The SIPLACE X3 is the three-gantry model in the modular SIPLACE X-series placement platform. Each gantry carries one placement head, allowing the machine to be configured for high-speed chip placement, mixed-component assembly or production that includes
The SIPLACE X3 is the three-gantry model in the modular SIPLACE X-series placement platform. Each gantry carries one placement head, allowing the machine to be configured for high-speed chip placement, mixed-component assembly or production that includes larger and more complex packages.
The X3 was originally documented under Siemens SIPLACE and is also commonly associated with the later ASM and ASMPT product portfolio. Available machines may differ in head combination, conveyor type, feeder system, software version and optional equipment. Actual machine photos, condition, configuration, included accessories, price and delivery time are confirmed before quotation.
The SIPLACE X3 has three independently configured gantries. Original X-series documentation lists four placement-head types: the 20-nozzle, 12-nozzle and 6-nozzle Collect & Place heads, together with the SIPLACE TwinHead.
Collect & Place heads pick up several components during each operating cycle and are intended primarily for standard SMD and IC placement. The TwinHead uses the Pick & Place principle and extends the platform to fine-pitch, special, heavy and irregularly shaped components.
Placement output changes significantly with the installed head combination. The following figures are selected reference values from the original SIPLACE X3 specification.
| Placement-Head Combination | IPC 9850 Rate | SIPLACE Benchmark Rate | Theoretical Maximum |
|---|---|---|---|
| 3 × 20-Nozzle Collect & Place | 62,200 components/hour | 69,500 components/hour | 93,000 components/hour |
| 2 × 20-Nozzle + 1 × 12-Nozzle Collect & Place | 53,600 components/hour | 59,000 components/hour | 82,500 components/hour |
| 2 × 20-Nozzle + 1 × 6-Nozzle Collect & Place | 49,200 components/hour | 54,800 components/hour | 73,500 components/hour |
| 2 × 20-Nozzle Collect & Place + 1 × TwinHead | 44,800 components/hour | 50,000 components/hour | 68,500 components/hour |
| 3 × 12-Nozzle Collect & Place | 37,600 components/hour | 40,400 components/hour | 61,000 components/hour |
| 3 × TwinHead | 11,600 components/hour | 12,500 components/hour | 19,500 components/hour |
These values represent defined reference or test conditions rather than guaranteed production output. Actual throughput depends on the installed heads, component mix, PCB layout, feeder arrangement, program optimization and condition of the equipment.
| Placement Head | Reference Component Capability | Typical Production Role |
|---|---|---|
| 20-Nozzle Collect & Place | 01005 to 6 × 6 mm, subject to nozzle and package requirements | High-speed placement of chips and other small standard components |
| 12-Nozzle Collect & Place | Small components, ICs, BGAs and packages up to 18.7 × 18.7 mm, depending on camera configuration | Balanced standard-component and IC placement |
| 6-Nozzle Collect & Place | Components from 0201 up to 27 × 27 mm | Larger IC packages and mixed-component production |
| TwinHead | Fine-pitch and special components; up to 200 × 125 mm with restrictions | Large, heavy, complex or irregularly shaped components |
TwinHead configurations can handle components up to 25 mm high and up to 100 g with standard nozzles. Maximum component dimensions depend on whether one or two nozzles are used, as well as the installed camera, nozzle or gripper.
The SIPLACE X-series was designed for 01005 placement using the 20-nozzle Collect & Place head, its high-resolution camera, compatible SIPLACE X feeder modules and dedicated nozzles. This capability should still be checked on an available X3 because its installed heads, feeders, nozzles and software may differ from the original configuration.
The SIPLACE X3 can be configured with a single conveyor or a flexible dual conveyor. The flexible dual conveyor supports synchronous and asynchronous operation and can also be operated in single-conveyor mode.
| Conveyor Mode | Standard PCB Range | Maximum with Applicable Options |
|---|---|---|
| Single Conveyor | 50 × 50 mm to 450 × 535 mm | Up to 610 × 535 mm |
| Flexible Dual Conveyor | 50 × 50 mm to 450 × 250 mm | Up to 610 × 250 mm per reference configuration |
| Dual Conveyor in Single-Conveyor Mode | 50 × 50 mm to 450 × 450 mm | Up to 610 × 450 mm |
| PCB Thickness | 0.3 to 4.5 mm; other thicknesses were available on request |
|---|---|
| Maximum PCB Weight | 3 kg |
| PCB Transport Interface | SMEMA or Siemens interface, depending on configuration |
| Automatic Width Adjustment | Available for single- and flexible dual-conveyor configurations |
The X-series uses movable component changeover tables that can be prepared outside the placement machine. Feeders can therefore be set up while production continues and the prepared table can be docked when a product change is required.
| Feeding Arrangement | Reference Capacity or Use | Important Limitation |
|---|---|---|
| SIPLACE X Changeover Tables | Up to 160 positions for 8 mm X feeder modules across four tables | Actual table and feeder quantities must be confirmed |
| SIPLACE HF Changeover Tables | Supports legacy S-series feeders and up to 180 tracks with 3 × 8 mm feeder modules | Cannot be combined with the 20-nozzle Collect & Place head |
| Matrix Tray Changer | Tray-fed ICs and special components | Optional and not compatible with every head arrangement |
| Waffle-Pack and Alternative Feeders | Trays, stick magazines, label presentation and application-specific feeding | Depends on adapters and installed peripheral equipment |
The SIPLACE X platform uses digital vision and multiple sensing functions to monitor component pickup and placement. Depending on the installed head, these may include head cameras, component sensors, vacuum monitoring, programmable placement-force control and PCB warpage checking.
Component position at the nozzle can be measured before placement, allowing detected pickup offsets to be corrected. Force and vacuum sensors are used to monitor component handling and help compensate for height differences or uneven PCB surfaces.
| Item | Why It Matters |
|---|---|
| Placement-Head Combination | Determines output, component range and the balance between speed and flexibility. |
| Camera, Nozzles and Grippers | Affect package recognition, component dimensions and special-component capability. |
| 01005 Equipment | Requires compatible heads, feeders, nozzles and supporting software. |
| Conveyor Type | Determines PCB dimensions, transport mode and compatibility with adjacent equipment. |
| X or HF Changeover Tables | Affects feeder compatibility and whether a 20-nozzle head can be used. |
| Feeders and Tray Equipment | May be included with the main machine or quoted separately. |
| Software Version | Should be checked against the required heads, options and existing SIPLACE production environment. |
| Machine Condition | Actual photos, configuration, included parts and delivery scope should match the final quotation. |
GEEKVALUE provides sourcing and quotation support for SIPLACE X3 placement machines according to current availability. Available equipment may differ in production year, head configuration, conveyor, feeder setup, software, condition and included accessories.
Send us your PCB dimensions, component range, required production capacity, preferred feeder system and destination country. We will confirm the available machine configuration, current photos, quotation scope, price and estimated delivery time before ordering.
No. The X3 supports several head combinations, and each combination has a different reference output. Production speed also changes with the component mix, PCB program, feeder layout and equipment condition.
The platform can cover both ranges when equipped with the appropriate heads and supporting equipment. A 20-nozzle Collect & Place head is used for 01005 placement, while the TwinHead extends the machine to larger and more complex components.
SIPLACE HF changeover tables and compatible S-series feeders can be used when the required docking equipment is installed. However, this arrangement cannot be combined with the 20-nozzle Collect & Place head.
Feeders, changeover tables, nozzles, tray systems and other accessories may be included or quoted separately. The final quotation should identify each item included in the delivery scope.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
