Place operating mode
Mixed placement mode
Component range extending to approximately 50 × 40 mm
Component height up to approximately 15.5 mm on relevant configurations
Programmable placement force
A CPP or MultiStar configuration can help balance a line where the PCB contains both high-volume standard components and medium-sized IC packages.
The TWIN family is intended for large, heavy, delicate and odd-shaped components. Components may be picked using a vacuum nozzle or a specialized mechanical gripper.
Typical applications include:
Large connectors
Fine-pitch integrated circuits
Large BGA and QFP packages
Coils and inductive components
Sockets and switches
Large tray-fed devices
Mechanical electronic components
Selected components requiring controlled insertion or snap-in detection
Common X4i S platform specifications describe components up to approximately 200 × 110 or 200 × 125 mm with heights up to approximately 25 mm. Exact capability depends on the head generation, camera, nozzle or gripper, component weight, software and available component-supply system.
The original product description stated that the X4i supports components only from 0201 metric to 6 × 6 mm. That range applies primarily to the high-speed SpeedStar head.
The complete machine may process a much wider spectrum when it is equipped with flexible or TWIN placement heads. Therefore, component capability should be described in two levels:
High-speed head range: Small standard components used for maximum placement output.
Complete machine range: Small chips, medium ICs, large packages and selected odd-shaped components, depending on installed heads.
Before confirming compatibility with a particular component, review:
Component length and width
Component height
Component weight
Pickup surface
Center of gravity
Required placement force
Package lead or ball structure
Required nozzle or gripper
Feeder or tray presentation
Camera field of view and recognition method
The SIPLACE X4i S provides up to 148 positions for standard 8 mm X feeders. This capacity supports complex boards containing many component part numbers while helping reduce setup changes.
Wider tape feeders occupy multiple feeder positions. The actual number of installed feeder units therefore depends on the required combination of 8 mm, 12 mm, 16 mm, 24 mm, 32 mm and wider tapes.
Intelligent feeder identification
Automatic transfer of feeder and component data
Contactless power and data transmission on suitable feeder generations
Closed-loop tape-position control
Setup verification through feeder identification
Component tape splicing without stopping the complete machine
Status indication for easier operator control
Offline feeder-table preparation
Number of component changeover tables supplied
Number of included 8 mm feeders
Quantity of wider tape feeders
X or Xi feeder generation
Feeder firmware and machine-software compatibility
Feeder-table communication-unit condition
Docking and locking condition
Reel holders and tape-waste containers
Feeder calibration status
Spare feeder requirement
Feeders and changeover tables should not be assumed to be included with every used X4i S. The quotation should list the machine, heads, tables, feeders, nozzles and accessories separately.
The X4i S may be equipped with a single PCB conveyor or a flexible dual conveyor. The correct configuration depends on PCB width, production volume and the surrounding SMT line.
Single-conveyor operation is suitable for wider PCBs and production lines that process one board stream. The maximum PCB dimensions depend on the conveyor generation and whether input, output, long-board or wide-board extensions are installed.
In synchronous mode, two related PCBs or the top and bottom sides of one product can be transported and processed together. The exact production method depends on the program and installed conveyor configuration.
In asynchronous mode, one PCB can be processed while another board enters or waits in the second lane. This can reduce non-productive conveyor time and improve machine utilization.
X4i S configurations may include an i-Placement transport mode designed to improve machine and line performance. The availability and exact function depend on the conveyor, software generation and installed production options.
Because used-machine listings often mention i-Placement without showing the complete configuration, request a powered-on demonstration of the relevant conveyor and software functions.
Historical X4i S specifications commonly describe PCB formats from approximately 50 × 50 mm to 610 × 560 mm. Later ASMPT X S specifications show extended board capabilities up to approximately 850 × 685 mm with the required conveyor and extension options.
These maximum dimensions should not be assigned automatically to every used machine. The actual conveyor must be measured and tested.
Minimum PCB length and width
Maximum PCB or panel dimensions
PCB thickness
Maximum assembled-board weight
Single-lane or dual-lane production
Required transport direction
Fixed conveyor-rail position
Required line height
Board-edge clearance
Panel support requirements
Long-board or wide-board option requirement
Upstream and downstream interface requirements
Large or flexible boards may also require suitable PCB support and warpage compensation. Machine capability should be evaluated together with the printer, inspection equipment, reflow oven and board-handling systems.
The SIPLACE X platform uses digital vision, sensors and software-controlled processes to monitor component pickup and placement.
Depending on the installed configuration, process-control functions may include:
Component-presence detection
Vacuum monitoring during pickup and placement
Placement-force monitoring
Component-position and rotation correction
PCB fiducial recognition
Bad-board and bad-panel recognition
PCB warpage measurement and compensation
Feeder setup verification
Barcode-controlled production
Component traceability
Coplanarity inspection for suitable packages
Closed-loop pickup correction
These functions must be verified on the individual machine. The presence of an X4i S model label does not prove that every optional camera, scanner, laser module or software license is installed.
The X platform was developed for reliable placement of very small components. However, stable 01005 or 0201 metric production requires more than the correct machine model.
A complete small-component process may require:
Compatible high-speed placement heads
High-resolution component cameras
Correct small-component nozzles
Low-force placement sleeves
Compatible X or Xi feeder modules
Calibrated feeder pickup positions
Suitable component tape and pocket quality
Correct machine and programming software
Stable PCB support
Controlled solder-paste printing
Suitable factory temperature and humidity
When a used machine is purchased specifically for very small components, request a sample pickup and placement test using a representative component size.
The SIPLACE X4i S is most suitable for production where large component counts, high line output and consistent process control are critical.
Telecommunications and 5G equipment
Server and data-center hardware
Computer and network products
Consumer electronic devices
Automotive electronic modules
High-volume EMS manufacturing
Industrial control electronics
LED and display-control boards
Mobile-device and compact electronics production
Large and component-dense PCBs
The correct head configuration should be selected according to the real component mix. Four high-speed heads may be suitable for boards dominated by small components, while a combination including CPP or TWIN heads may be more appropriate for mixed-component production.
| Comparison | SIPLACE X4i S | SIPLACE X4 S | Original SIPLACE X4 |
|---|---|---|---|
| Platform generation | X-Series S high-output configuration | X-Series S four-gantry configuration | Original X Series platform |
| Gantry quantity | 4 | 4 | 4 |
| Primary positioning | Maximum X S platform output | High-volume and flexible production | Established modular high-volume production |
| Published output | Generation-dependent; later benchmark up to 172,000 CPH | Common later benchmark up to approximately 150,000 CPH | Head-configuration dependent; substantially different from X4i S ratings |
| Feeder capacity | Up to 148 × 8 mm positions | Commonly up to 160 × 8 mm positions | Configuration-dependent, including X or legacy feeder-table options |
| Head terminology | CP20, CPP and TWIN or generation-equivalent descriptions | CP20, CPP and TWIN | C&P20, C&P12, C&P6 and TwinHead |
| Critical verification | Model label, performance generation, heads, conveyor and software | Installed heads, conveyor, feeders and options | Head combination, legacy feeder interface, conveyor and software |
An original SIPLACE X4 should not be advertised using X4i S performance values. The complete machine generation must be confirmed before publishing specifications or preparing a quotation.
A used X4i S should be evaluated as a complete high-speed production system. External appearance and manufacturing year alone are not sufficient to determine equipment condition.
Complete nameplate model
X4i S designation confirmation
Machine serial number
Manufacturing year
Total operating hours
Total placement counter
Original machine configuration
Current installed configuration
Station-software version
Programming-software compatibility
Movement of all four gantries
X-axis and Y-axis noise
Vibration during acceleration
Machine homing and reference operation
Linear-drive condition
Encoder and position-feedback condition
Axis-drive alarm history
Cable-chain and trailing-cable condition
Cooling and air-filter condition
Gantry calibration and alignment
Exact head model installed on each gantry
Head identification labels and part numbers
Head operating and placement counters
Segment or nozzle-sleeve wear
Z-axis operation
Rotational-axis operation
Vacuum pressure and leakage
Force-sensor operation
Component-sensor operation
Nozzle-changer operation
Pickup and placement repeatability
Component camera on every gantry
High-resolution camera availability
PCB camera image quality
Lighting-level operation
Component recognition
Fiducial recognition
Pickup-position correction
Bad-board recognition
Coplanarity options where required
Camera calibration status
Single or flexible dual conveyor
Synchronous and asynchronous operation
i-Placement function where required
Automatic width adjustment
Conveyor belts and pulleys
PCB entrance and exit sensors
Board clamping and support
Long-board or wide-board extensions
PCB warpage-measurement function
Communication with surrounding equipment
Number of component changeover tables
Included feeder quantities
Feeder tape widths
X or Xi feeder generation
Feeder indexing and pickup performance
Contactless interface condition
Table docking and locking
Communication-unit operation
Reel holders and waste containers
Setup-verification functions
Required high-resolution cameras
Small-component nozzles
Compatible sleeves and nozzle changers
Compatible 8 mm feeders
Required software package
Feeder and head calibration
Sample 01005 or 0201 metric pickup test
Sample placement and inspection result
Station computers and monitors
Machine-software backup
Programming files and configuration records
Nozzles and nozzle magazines
Feeder tables and feeders
Transformers or voltage-conversion equipment
Operating and maintenance manuals
Calibration tools
Export packing materials
Included spare parts
A complete inspection video should show machine startup, homing, movement of all four gantries, operation of every placement head, feeder pickup, component recognition, nozzle changing, PCB transport and an actual sample placement program.
The X4i S operates at very high mechanical speed. Preventive maintenance is therefore essential for maintaining placement performance and process stability.
CP20 or SpeedStar placement-head segments
CPP or MultiStar head assemblies
TWIN or TwinHead Z-axis and rotational components
Nozzle sleeves and nozzle holders
Nozzles and nozzle changers
Vacuum valves, filters and generators
Force and component sensors
Component cameras and lighting modules
PCB camera and fiducial lighting
Linear motors and encoders
Axis drives and control boards
Trailing cables and cable chains
Cooling fans and machine filters
Conveyor belts, pulleys and sensors
PCB support and warpage systems
Feeder-table docking interfaces
X and Xi feeder modules
Station computers and storage devices
Maintenance should include head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, axis inspection, conveyor adjustment, filter replacement and verification of current software backups.
A used X4i S may be a practical solution for manufacturers that already operate compatible SIPLACE X S equipment and require additional high-volume placement capacity.
The machine may be suitable when:
The PCB contains a very high number of small components
The factory already owns compatible X or Xi feeders
The existing line uses SIPLACE X-Series S equipment
Existing technicians understand X S operation and maintenance
Replacement heads and spare parts are available
A failed X4i S must be replaced without redesigning the line
The factory needs additional peak-volume capacity
A used-machine investment is preferred over a new platform
A newer platform may be more appropriate when the project requires the latest factory-software integration, current manufacturer lifecycle support, new feeder technology, lower energy consumption or a production process that cannot be supported by the available used-machine configuration.
Provide the following information so that the available machine can be matched accurately:
Required X4i S machine quantity
Preferred manufacturing year
Preferred machine condition
Required production output
Minimum component package
Maximum component dimensions
Maximum component height and weight
Required placement accuracy
Required placement-head configuration
PCB dimensions and thickness
Single- or dual-conveyor requirement
Need for i-Placement operation
Required feeder quantities and tape widths
Existing X or Xi feeder inventory
Existing SIPLACE line configuration
Factory voltage and frequency
Compressed-air availability
Destination country
Required shipment schedule
Customers who need a production-capacity assessment may send the PCB BOM, placement file, component list, panel dimensions and target cycle time for preliminary machine matching.
X4i is commonly used as a shortened equipment description, but the complete model is generally SIPLACE X4i S. The original machine nameplate should be checked before the model is confirmed.
Later ASMPT specifications list up to approximately 172,000 CPH benchmark performance and 146,000 CPH IPC performance. Earlier documentation lists approximately 150,000 CPH benchmark and 200,000 CPH theoretical performance. Actual production output depends on the individual machine and PCB program.
The 200,000 CPH figure is a historical theoretical rating calculated under highly favorable conditions. It should not be treated as guaranteed output for a real production board.
The X4i S is a four-gantry placement machine. The installed placement head on each gantry must be checked individually.
Depending on machine generation, documentation may describe SpeedStar, MultiStar and TwinStar heads or CP20, CPP and TWIN heads. The actual labels and part numbers must be confirmed on the individual machine.
The high-speed head handles small standard components, while flexible and TWIN heads can support medium, large and selected odd-shaped parts. The complete platform range can extend from 0201 metric to approximately 200 × 110 or 200 × 125 mm, depending on configuration.
The X4i S supports up to approximately 148 positions for 8 mm X feeders. Wider tape feeders occupy multiple positions and reduce the total number of installed feeder units.
Yes. Machines may be equipped with a flexible dual conveyor supporting synchronous and asynchronous operation. Some configurations also include i-Placement transport functions.
PCB capacity depends on the conveyor generation and installed extensions. Historical specifications commonly show up to approximately 610 × 560 mm, while later configurations may support boards up to approximately 850 × 685 mm.
Suitable configurations can support very small components, but the required head, camera, nozzle, sleeve, feeder, software and calibration package must be present. A sample placement test is recommended.
Both are four-gantry X-Series S machines, but the X4i S is positioned as the highest-output configuration and has different published performance and feeder-capacity values. The exact generation and hardware must be verified.
Not automatically. Feeders, component tables, nozzles, computers and spare parts may be included or quoted separately. Every included item should appear clearly in the commercial quotation.
Test all four gantries, every installed placement head, component cameras, PCB camera, vacuum and force sensors, nozzle changers, conveyor, feeder tables, feeders, station computers and required software functions. A sample placement test is strongly recommended.
Send your required production output, head configuration, PCB dimensions, component range, feeder quantity, conveyor requirement and destination country. GEEKVALUE will check available ASM SIPLACE X4i S machines and confirm the model label, serial number, manufacturing year, installed heads, conveyor, software, included accessories, inspection scope and delivery arrangement.
View the complete ASM SIPLACE X S / XS Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
