Used SIPLACE X2 two-gantry SMT mounter with modular C&P and TwinHead options, X feeders and flexible PCB transport.
The ASM Siemens SIPLACE X2 SMT placement machine is a modular two-gantry pick-and-place platform developed for high-speed chip placement, flexible IC processing and selected large or odd-shaped components. Its production capability depends on the placement head installed on each gantry, allowing the same X2 platform to be configured for speed, flexibility or a combination of both.
A high-speed SIPLACE X2 equipped with two 20-nozzle Collect & Place heads provides published performance of up to 43,400 CPH under IPC conditions, 49,000 CPH under SIPLACE benchmark conditions and 62,000 CPH as a theoretical maximum. Machines equipped with 12-nozzle, 6-nozzle or TwinHead combinations have different placement rates and component capabilities.
GEEKVALUE supplies available used, inspected and refurbished SIPLACE X2 machines according to the installed heads, conveyor configuration, feeder interface, software generation and production requirement. Explore the complete ASM Siemens SIPLACE X Series to compare the original X2, SIPLACE X3 and X4 placement platforms.
The original SIPLACE X2 belongs to the modular X Series platform introduced before the later SIPLACE X-Series S generation. It uses two independently controlled placement gantries, with one placement head installed on each gantry.
The machine can be equipped with high-speed Collect & Place heads for standard surface-mount components or TwinHead modules for large, heavy, fine-pitch and odd-shaped components. This makes the X2 suitable both as a two-head chip mounter and as a flexible end-of-line placement machine.
Two independently controlled placement gantries
One placement head on each gantry
20-nozzle Collect & Place head option
12-nozzle Collect & Place head option
6-nozzle Collect & Place head option
High-precision SIPLACE TwinHead option
Maximum theoretical output up to approximately 62,000 CPH with two C&P20 heads
Overall platform component range from 01005 to selected components around 200 × 125 mm
Up to 160 positions for 8 mm SIPLACE X feeders
Optional support for legacy SIPLACE S feeders through compatible HF component tables
Single-conveyor and flexible dual-conveyor options
Tray, waffle-pack, stick, bulk and application-specific component supply
| Specification | Typical Original SIPLACE X2 Configuration |
|---|---|
| Machine type | Modular two-gantry SMT placement machine |
| Number of gantries | 2 |
| Placement heads | C&P20, C&P12, C&P6 and TwinHead, depending on configuration |
| Maximum IPC placement rate | Up to approximately 43,400 CPH with C&P20/C&P20 |
| Maximum SIPLACE benchmark rate | Up to approximately 49,000 CPH with C&P20/C&P20 |
| Maximum theoretical rate | Up to approximately 62,000 CPH with C&P20/C&P20 |
| Overall component range | Approximately 01005 to selected components around 200 × 125 mm |
| Maximum component height | Head-dependent: approximately 4 mm to 25 mm |
| Maximum component weight | Up to approximately 100 g with TwinHead and suitable tooling |
| Best published placement accuracy | Up to approximately ±22 μm at 3 sigma with the relevant TwinHead vision configuration |
| X feeder capacity | Up to approximately 160 positions for 8 mm X feeder modules |
| Legacy S feeder capacity | Up to approximately 180 tracks with compatible HF component tables |
| Standard single-conveyor PCB size | Approximately 50 × 50 mm to 450 × 535 mm |
| Maximum single-conveyor PCB size | Up to approximately 610 × 535 mm with long- and wide-board options |
| Maximum flexible dual-conveyor PCB size | Up to approximately 610 × 250 mm per lane with the applicable options |
| Dual conveyor in single-lane mode | Up to approximately 610 × 450 mm |
| PCB thickness | Approximately 0.3–4.5 mm; other thicknesses require confirmation |
| Maximum PCB weight | Approximately 3 kg |
| Component supply | Tape feeders, waffle-pack trays, Matrix Tray Changer, stick feeders, bulk feeders and OEM modules |
| Typical production role | High-speed placement, mixed-component production or flexible end-of-line placement |
Configuration notice: SIPLACE X2 machines were supplied with different head combinations, feeder-table interfaces, conveyors, camera modules and software versions. The values above describe the original X Series platform and should be verified against the actual machine nameplate and installed hardware before quotation.
The placement speed of an original X2 depends directly on the two installed heads. The model name alone does not determine the machine output.
| Head Configuration | IPC Speed | SIPLACE Benchmark | Theoretical Maximum |
|---|---|---|---|
| C&P20 + C&P20 | 43,400 CPH | 49,000 CPH | 62,000 CPH |
| C&P20 + C&P12 | 34,800 CPH | 38,500 CPH | 51,000 CPH |
| C&P20 + C&P6 | 30,400 CPH | 34,300 CPH | 42,500 CPH |
| C&P20 + TwinHead | 26,000 CPH | 29,500 CPH | 37,500 CPH |
| C&P12 + C&P12 | 26,200 CPH | 28,000 CPH | 40,500 CPH |
| C&P12 + C&P6 | 21,800 CPH | 23,800 CPH | 32,000 CPH |
| C&P12 + TwinHead | 17,400 CPH | 19,000 CPH | 26,500 CPH |
| C&P6 + C&P6 | 17,400 CPH | 19,600 CPH | 23,000 CPH |
| C&P6 + TwinHead | 13,000 CPH | 14,800 CPH | 18,000 CPH |
| TwinHead + TwinHead | 8,600 CPH | 10,000 CPH | 13,000 CPH |
The theoretical value represents performance under highly favorable operating conditions. It is not the guaranteed output of a real PCB program.
Placement head installed on each gantry
Number of placements on each PCB
Distribution of components between the two gantries
Feeder positions and tape widths
Component size, height and required rotation
PCB dimensions and panel layout
Nozzle changes
Tray access and component-supply method
Vision inspection and coplanarity checks
Conveyor loading and unloading time
Pickup retries and rejection rate
Head, nozzle and feeder condition
Programming and complete line balance
A realistic capacity estimate should be calculated from the PCB BOM, placement coordinates, feeder arrangement and target cycle time rather than from the theoretical 62,000 CPH value alone.
The SIPLACE X2 has two placement gantries, with each gantry carrying one head. The two heads can have the same configuration or perform different production roles.
For example, a machine with two C&P20 heads is optimized for maximum small-component output. A machine with one C&P20 and one TwinHead can place standard chips at higher speed while also handling large ICs, connectors and special components.
Common X2 configuration concepts include:
Two C&P20 heads for high-speed chip placement
C&P20 plus C&P12 for speed with broader package coverage
C&P20 plus C&P6 for mixed chip and IC production
C&P20 plus TwinHead for high-speed and odd-shaped components
C&P12 plus TwinHead for flexible mixed-component assembly
Two TwinHeads for high-precision and complex end-of-line placement
The production software distributes placements between the two gantries according to the head capability, feeder location, PCB coordinate, nozzle requirement and expected cycle time.
The C&P20 is the highest-speed head available on the original X Series. It uses twenty nozzle segments to collect multiple components before moving to the PCB.
Each component is inspected and corrected before placement. The Collect & Place principle reduces repeated travel between the feeder area and PCB, making it particularly suitable for large quantities of small standard components.
| Typical component range | 01005 to selected chip, MELF, SOT and SOD packages |
|---|---|
| Minimum component dimensions | Approximately 0.4 × 0.2 mm |
| Maximum component dimensions | Approximately 6 × 6 mm |
| Maximum component height | Approximately 4 mm |
| Maximum component weight | Approximately 1 g |
| Placement accuracy | Approximately ±41 μm at 3 sigma and ±55 μm at 4 sigma |
| Programmable placement force | Approximately 1.5–4.5 N |
A two-C&P20 configuration provides the highest X2 speed, but the machine will not have the same large-component capability as an X2 equipped with a TwinHead.
The C&P12 head offers a balance between placement output and component-range flexibility. It can process passive components, small ICs, PLCC, QFP, BGA and selected flip-chip or bare-die packages when equipped with the appropriate camera and software.
| Typical component range | Approximately 0201 to 18.7 × 18.7 mm |
|---|---|
| Maximum component height | Approximately 6 mm |
| Maximum component weight | Approximately 2 g |
| Placement accuracy | Approximately ±41–45 μm at 3 sigma, depending on camera type |
| Programmable placement force | Approximately 2.4–5.0 N |
The exact capability depends on whether the head uses the standard component camera or a higher-resolution camera package.
The C&P6 head is intended for larger components while retaining the multi-nozzle Collect & Place operating principle.
| Typical component range | Approximately 0201 to 27 × 27 mm |
|---|---|
| Maximum component height | Approximately 8.5 mm |
| Maximum component weight | Approximately 5 g |
| Placement accuracy | Approximately ±45 μm at 3 sigma and ±60 μm at 4 sigma |
| Programmable placement force | Approximately 2.4–5.0 N |
This head may be suitable for QFP, BGA, PLCC and medium-sized IC packages that are too large for the high-speed C&P20 head.
The TwinHead consists of two linked Pick & Place modules and is intended for large, heavy, fine-pitch or odd-shaped components. Components are picked and placed individually rather than collected in a rotating multi-nozzle sequence.
The head can work with vacuum nozzles, adapters and mechanical grippers. It can also be configured with fine-pitch or flip-chip cameras and optional coplanarity inspection systems.
| Standard component capability | Small ICs to approximately 85 × 85 mm with one nozzle |
|---|---|
| Extended component capability | Selected components up to approximately 200 × 125 mm with restrictions |
| Maximum component height | Approximately 25 mm; greater heights may require special confirmation |
| Maximum component weight | Approximately 100 g with suitable tooling |
| Fine-pitch accuracy | Approximately ±26 μm at 3 sigma |
| Flip-chip accuracy | Approximately ±22 μm at 3 sigma |
| Programmable placement force | Approximately 1–15 N |
| High-force option | Up to approximately 30 N on applicable configurations |
The maximum 200 × 125 mm component specification does not mean that every part of this size can be placed. Component weight, pickup position, center of gravity, vision field, feeder presentation and nozzle or gripper design must also be evaluated.
The original page described the X2 as handling components up to approximately 200 × 110 mm, but it did not explain that this capability requires the appropriate TwinHead configuration.
The usable component range should be divided according to the installed heads:
C&P20: Very small standard components up to approximately 6 × 6 mm
C&P12: Small and medium components up to approximately 18.7 × 18.7 mm
C&P6: Medium-sized components up to approximately 27 × 27 mm
TwinHead: Large ICs, connectors and selected odd-shaped components up to approximately 200 × 125 mm
Before confirming component compatibility, provide:
Component drawing
Length, width and height
Component weight
Pickup-surface image
Center-of-gravity information
Required placement force
Lead, ball or connector geometry
Tray, tape or feeder presentation
Required nozzle or gripper
The original SIPLACE X Series was developed to support 01005 placement, but stable production requires the complete hardware and process package.
A suitable setup may require:
20-nozzle Collect & Place head
Type 1005 component nozzles
8 mm SIPLACE X tape feeder
Compatible station-software version
Compatible SIPLACE Pro programming software
Correct nozzle and feeder calibration
Suitable tape-pocket tolerances
Accurate solder-paste printing
Stable PCB support
Controlled factory temperature and humidity
The machine model alone does not guarantee reliable 01005 production. A sample pickup and placement test should be completed when very small components are a critical purchasing requirement.
The SIPLACE X2 can use SIPLACE X component changeover tables or compatible SIPLACE HF component tables, depending on its installed docking system and placement heads.
With X component tables, the complete platform can provide up to approximately 160 positions for standard 8 mm X feeder modules.
With compatible HF component tables, capacity may reach approximately 180 tracks using 3 × 8 mm S feeder modules. However, the legacy HF table is not compatible with the C&P20 head in certain software and machine configurations.
Automatic docking and precise positioning
Offline feeder setup
Fast product changeover
Feeder removal and installation during production
Stable feeder positions during placement
Automatic empty-tape cutting
Optional reel-barcode verification
Traceability and setup control
Number of component tables supplied
X table or HF table configuration
Number of included 8 mm feeders
Quantity of wider tape feeders
Feeder model and part numbers
Feeder firmware compatibility
Table docking-unit condition
Communication-unit operation
Reel holders and waste containers
Feeder calibration condition
Compatibility with the installed C&P20 head
Feeders and component tables should not be assumed to be included with every used-machine quotation. The machine, tables, feeders and accessories should be listed separately.
The X2 can be configured with different component-supply systems for ICs, large packages and special components.
Matrix Tray Changer
Waffle Pack Changer
Manual waffle-pack tray holder
Stick magazine feeder
Linear vibratory feeder
Bulk-case feeder
Dip module
Application-specific OEM feeder
The X2 is particularly flexible for tray applications because optional tray systems may be installed at more than one component-supply location, depending on the complete machine layout.
Before ordering a machine for tray-fed production, confirm:
Tray system model
Supported tray dimensions
Tray elevator and transfer operation
Available component-table positions
Pickup-position calibration
Communication with the station software
Required nozzle or gripper
The SIPLACE X2 may be equipped with a single conveyor or a flexible dual conveyor. The actual system should be confirmed through photographs, measurements and a powered-on transport test.
A standard single-conveyor configuration supports boards from approximately 50 × 50 mm to 450 × 535 mm.
With the relevant long- and wide-board options, maximum dimensions can reach approximately 610 × 535 mm.
The flexible dual conveyor can process boards on two independent lanes. With the applicable options, maximum PCB dimensions can reach approximately 610 × 250 mm per lane.
The two lanes may operate:
Synchronously
Asynchronously
With the same product on both lanes
With different products on separate lanes
As one wider single conveyor
When used as a wider single conveyor, the system may process boards up to approximately 610 × 450 mm, depending on the installed configuration.
Minimum and maximum PCB length
Minimum and maximum PCB width
PCB thickness
Maximum board or panel weight
Single- or dual-lane requirement
Same or different products on each lane
Fixed conveyor-rail position
Transport direction
Production-line height
PCB edge clearance
Long-board and wide-board requirements
PCB support and warpage requirements
SMEMA or Siemens interface requirement
The original page’s 1525 × 560 mm figure should not be reused unless a specific modified machine can be physically measured and demonstrated to support that format.
The SIPLACE X platform follows the established principle of keeping both the PCB and feeder tables stationary during placement. The gantries move between the component supply, vision system and PCB coordinates.
This design supports:
Stable component pickup positions
Reliable handling of small components
Reduced risk of components shifting on the PCB
Shorter and more predictable head travel
Component inspection before placement
Tape splicing without moving the complete feeder table
Offline preparation of component tables
The original X Series combines digital vision and multiple process-control functions to monitor component pickup and placement.
Depending on the installed heads and options, the machine may include:
High-resolution component cameras
PCB fiducial recognition
Component position and rotation correction
Vacuum monitoring
Component-presence sensing
Placement-force monitoring
PCB warpage measurement
Bad-board recognition
Fine-pitch vision
Flip-chip vision
2D or 3D coplanarity inspection
Barcode-based setup verification
Production traceability
Optional functions should not be assumed from the machine model. Every camera, laser module, barcode scanner and software package must be checked on the actual equipment.
| Comparison | Original SIPLACE X2 | SIPLACE X2 S |
|---|---|---|
| Platform family | Original modular SIPLACE X Series | Later SIPLACE X-Series S generation |
| Number of gantries | 2 | 2 |
| Original head terminology | C&P20, C&P12, C&P6 and TwinHead | SpeedStar, MultiStar and TwinHead or later equivalent names |
| Maximum original X2 benchmark | Approximately 49,000 CPH with two C&P20 heads | Generation-dependent, with higher published performance |
| Maximum original X2 theoretical speed | Approximately 62,000 CPH | Approximately 85,250 CPH in earlier X-Series S documentation |
| Model identification | Nameplate normally states SIPLACE X2 | Nameplate normally states SIPLACE X2 S |
| Series page | Original SIPLACE X Series | SIPLACE X S / XS Series |
The original X2 should not be published using X2 S speed values. Used-equipment listings frequently omit the letter “S,” so the nameplate and installed head generation must be checked before specifications are assigned.
| Comparison | SIPLACE X2 | SIPLACE X3 | SIPLACE X4 |
|---|---|---|---|
| Number of gantries | 2 | 3 | 4 |
| Primary positioning | Flexible two-gantry configuration | Balanced capacity and flexibility | Highest gantry count in the original X Series |
| Head positions | 2 configurable positions | 3 configurable positions | 4 configurable positions |
| Maximum C&P20 benchmark | Approximately 49,000 CPH | Approximately 69,500 CPH | Approximately 90,000 CPH |
| Typical selection reason | Replacement, flexible placement or lower capacity requirement | Medium-to-high capacity line | Maximum original X Series output |
The X2 may be a better choice than an X3 or X4 when the production line does not require additional gantries, when machine length and investment must be controlled, or when the main requirement is flexible TwinHead placement rather than maximum chip output.
The production role of an X2 depends on its two installed placement heads.
Telecommunications equipment
Industrial-control electronics
Automotive electronic modules
Server and computer boards
Network hardware
Consumer electronics
Medical electronic assemblies
LED control boards
High-mix EMS production
Large IC and connector placement
Legacy X Series line expansion
Replacement of an existing X2 machine
A machine with two C&P20 heads is suitable for boards dominated by small tape-fed components. A machine with a C&P head and TwinHead is more suitable for mixed-component boards containing ICs, connectors and tray-fed parts.
The X2 can operate as a standalone placement machine or as part of a multi-machine SIPLACE X Series line.
A typical line may include:
PCB loader
Solder paste printer
Solder paste inspection system
SIPLACE X4 or X3 high-speed mounter
SIPLACE X2 flexible placement machine
Reflow oven
Automatic optical inspection system
PCB unloader
In this arrangement, the higher-gantry machine places most small components, while the X2 completes large ICs, connectors, tray-fed components and odd-shaped parts.
The X2 can also be configured with two high-speed heads and used to increase chip-placement capacity in an existing line.
A used X2 should be evaluated according to its complete configuration and intended production task. A successful power-on test alone does not confirm that the machine can maintain placement speed and accuracy.
Complete machine model
Original X2 or X2 S confirmation
Machine serial number
Manufacturing year
Total operating hours
Total placement counter
Original factory configuration
Current installed configuration
Station-software version
SIPLACE Pro compatibility
Head model installed on gantry one
Head model installed on gantry two
Head part and serial numbers
Individual head operating hours
Individual placement counters
Installed camera type
Nozzle-changer configuration
Head maintenance and repair history
Movement of both gantries
X-axis and Y-axis noise
Vibration during acceleration
Machine homing and reference operation
Motor and encoder condition
Axis-drive alarm history
Cable-chain and trailing-cable condition
Gantry calibration and alignment
Segment or nozzle-sleeve wear
Rotary-head movement
Z-axis movement
Vacuum pressure and leakage
Component-sensor operation
Force-sensor operation
Nozzle-changer operation
Pickup and placement repeatability
Both Pick & Place modules
Z-axis and rotational-axis movement
Vacuum and gripper operation
Placement-force control
Fine-pitch or flip-chip camera
Coplanarity module where installed
Nozzle-changer condition
Large-component sample placement
Component camera on each gantry
PCB-camera image quality
Lighting-level operation
Component recognition
Fiducial recognition
Pickup-position correction
PCB warpage detection
Camera calibration status
Single or flexible dual conveyor
Synchronous and asynchronous operation
Automatic width adjustment
Conveyor belts and pulleys
PCB entrance and exit sensors
Board clamping and support
Long-board and wide-board options
Dual conveyor in single-lane mode
Communication with surrounding equipment
X table or HF table configuration
Number of component tables
Number and type of included feeders
Feeder indexing and pickup performance
Table docking and locking condition
Communication-unit operation
Reel holders and waste containers
C&P20 compatibility with the installed feeder tables
Matrix Tray Changer condition
Waffle Pack Changer condition
Tray elevator and transfer movement
Pickup-position calibration
Stick and vibratory feeder condition
Application-specific feeder modules
Required nozzles and grippers
Station computers and monitors
Machine-software backups
Product and configuration files
Nozzles and nozzle magazines
Component tables and feeders
Tray systems
Transformer or voltage-conversion equipment
Operating and maintenance manuals
Calibration tools
Included spare parts
A complete inspection video should show startup, homing, both gantries, every installed placement head, feeder pickup, component recognition, nozzle changing, conveyor operation and an actual placement program.
Long-term production reliability depends on preventive maintenance and access to compatible legacy parts.
C&P20 placement segments
C&P12 and C&P6 rotary-head assemblies
TwinHead Z-axis and rotational components
Nozzle sleeves and holders
Nozzles and nozzle changers
Vacuum valves, filters and generators
Force and component sensors
Component cameras and lighting modules
PCB camera and fiducial lighting
X/Y motors and encoders
Axis drives and control boards
Trailing cables and cable chains
Cooling fans and air filters
Conveyor belts, pulleys and sensors
PCB support and warpage systems
Component-table docking interfaces
X and S feeder modules
Station computers and storage devices
Maintenance should include head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, conveyor adjustment, axis inspection, filter replacement and verification of software backups.
A used X2 may be suitable for manufacturers that already operate the original SIPLACE X Series and need replacement equipment, additional capacity or a flexible end-of-line machine.
The machine may be practical when:
The factory already owns compatible SIPLACE X feeders
The existing line uses original X2, X3 or X4 machines
Two gantries provide sufficient production capacity
The PCB contains both standard and complex components
A TwinHead is required for large or odd-shaped parts
Existing technicians understand the original X Series
Legacy spare parts and repair support are available
A damaged X2 must be replaced without redesigning the line
A used-machine investment is preferred over a new platform
A newer platform may be more suitable when the project requires current factory-software integration, newer feeder technology, lower energy use or long-term original-manufacturer lifecycle support.
Provide the following information so the available machine can be matched accurately:
Original X2 or X2 S requirement
Required machine quantity
Preferred manufacturing year
Preferred equipment condition
Required placement-head combination
Target production output
Minimum component package
Maximum component dimensions
Maximum component height and weight
Required placement accuracy
PCB dimensions and thickness
Single- or dual-conveyor requirement
Required feeder quantities and tape widths
Existing X or S feeder inventory
Tray or special component-supply requirement
Existing SIPLACE line configuration
Factory voltage and frequency
Compressed-air availability
Destination country
Required delivery schedule
Customers who require a cycle-time assessment may send the PCB BOM, placement file, component list, panel dimensions and target output for preliminary machine matching.
The original SIPLACE X2 is a two-gantry modular SMT placement machine. Depending on its heads, it can perform high-speed chip placement, flexible IC placement or odd-shaped component assembly.
The original SIPLACE X2 has two independently controlled placement gantries, with one head installed on each gantry.
With two C&P20 heads, the published values are approximately 43,400 CPH IPC, 49,000 CPH SIPLACE benchmark and 62,000 CPH theoretical maximum.
The original X2 technical specification does not list 100,000 CPH. That figure may result from confusion with a later X-Series S machine or another platform. The original X2 maximum theoretical value is approximately 62,000 CPH with two C&P20 heads.
The original platform supports 20-nozzle, 12-nozzle and 6-nozzle Collect & Place heads as well as the SIPLACE TwinHead.
The overall platform range extends from 01005 components to selected large parts around 200 × 125 mm. Actual capability depends on the two installed heads, cameras, nozzles and component supply.
The platform supports up to approximately 160 positions for 8 mm X feeders. Machines with compatible HF tables may provide up to approximately 180 S feeder tracks, but head and table compatibility must be checked.
A standard single conveyor supports boards up to approximately 450 × 535 mm. With suitable options, maximum single-conveyor dimensions can reach approximately 610 × 535 mm.
Yes. Machines may have a flexible dual conveyor supporting synchronous, asynchronous and wider single-lane operating modes.
A suitable X2 with the C&P20 head, correct nozzles, X feeders, software and calibration can process 01005 components. A sample placement test is recommended.
The X2 belongs to the original SIPLACE X Series. The X2 S belongs to the later X-Series S generation and has different heads, software and performance specifications.
Not automatically. Feeders, component tables, tray systems, nozzles and spare parts may be included or quoted separately. Every included item should be listed clearly.
Test both gantries, every placement head, component cameras, PCB camera, vacuum and force sensors, nozzle changers, conveyor, component tables, feeders, tray systems and station computers. A sample placement test is strongly recommended.
Send your required placement-head combination, PCB dimensions, component range, target output, feeder requirement, conveyor type and destination country. GEEKVALUE will check available ASM Siemens SIPLACE X2 machines and confirm the model, serial number, manufacturing year, installed heads, conveyor, feeder interface, software, included accessories, inspection scope and delivery arrangement.
View the complete ASM Siemens SIPLACE X Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
