ASM SIPLACE X3 S SMT Placement Machine | 112,500 CPH

The ASM SIPLACE X3 S placement machine is a three-gantry SMT mounter developed for high-volume production that requires a balance of placement output, component flexibility and large-board capability. Depending on the installed heads, the machine can operate as a high-speed chip placer, a flexible IC mounter or an end-of-line placement system for larger and more complex components.

A current X3 S configuration provides SIPLACE benchmark performance of up to 112,500 components per hour and supports up to 160 positions for 8 mm SIPLACE X feeders. Earlier X3 S machines may show different published speed values because they use an older generation of placement heads, software and performance-test standards.

GEEKVALUE supplies available used, inspected and refurbished X3 S machines according to the required placement heads, conveyor configuration, feeder package, machine condition and production application. Explore the complete ASM SIPLACE X S  / SIPLACE XS Seriesto compare the X2S, X3S and X4S placement platforms.

ASM SIPLACE X3 S Machine Overview

The SIPLACE X3 S uses three independently controlled placement gantries. Each gantry carries one placement head, allowing the machine to be configured with three high-speed heads, three flexible heads or a combination of high-speed, flexible and odd-shaped component heads.

This modular design is one of the main differences between the X3 S and a dedicated chip shooter. A factory can select the head combination according to its PCB component mix instead of purchasing a machine that is limited to only one placement task.

• Three independently operating placement gantries

• Current SIPLACE benchmark speed up to 112,500 CPH

• Current IPC placement rating up to 97,050 CPH

• Earlier theoretical rating up to 127,875 CPH

• CP20, CPP and TWIN placement-head options

• Earlier SpeedStar, MultiStar and TwinHead terminology

• Up to 160 feeder positions for 8 mm X feeders

• Single-conveyor and flexible dual-conveyor configurations

• Placement accuracy up to approximately 22 μm at 3 sigma with the relevant precision-head configuration

• Support for small chips, IC packages, tray-fed devices and selected odd-shaped components

• Suitable for telecommunications, servers, automotive electronics and high-volume EMS production

ASM SIPLACE X3 S Technical Specifications

Configuration notice: Published X3 S specifications changed during the product lifecycle. The actual speed, component spectrum, PCB dimensions, placement accuracy and feeder compatibility of a used machine must be confirmed from its original nameplate, installed heads, conveyor, software version and powered-on inspection.

Why X3 S Speed Figures Differ Between Documents

The SIPLACE X3 S has been produced and documented across several placement-head and software generations. For this reason, older and later brochures contain different performance ratings.

The earlier 127,875 CPH number is a theoretical value. It should not be presented as the guaranteed production output of every X3 S machine.

The later 112,500 CPH figure is a SIPLACE benchmark value associated with a newer machine and head generation. A used machine cannot automatically be assigned this output without confirming its exact configuration.

Factors That Affect Actual X3 S Output

• Placement-head model on each gantry

• Number of components placed on each PCB

• Distribution of placements across the three gantries

• Feeder positions and tape widths

• PCB dimensions and panel format

• Component size and required rotation

• Nozzle-change frequency

• Tray access and component-supply method

• Component inspection time

• Conveyor loading and unloading cycle

• Pickup retries and rejection rate

• Placement-head and feeder condition

• Program optimization and complete line balance

For a realistic capacity estimate, the PCB BOM, placement coordinates, panel dimensions and target cycle time should be reviewed rather than relying only on the highest published CPH value.

Three-Gantry Modular Placement Architecture

The three-gantry architecture allows the X3 S to occupy a position between the two-gantry X2 S and the four-gantry X4 S. It provides more placement capacity than the X2 S while retaining greater configuration flexibility than a machine designed only for maximum chip-placement speed.

The production software assigns component part numbers and placement coordinates to the three gantries according to:

• Installed head capability

• Feeder location

• Component dimensions

• Nozzle requirement

• Required placement accuracy

• Placement force

• Head travel distance

• Estimated cycle time

A well-balanced program allows all three gantries to complete their work at approximately the same time. If one head is assigned significantly more components or longer travel distances, the remaining gantries may wait and the total machine output will decrease.

SIPLACE X3 S Placement-Head Configurations

The installed head combination determines whether an individual X3 S is optimized for high-speed chip placement, mixed-component production or flexible end-of-line assembly.

Common configuration concepts include:

• Three CP20 or SpeedStar heads for maximum small-component output

• Two high-speed heads plus one CPP or MultiStar flexible head

• One high-speed head plus two flexible heads

• CPP and TWIN combinations for ICs and odd-shaped components

• Three flexible heads for high-mix production

Customers should request clear photographs of all three head labels. The sales description “X3S” alone does not identify which placement heads are installed.

CP20 or SpeedStar High-Speed Head

The CP20 family is a 20-segment Collect & Place head intended for maximum placement speed. Multiple components are collected from the stationary feeder area, inspected and then placed onto the stationary PCB.

Current CP20 specifications support small components from approximately 0201 metric to 8.2 × 8.2 × 4 mm. Earlier SpeedStar documentation commonly describes the smallest-component range using 03015 or 0201 metric terminology, depending on the machine generation.

Typical components include:

• Chip resistors

• Multilayer ceramic capacitors

• Small diodes

• Small transistors

• Resistor and capacitor arrays

• Small-outline IC packages

• Small CSP and BGA packages

• LED and communication-board components

A three-CP20 configuration normally provides the highest X3 S output, but it does not provide the complete component flexibility available from CPP or TWIN heads.

CPP or MultiStar Flexible Placement Head

The CPP head is designed for production programs that contain both small standard components and medium-sized IC packages. Depending on the head generation, it can switch between Collect & Place, Pick & Place and mixed operating modes through software.

Current CPP specifications include:

• Component range from approximately 01005 to 50 × 40 mm

• Maximum component height up to approximately 15.5 mm

• Software-controlled placement mode switching

• Programmable component-placement force

• Support for both high-speed and flexible production tasks

A CPP or earlier MultiStar head can help balance an X3 S line where one machine must process passive components, ICs and medium-sized packages without adding a separate flexible mounter.

TWIN or TwinHead for Large and Odd-Shaped Components

The TWIN placement head is intended for larger, heavier, delicate or irregular components. It can use vacuum tooling or application-specific mechanical grippers.

Depending on the machine and head generation, typical applications include:

• Large BGA and QFP packages

• Fine-pitch integrated circuits

• Large connectors

• Coils and transformers

• Sockets and switches

• Mechanical electronic components

• Tray-fed components

• Parts requiring controlled placement force

• Snap-in or press-fit style components supported by the installed package

Common X S platform documentation describes an overall component spectrum extending to approximately 200 × 110 or 200 × 125 mm, with component heights up to approximately 25 mm. The actual limit depends on head version, camera, tooling, component weight and software.

The X3 S Is More Than a High-Speed Chip Mounter

The X3 S is frequently described only by its maximum placement speed. This overlooks one of its main advantages: three independently configurable gantries.

A suitable head combination allows the machine to cover:

• High-volume passive-component placement

• Medium and large IC packages

• Fine-pitch devices

• Tray-fed components

• Selected large connectors

• Odd-shaped components

• Mixed-component high-volume boards

• Flexible end-of-line placement

A machine equipped with three high-speed heads has a different production role from an X3 S equipped with CPP and TWIN heads. Both may carry the same X3 S model name, but they should not be quoted or promoted as identical machines.

160 Feeder Positions and X Feeder Support

The SIPLACE X3 S supports up to 160 feeder positions when calculated using standard 8 mm SIPLACE X feeders. This large feeder capacity supports complex PCBs with many component part numbers and helps reduce product-change preparation.

Wider feeders consume more than one 8 mm position, so the actual number of installed feeder units depends on the component tape-width combination.

Typical Component-Supply Options

• 8 mm SIPLACE X feeders

• 12 mm and 16 mm tape feeders

• 24 mm, 32 mm and wider tape feeders

• SIPLACE component carts and changeover tables

• Matrix Tray Changer systems

• Waffle Pack Changer systems

• Stick and vibratory component feeders

• Bulk-case feeders

• Application-specific OEM component modules

Feeder Package Information to Confirm

• Number of component carts supplied

• Number of included 8 mm feeders

• Quantity and width of larger feeders

• X feeder generation and part numbers

• Feeder firmware compatibility

• Feeder-table communication condition

• Contactless power and data-interface condition

• Feeder calibration status

• Reel-holder and waste-tape container condition

• Required spare feeder quantity

Feeders, component carts and tray systems should not be assumed to be included with every used machine. The quotation should identify all included accessories separately.

Single-Conveyor and Flexible Dual-Conveyor Options

The SIPLACE X3 S can be equipped with a single conveyor or a flexible dual conveyor. Conveyor configuration affects PCB dimensions, production mode and integration with the surrounding SMT equipment.

Single-Conveyor Production

Single-conveyor operation is suitable for wider PCBs and panels that cannot fit within one lane of a dual-conveyor system. Earlier standard specifications commonly describe boards up to approximately 450 × 560 mm, with a long-board option extending the length to approximately 850 mm.

Later X S specifications show larger board capability, but the required wide-board and long-board options must be installed on the actual machine.

Flexible Dual-Conveyor Production

A flexible dual conveyor can reduce non-productive transport time by allowing one PCB to enter or wait while another board is being processed.

Depending on the installed software and transport system, the conveyor may support:

• Synchronous dual-lane production

• Asynchronous dual-lane production

• The same product on both lanes

• Different products on separate lanes

• Dual conveyor operated as a wider single lane

• Long-board processing with suitable options

PCB Information Required Before Selection

• Minimum PCB length and width

• Maximum PCB or panel dimensions

• PCB thickness

• Maximum assembled-board weight

• Single- or dual-lane production requirement

• Same or different product on each lane

• Fixed conveyor-rail position

• PCB transport direction

• Required production-line height

• Available PCB edge clearance

• Long-board or wide-board requirement

• Board support and warpage-control requirement

• Upstream and downstream communication interface

The actual conveyor should be measured and tested before purchase. The model name alone does not prove that the machine supports the largest PCB format published for the complete X S platform.

Placement Accuracy and Process Control

The SIPLACE X S platform combines digital component vision, PCB recognition, vacuum sensing, force sensing and software-controlled calibration to maintain placement stability at high production speeds.

Depending on machine generation and installed options, process-control functions may include:

• Component presence detection

• Vacuum monitoring during pickup and placement

• Component position and rotation correction

• Programmable placement force

• PCB fiducial recognition

• PCB warpage measurement and compensation

• Bad-board and bad-panel recognition

• Automatic feeder setup verification

• Barcode-controlled production

• Component traceability

• Coplanarity inspection for selected packages

• Closed-loop pickup correction

The published placement accuracy of up to approximately 22 μm at 3 sigma applies to the relevant precision-head configuration and test conditions. It should not be assigned automatically to every head or every production component.

Small-Component Production Requirements

The X S platform is designed for very small components, but stable 0201 metric or 01005 production depends on the complete process rather than only the machine model.

Reliable small-component placement may require:

• Compatible CP20 or equivalent high-speed heads

• High-resolution component cameras

• Correct micro-component nozzles

• Suitable low-force nozzle sleeves

• Compatible and calibrated X feeders

• Correct machine and programming software

• Stable PCB support

• Accurate solder-paste printing

• Consistent component-tape pocket quality

• Controlled factory temperature and humidity

When the machine is being purchased specifically for very small components, request a sample pickup and placement test with a representative component package.

Typical SIPLACE X3 S Applications

The X3 S is suitable for production lines that require higher output than a two-gantry platform but do not necessarily require the maximum capacity of an X4 S.

• Telecommunications and 5G equipment

• Server and data-center hardware

• Network and computing products

• Automotive electronic modules

• Consumer electronic devices

• Industrial control equipment

• Medical electronic assemblies

• LED and display-control boards

• High-volume EMS manufacturing

• Mixed-component large-PCB production

A three-high-speed-head configuration is suitable for boards dominated by small tape-fed components. A mixed CP20, CPP and TWIN configuration may be more suitable when the PCB contains a wider range of ICs, connectors and special components.

ASM SIPLACE X3 S vs X2 S and X4 S

The X3 S is often selected when the X2 S does not provide enough placement capacity but the production requirement does not justify a four-gantry X4 S.

Machine condition and head configuration remain more important than model count alone. A properly configured and maintained X3 S may be more productive for a mixed-component board than an X4 S equipped only with high-speed heads.

ASM X3S, SIPLACE X3 S and Siemens X3S Identification

Used-equipment listings may describe the machine using several names:

• ASM SIPLACE X3 S

• ASM placement machine X3S

• SIPLACE X3S chip mounter

• Siemens SIPLACE X3 S

• X3 S pick and place machine

• ASM X3S SMT machine

The correct product name is normally written as SIPLACE X3 S. Since older SIPLACE equipment and parts may still be associated with Siemens terminology, some suppliers use Siemens and ASM wording interchangeably.

Machine identification should be based on:

• Original machine nameplate

• Complete model designation

• Machine serial number

• Manufacturing year

• Installed head labels

• Station-software version

• Conveyor configuration

• Feeder-interface generation

Used ASM SIPLACE X3 S Inspection Checklist

A used X3 S should be evaluated as a complete production system. External photographs and a successful power-on test are not sufficient to confirm stable placement performance.

1. Machine Identification

• Complete X3 S model designation

• Machine serial number

• Manufacturing year

• Total operating hours

• Total placement counter

• Original factory configuration

• Current installed configuration

• Station-software version

• Programming-software compatibility

2. Gantry and Axis Inspection

• Movement of all three gantries

• X-axis and Y-axis noise

• Vibration during acceleration and deceleration

• Machine homing and reference operation

• Linear-motor condition

• Encoder and position-feedback condition

• Axis-drive alarm history

• Cable-chain and trailing-cable condition

• Gantry calibration and alignment

3. Placement-Head Inspection

• Exact head installed on each gantry

• Head identification labels and part numbers

• Individual head operating hours

• Individual placement counters

• Nozzle-segment and sleeve wear

• Z-axis movement

• Rotational-axis movement

• Vacuum pressure and leakage

• Force-sensor operation

• Component-sensor operation

• Nozzle-changer operation

• Pickup and placement repeatability

4. Camera and Vision Inspection

• Component-camera condition on all three gantries

• High-resolution camera availability

• PCB-camera image quality

• Lighting-level operation

• Component-shape recognition

• Fiducial recognition

• Pickup-position correction

• PCB warpage measurement

• Coplanarity option where required

• Camera calibration status

5. Conveyor Inspection

• Single or flexible dual conveyor

• Synchronous and asynchronous operation

• Automatic width adjustment

• Conveyor belts and pulleys

• PCB entrance and exit sensors

• PCB clamping and board support

• Long-board or wide-board extensions

• Dual conveyor used as a single wider lane

• Communication with surrounding equipment

6. Feeder and Component-Cart Inspection

• Number of included component carts

• Number and type of included feeders

• Feeder tape-width combinations

• Feeder firmware and machine compatibility

• Feeder indexing and pickup performance

• Contactless power and data interface

• Cart docking and locking condition

• Communication-unit operation

• Reel holders and waste containers

• Setup-verification functions

7. Tray and Special Component Supply

• Matrix Tray Changer availability

• Waffle Pack Changer availability

• Tray elevator and transfer operation

• Stick or vibratory feeder availability

• Application-specific component modules

• Required nozzles and grippers

• Tray pickup-position calibration

8. Included Equipment

• Station computers and monitors

• Machine-software backups

• Product and configuration files

• Nozzles and nozzle magazines

• Component carts and feeders

• Tray systems

• Transformer or voltage-conversion equipment

• Operating and maintenance manuals

• Calibration tools

• Included spare parts

A complete inspection video should show machine startup, homing, operation of all three gantries, every installed placement head, feeder pickup, component recognition, nozzle changing, conveyor operation and an actual sample placement program.

Common SIPLACE X3 S Maintenance Areas

The X3 S operates with high acceleration and frequent placement cycles. Preventive maintenance is necessary to maintain its speed, accuracy and process stability.

• CP20 or SpeedStar head segments

• CPP or MultiStar head assemblies

• TWIN or TwinHead Z-axis assemblies

• Nozzle sleeves and nozzle holders

• Nozzles and automatic nozzle changers

• Vacuum valves, generators and filters

• Force sensors and component sensors

• Component cameras and lighting modules

• PCB camera and fiducial lighting

• Linear motors and encoders

• Axis drives and control boards

• Trailing cables and cable chains

• Cooling fans and machine filters

• Conveyor belts, pulleys and sensors

• PCB support and warpage systems

• Component-cart docking interfaces

• X feeder modules

• Station computers and storage devices

Recommended maintenance includes placement-head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, conveyor adjustment, axis inspection, filter replacement and verification of software backups.

Who Should Consider a Used SIPLACE X3 S?

A used X3 S may be suitable for manufacturers that already operate compatible SIPLACE X equipment and require additional placement capacity or a replacement machine.

The platform may be practical when:

• The factory requires more output than an X2 S provides

• The production mix does not require a four-gantry X4 S

• The PCB contains both small chips and larger IC packages

• The factory already owns compatible X feeders

• Existing technicians understand X-Series S equipment

• Replacement heads and spare parts are available

• The existing software environment supports the machine

• A damaged X3 S must be replaced without redesigning the complete line

• A used-machine investment is preferred over a new platform

A newer platform may be more appropriate when the project requires the newest factory-software integration, current manufacturer lifecycle support, updated feeder technology or process capabilities not included with the available used machine.

Information Required for an X3 S Quotation

Provide the following information so the available machine can be matched to the production requirement:

• Required machine quantity

• Preferred manufacturing year

• Preferred machine condition

• Target placement output

• Required placement-head configuration

• Minimum component package

• Maximum component dimensions

• Maximum component height and weight

• Required placement accuracy

• PCB dimensions and thickness

• Single- or dual-conveyor requirement

• Long-board or wide-board requirement

• Required feeder quantities and tape widths

• Existing SIPLACE X feeder inventory

• Tray or special component-supply requirement

• Existing SIPLACE line configuration

• Factory voltage and frequency

• Compressed-air availability

• Destination country

• Required delivery schedule

Customers who require a cycle-time estimate may send the PCB BOM, placement file, component list, panel dimensions and target output for preliminary equipment matching.

Frequently Asked Questions

What is the ASM SIPLACE X3 S used for?

The SIPLACE X3 S is used for high-speed and flexible SMT placement. Depending on its heads, it can process small passive components, IC packages, tray-fed devices and selected odd-shaped components.

How many gantries does the SIPLACE X3 S have?

The X3 S has three independently controlled placement gantries. Each gantry carries one placement head.

What is the placement speed of the X3 S?

Later ASMPT specifications list up to 112,500 CPH SIPLACE benchmark performance and 97,050 CPH IPC performance. Earlier specifications list 127,875 CPH theoretical, 94,500 CPH benchmark and 78,100 CPH IPC performance.

Why are there different X3 S speed specifications?

The values come from different machine, placement-head and software generations and use different test methods. The actual machine generation must be confirmed before a performance value is quoted.

Which placement heads can be installed on the X3 S?

Later machines may use CP20, CPP and TWIN heads. Earlier documentation may describe equivalent production roles using SpeedStar, MultiStar and TwinHead terminology.

What component sizes can the X3 S process?

The overall platform spectrum can extend from very small metric chip components to selected parts around 200 × 110 or 200 × 125 mm. The actual range depends on the three installed placement heads and tooling.

How many feeders can be installed?

The X3 S provides up to 160 positions for standard 8 mm X feeders. Wider feeders occupy several positions and reduce the total installed feeder quantity.

Does the X3 S support tray-fed components?

Yes. Depending on configuration, the machine can work with Matrix Tray Changers, Waffle Pack Changers and other tray or special component-supply systems.

Does the X3 S support dual-lane production?

Yes. Machines may be equipped with a flexible dual conveyor supporting synchronous, asynchronous or wider single-lane operation. The actual conveyor must be checked on the machine.

What PCB size can the X3 S process?

PCB capacity depends on the conveyor and extension options. Earlier specifications commonly show 450 × 560 mm as a standard single-conveyor format, while later platform options can support significantly larger boards.

What is the difference between the X2 S, X3 S and X4 S?

The main difference is gantry count. The X2 S has two gantries, the X3 S has three and the X4 S has four. More gantries generally provide higher placement capacity, although head configuration and machine condition remain important.

Are feeders included with a used X3 S?

Not automatically. Feeders, component carts, tray systems, nozzles and spare parts may be included or quoted separately. Every included item should be listed clearly in the quotation.

What should be tested before purchasing a used X3 S?

Test all three gantries, every placement head, component cameras, PCB camera, vacuum and force sensors, nozzle changers, conveyor, feeders, component carts, station computers and required software functions. A sample placement test is strongly recommended.

Request ASM SIPLACE X3 S Availability

Send your required head configuration, PCB dimensions, component range, target output, feeder requirement, conveyor type and destination country. GEEKVALUE will check available ASM SIPLACE X3 S machines and confirm the model, serial number, manufacturing year, installed heads, conveyor, software, included accessories, inspection scope and delivery arrangement.

View the complete ASM SIPLACE X S / XS Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.