Used ASM SIPLACE X3 S SMT Machine | Inspection & Supply

The used ASM SIPLACE X3 S SMT machine is a three-gantry placement system suitable for replacing an existing X3 S, expanding an established SIPLACE X-Series S line or adding flexible placement capacity without changing the complete production platform. Machine suitability depends on the installed placement heads, conveyor, feeder package, software generation and current mechanical condition.

A later high-speed SIPLACE X3 S configuration provides published benchmark performance of up to 112,500 components per hour and IPC performance of up to 97,050 components per hour. Earlier machines may carry different published ratings, including 127,875 CPH theoretical, 94,500 CPH benchmark and 78,100 CPH IPC performance.

This page focuses on used-machine selection, configuration verification, inspection and production-line matching. For a complete technical introduction, review the ASM SIPLACE X3 S placement machine specifications. You can also compare the complete ASM SIPLACE X S / XS Series.

Used ASM SIPLACE X3 S Machine Overview

The SIPLACE X3 S is the three-gantry model within the X-Series S placement platform. Each gantry carries one placement head, giving the machine three independently controlled head positions.

The X3 S model designation does not automatically identify the exact head combination. One machine may be configured primarily for high-speed small-component placement, while another X3 S may use flexible or precision heads for larger ICs, trays, connectors and special components.

• Three independently controlled placement gantries

• Three installed placement-head positions

• Later benchmark performance up to approximately 112,500 CPH

• Later IPC performance up to approximately 97,050 CPH

• Earlier theoretical rating up to approximately 127,875 CPH

• CP20, CPP and TWIN placement-head options

• Earlier SpeedStar, MultiStar and TwinHead terminology

• Up to 160 positions for standard 8 mm SIPLACE X feeders

• Single-conveyor and flexible dual-conveyor options

• Support for high-speed chips, medium IC packages and selected special components

• Suitable for direct replacement, production expansion and line rebalancing

Used SIPLACE X3 S Technical Reference

Important: The values above describe different X3 S documentation generations and platform capabilities. A used machine should only be quoted according to its verified model, manufacturing year, installed heads, conveyor, software and current condition.

X3 S Has Three Gantries, Not Two or Four

The SIPLACE X-Series S platform includes several models with different gantry counts:

An X3 S does not become an X2 S or X4 S through a simple software setting. The model and gantry count should be verified using the original machine nameplate and complete interior photographs.

When a Used X3 S Is the Right Replacement

A used X3 S is frequently selected to replace an installed machine without redesigning the complete SMT line. A direct replacement may preserve existing programs, feeder investments, operator training, maintenance knowledge and line layout.

Common Replacement Situations

• An existing X3 S has suffered major gantry or control-system damage

• Repair cost is approaching the cost of a complete replacement machine

• The production line must return to operation quickly

• The factory already owns compatible X feeders and component trolleys

• Existing product programs were developed for the X-Series S platform

• Operators and maintenance technicians are familiar with X3 S equipment

• The surrounding printer, conveyors and reflow oven are already configured for the machine

• A newer platform would require software, feeder and training changes

A replacement machine should not be selected only because the front label says X3 S. Head configuration, conveyor width, transport direction, software generation, line interface and voltage must also be matched.

Using the X3 S for SMT Line Expansion

A used X3 S can also be added to increase placement capacity in an existing line. The machine may be used as the main high-speed mounter, a mixed-component placement module or a flexible machine positioned after a higher-output chip placer.

Expansion Scenario 1: Add Small-Component Capacity

An X3 S equipped with three CP20 or equivalent high-speed heads can increase placement capacity for boards containing large quantities of resistors, capacitors, diodes and other small tape-fed components.

This configuration may be suitable when:

• The existing placement section is the line bottleneck

• The PCB has a high number of small components

• The factory has enough compatible feeders

• Upstream printing and downstream reflow capacity can support the additional output

• Production floor space is available for another X-Series S module

Expansion Scenario 2: Add Flexible IC Placement

An X3 S equipped with CPP or earlier MultiStar heads can process small components together with medium-sized IC packages. This may reduce the workload assigned to an existing flexible mounter.

Expansion Scenario 3: Add End-of-Line Capability

An X3 S equipped with a TWIN or earlier TwinHead configuration can be used for larger ICs, trays, connectors and selected special components.

Expansion Scenario 4: Rebalance an X4 S Line

An X3 S can be added to a line containing an X4 S when the high-speed machine is completing its work before the flexible component stage. Components can be redistributed according to head capability, feeder location and required cycle time.

Placement-Head Configuration Determines the Machine Role

The three installed heads are the most important configuration detail on a used X3 S. Machines carrying the same X3 S model name can have substantially different output and component capability.

CP20 or SpeedStar Configuration

The CP20 and earlier SpeedStar production role is high-speed placement of small standard components. A later CP20 head supports components from approximately 0201 metric to 8.2 × 8.2 × 4 mm and provides published head performance up to approximately 43,000 CPH.

Typical applications include:

• Chip resistors

• Multilayer ceramic capacitors

• Small diodes and transistors

• Resistor and capacitor arrays

• Small-outline IC packages

• Small CSP and BGA packages

• LED components

CPP or MultiStar Configuration

The CPP and earlier MultiStar production role is flexible mixed-component placement. The head can switch between Collect & Place, Pick & Place and mixed operating modes on suitable configurations.

A later CPP configuration supports component heights up to approximately 15.5 mm and weights up to approximately 20 g.

Typical applications include:

• Passive components

• QFN and CSP packages

• BGA and QFP packages

• Medium-sized integrated circuits

• Components requiring controlled placement force

• High-mix production programs

TWIN or TwinHead Configuration

The TWIN and earlier TwinHead production role is precision handling of larger, taller, heavier and selected odd-shaped components. A later platform configuration supports component heights up to approximately 25 mm and weights up to approximately 160 g.

Typical applications include:

• Large BGA and QFP packages

• Large connectors

• Sockets and switches

• Coils and transformers

• Tray-fed processors

• Power electronic devices

• Components requiring snap-in detection

Common Used X3 S Head Combinations

Not every combination is available for every manufacturing year or software generation. Request clear photographs of all three placement-head labels before confirming the machine.

Understanding Used X3 S Speed Claims

Two groups of X3 S speed specifications are commonly found in technical documents and used-equipment listings.

These figures should not be combined into one machine description. The later 112,500 CPH value should only be applied when the available machine has the corresponding head generation and performance package.

The earlier 127,875 CPH value is theoretical. It is not guaranteed real production output.

Actual Output Depends on the Production Program

• Installed head on each of the three gantries

• Total placement quantity per PCB

• Component distribution between the heads

• Feeder positions and tape widths

• PCB and panel dimensions

• Required component rotations

• Nozzle-change frequency

• Tray-access time

• Vision and coplanarity inspection requirements

• Conveyor loading and unloading time

• Pickup retries and component rejection rate

• Placement-head, nozzle and feeder condition

• Complete line balance

For a meaningful cycle-time estimate, provide the PCB BOM, placement coordinates, panel dimensions, feeder requirements and target hourly output.

Feeder and Component-Trolley Compatibility

A maximum X3 S configuration provides up to 160 positions for standard 8 mm SIPLACE X feeders. Wider feeders occupy several 8 mm positions and reduce the number of physical feeder units that can be installed.

Feeder Information to Verify

• Number of component trolleys included

• Number of included 8 mm feeders

• Quantity of 12 mm, 16 mm and wider feeders

• Feeder generation and part number

• Feeder firmware compatibility

• Machine-software compatibility

• Feeder calibration status

• Tape-indexing and pickup performance

• Trolley docking and communication condition

• Reel holders and waste-tape containers

Feeders and component trolleys are not automatically included with every used machine. The quotation should list the machine, heads, trolleys, feeders, nozzles and tray systems separately.

Conveyor and PCB Compatibility

A used X3 S may have a single conveyor or flexible dual conveyor. PCB capacity depends on the conveyor generation, installed width package and long-board options.

Later platform specifications describe board sizes from approximately 50 × 50 mm to 850 × 685 mm. Earlier specifications commonly list 450 × 560 mm as a standard single-conveyor format and up to 850 × 560 mm with a Long Board Option.

PCB Information Required Before Matching

• Minimum PCB length and width

• Maximum PCB or panel dimensions

• PCB thickness

• Maximum assembled-board weight

• Single-lane or dual-lane production

• Same or different products on each lane

• Required PCB transport direction

• Fixed conveyor-rail position

• Required line height

• PCB edge-clearance requirement

• Long-board or wide-board requirement

• PCB support and warpage-control requirement

• Interface with the surrounding SMT equipment

The maximum platform PCB dimension should not be assigned automatically to every used X3 S. Request physical measurements and a powered-on board-transport test.

Used, Inspected and Refurbished Machine Conditions

The words used, inspected and refurbished should describe different supply conditions.

A repainted exterior does not prove that a machine has been refurbished. The refurbishment scope should identify the inspected, repaired, calibrated and replaced items.

Used SIPLACE X3 S Inspection Checklist

1. Machine Identification

• Complete X3 S model designation

• Machine item and serial numbers

• Manufacturing year

• Total operating hours

• Total placement counter

• Original factory configuration

• Current installed configuration

• Station-software version

• Programming-software compatibility

2. Three-Gantry Inspection

• Movement of all three gantries

• X-axis and Y-axis noise

• Vibration during acceleration and deceleration

• Machine homing and reference operation

• Linear-motor condition

• Encoder and position-feedback condition

• Axis-drive alarm history

• Cable-chain and trailing-cable condition

• Gantry alignment and calibration

3. Placement-Head Identification

• Head installed on gantry one

• Head installed on gantry two

• Head installed on gantry three

• Head model, part number and serial number

• Individual head operating hours

• Individual placement counters

• Installed camera type

• Nozzle-changer configuration

• Maintenance and repair history

4. Placement-Head Functional Test

• Nozzle-segment and sleeve condition

• Z-axis movement

• Rotational-axis movement

• Vacuum pressure and leakage

• Component-presence sensors

• Placement-force monitoring

• Nozzle-changer operation

• Special nozzle or gripper operation

• Pickup and placement repeatability

• Abnormal head temperature or noise

5. Camera and Vision Inspection

• Component camera on all three gantries

• PCB-camera image quality

• Lighting-level operation

• Component-shape recognition

• Small-component recognition

• Fiducial recognition

• Pickup-position correction

• PCB warpage measurement

• Coplanarity inspection where installed

• Camera calibration status

6. Conveyor Inspection

• Single or flexible dual conveyor

• Synchronous and asynchronous operation

• Automatic width adjustment

• Conveyor belts and pulleys

• PCB entrance and exit sensors

• PCB clamping and support

• Long-board and wide-board options

• Maximum measured PCB format

• Communication with surrounding equipment

7. Feeder and Trolley Inspection

• Number of included component trolleys

• Number and type of included feeders

• Feeder tape-width combinations

• Feeder firmware compatibility

• Feeder indexing and pickup performance

• Trolley docking and locking condition

• Communication-interface operation

• Reel holders and tape-waste containers

• Material setup-verification functions

8. Tray and Special Component Systems

• Matrix Tray Changer availability

• Waffle Pack Changer availability

• Tray elevator and transfer operation

• Special component-supply modules

• Required nozzles and grippers

• Pickup-position calibration

• Snap-in or placement-force functions where required

9. Included Equipment

• Station computers and monitors

• Machine-software backups

• Product and configuration files

• Nozzles and nozzle magazines

• Component trolleys and feeders

• Tray systems

• Transformer or voltage-conversion equipment

• Operating and maintenance manuals

• Calibration tools

• Included spare parts

Recommended Powered-On Acceptance Test

A complete acceptance test should demonstrate more than startup and gantry movement.

1. Start the machine from a complete power-off condition.

2. Record the machine model, serial number and software version.

3. Complete the homing and reference sequence.

4. Operate all three gantries through their full movement range.

5. Show the label of every installed placement head.

6. Test feeder communication and component indexing.

7. Perform component pickup with each head.

8. Demonstrate component-camera recognition.

9. Test the PCB camera and fiducial recognition.

10. Operate the nozzle changers.

11. Transport a representative PCB through the conveyor.

12. Run a sample placement program.

13. Record alarms, rejected components and pickup retries.

14. Show the final machine status after the test.

Refurbishment Areas to Review

• CP20 or SpeedStar head segments

• CPP or MultiStar head assemblies

• TWIN or TwinHead Z-axis assemblies

• Nozzle sleeves and nozzle holders

• Nozzles and nozzle changers

• Vacuum valves, generators and filters

• Placement-force and component sensors

• Component cameras and lighting modules

• PCB camera and fiducial lighting

• Linear motors and encoders

• Axis drives and control boards

• Trailing cables and cable chains

• Cooling fans and machine filters

• Conveyor belts, pulleys and sensors

• PCB support and warpage systems

• Component-trolley docking interfaces

• SIPLACE X feeders

• Station computers and storage devices

Refurbishment should be based on inspection results. Replacing parts without completing calibration and placement testing does not confirm production readiness.

Shipping and Installation Preparation

A SIPLACE X3 S is a precision machine. Gantries, heads, conveyors, computers and feeder interfaces must be secured correctly before transport.

Pre-Shipment Requirements

• Complete machine backup

• Parking and securing of all three gantries

• Head and nozzle protection

• Removal or securing of component trolleys

• Protection of monitors and station computers

• Moisture and impact protection

• Vacuum packaging where required

• Suitable export crate or container fixing

• Photographs before and after packaging

• Complete packing list

Information Required at the Destination Factory

• Factory voltage and frequency

• Compressed-air pressure and quality

• Machine installation space

• Floor loading and levelling conditions

• Upstream and downstream line height

• PCB transport direction

• Network and factory-software requirements

• Available feeder and nozzle inventory

• Installation and calibration support requirements

Who Should Consider This Used X3 S?

A used SIPLACE X3 S may be suitable when:

• An existing X3 S requires direct replacement

• The factory needs more output than an X2 S provides

• An X4 S is not required for the target production capacity

• The existing line already uses X-Series S equipment

• The factory owns compatible SIPLACE X feeders

• Existing product programs are based on SIPLACE software

• Operators and technicians understand the platform

• The PCB contains both small components and medium IC packages

• Production capacity must be expanded with limited process changes

• A used-equipment investment is preferred over a new platform

Information Required for a Used X3 S Quotation

• Replacement or line-expansion purpose

• Required manufacturing year

• Preferred used, inspected or refurbished condition

• Required placement-head combination

• Target production output

• Smallest component package

• Largest component dimensions

• Maximum component height and weight

• Required placement accuracy

• Required placement force

• PCB dimensions and thickness

• Single- or dual-conveyor requirement

• Long-board or wide-board requirement

• Required feeder quantity and tape widths

• Existing feeder model and generation

• Tray or special component-supply requirement

• Current SIPLACE line configuration

• Machine software and factory-interface requirements

• Factory voltage and frequency

• Destination country

• Required delivery schedule

Frequently Asked Questions

Is the SIPLACE X3 S a three-gantry machine?

Yes. The X3 S has three placement gantries. The X2 S has two gantries, while the X4 S and X4i S have four.

Can an X3 S be configured as a two- or four-gantry machine?

The X-Series S platform provides separate X2 S, X3 S and X4 S models. A standard X3 S should be treated as a three-gantry machine and verified from its nameplate.

What is the speed of a used SIPLACE X3 S?

Later specifications list up to approximately 112,500 CPH benchmark and 97,050 CPH IPC performance. Earlier specifications list 127,875 CPH theoretical, 94,500 CPH benchmark and 78,100 CPH IPC performance.

Why do X3 S machines have different speed specifications?

The values come from different head, software and machine generations. The exact equipment configuration must be checked before a speed rating is assigned.

Which placement heads can be installed?

Later configurations may use CP20, CPP and TWIN heads. Earlier documentation may use SpeedStar, MultiStar and TwinHead names.

How many feeders can the X3 S support?

The machine can provide up to 160 positions for standard 8 mm SIPLACE X feeders. Wider feeders occupy multiple positions.

Are feeders included with a used X3 S?

Not automatically. Feeders, component trolleys, nozzles, tray systems and spare parts may be included or quoted separately.

Can the X3 S replace an existing X3 S directly?

It may be suitable as a direct replacement, but the heads, conveyor, software, transport direction, voltage and line interfaces must be matched.

Can the X3 S process large PCBs?

PCB capability depends on the conveyor and installed options. Later platform data extends to approximately 850 × 685 mm, while earlier standard configurations may support smaller formats.

What should an inspection video show?

It should show startup, homing, all three gantries, every head label, feeder pickup, component recognition, nozzle changes, PCB transport and an actual placement program.

What is the difference between a used and refurbished X3 S?

A used machine may be supplied largely in its current condition. A refurbished machine should have a documented inspection, repair, replacement and calibration scope.

What information is needed to match an available machine?

Provide the required head combination, PCB dimensions, component range, output target, feeder package, software environment, factory voltage and destination.

Request Used ASM SIPLACE X3 S Availability

Send your current line configuration, required placement heads, PCB dimensions, component range, feeder inventory, target output and destination country. GEEKVALUE will check available SIPLACE X3 S machines and confirm the machine label, manufacturing year, serial number, installed heads, conveyor, software, operating condition, included accessories and inspection scope.

Review the ASM SIPLACE X3 S technical page, compare the complete SIPLACE X S / XS Series, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.