Used ASM SIPLACE SX2 with two removable gantries, up to 86,500 CPH, 120 feeder slots and configurable placement heads.
The ASM SIPLACE SX2 chip mounter is a flexible two-gantry SMT placement machine designed for high-mix production, rapidly changing order volumes and demanding component applications. Its removable gantry concept allows manufacturers to adjust placement capacity without replacing or rebuilding the complete production line.
A high-speed SX2 equipped with two SpeedStar placement heads provides SIPLACE benchmark performance of up to 86,500 components per hour and IPC performance of up to 66,000 components per hour. Alternative configurations using MultiStar or TwinStar heads provide broader component handling, controlled placement force and support for large or odd-shaped components.
GEEKVALUE supplies available used, inspected and refurbished SIPLACE SX2 machines according to the installed gantries, placement heads, conveyor, feeder package, software version and machine condition. Explore the complete ASM SIPLACE SX Series to compare SX1 and SX2 machine configurations.

The SIPLACE SX2 is the two-gantry configuration of the modular SX placement platform. Each gantry carries one placement head and can be configured according to the required component range, output and placement process.
A machine equipped with two SpeedStar heads is optimized for high-speed placement of small standard components. A SpeedStar and MultiStar combination balances speed and flexibility, while MultiStar and TwinStar configurations support larger ICs, connectors, tray-fed parts and odd-shaped components.
Two removable and independently controlled placement gantries
Maximum SIPLACE benchmark speed of up to 86,500 CPH
Maximum IPC placement speed of up to 66,000 CPH
SpeedStar, MultiStar and TwinStar placement-head options
Up to 120 positions for standard 8 mm feeders
Component spectrum from 0201 metric to approximately 200 × 125 × 50 mm
Best platform placement accuracy of approximately 22 μm at 3 sigma
Single-conveyor and flexible dual-conveyor options
Optional long-board capability up to approximately 1,525 × 560 mm
Support for tape, tray, stick, bowl and application-specific component supply
Suitable for high-mix, automotive, industrial, medical and communication electronics
| Specification | Typical SIPLACE SX2 Platform Capability |
|---|---|
| Machine type | Flexible two-gantry SMT placement machine |
| Number of gantries | 2 removable placement gantries |
| Available placement heads | SpeedStar CP20P2, MultiStar CPP and TwinStar TH |
| Maximum SIPLACE benchmark speed | Up to approximately 86,500 CPH with two SpeedStar heads |
| Maximum IPC speed | Up to approximately 66,000 CPH |
| Overall component spectrum | Approximately 0201 metric to 200 × 125 × 50 mm, depending on the installed heads |
| Best published placement accuracy | Approximately 22 μm at 3 sigma with the relevant TwinStar configuration |
| SpeedStar accuracy | Approximately ±34 μm at 3 sigma |
| Maximum feeder capacity | Up to 120 positions for 8 mm feeders |
| Minimum PCB size | Approximately 50 × 50 mm |
| Dual-conveyor PCB size | Up to approximately 450 × 275 mm per lane, depending on configuration |
| Maximum long-board format | Up to approximately 1,525 × 560 mm with the applicable transport module |
| Conveyor options | Single conveyor and flexible dual conveyor |
| Machine dimensions | Approximately 1.5 × 2.8 × 1.8 m |
| Component supply | Tape feeders, trays, sticks, bowls and application-specific feeders |
| Typical production role | High-mix placement, variable-volume production and flexible special-component assembly |
Configuration notice: The specifications above describe the complete SIPLACE SX platform and representative SX2 configurations. The speed, feeder capacity, component range, PCB dimensions and placement accuracy of a particular used machine depend on its installed heads, conveyor, feeders, software and optional process packages.
The defining feature of the SIPLACE SX platform is its removable placement gantry. Instead of purchasing a fixed-capacity machine for every production line, manufacturers can add, remove or transfer compatible gantries according to changes in production demand.
An SX base machine can operate with one gantry as an SX1 or with two gantries as an SX2. Where compatible equipment and software are available, a gantry can be transferred from a line with excess capacity to another line that has become a production bottleneck.
Increase placement capacity when production volume rises
Reduce excess equipment capacity during lower-volume periods
Transfer placement performance between compatible SX lines
Adjust equipment investment according to actual production demand
Support temporary production peaks and short-term projects
Rebalance lines when one placement process becomes a bottleneck
Change the production role of an existing SX machine
The gantry should not be treated as a simple mechanical accessory. Gantry transfer requires compatible machine hardware, software configuration, calibration and qualified technical work.
The maximum SX2 output depends on the installed head combination. A machine with two SpeedStar heads provides significantly more small-component output than a configuration using MultiStar and TwinStar heads.
| Representative Head Configuration | SIPLACE Benchmark Speed | Typical Production Role |
|---|---|---|
| SpeedStar + SpeedStar | Up to approximately 86,500 CPH | Maximum small-component placement output |
| SpeedStar + MultiStar | Up to approximately 66,000 CPH | High-speed placement with broader component flexibility |
| TwinStar + MultiStar | Up to approximately 27,000 CPH | Flexible placement of ICs, large and odd-shaped components |
| Actual production output | Application-dependent | Determined by the PCB program, component mix and machine condition |
The 86,500 CPH value is a SIPLACE benchmark rating for a two-SpeedStar configuration. It should not be described as guaranteed output for an SX2 equipped with different heads or running a complex production program.
Placement head installed on each gantry
Number of components placed on each PCB
Distribution of placements between the two gantries
Feeder positions and component tape widths
PCB dimensions and panel format
Component dimensions and required rotations
Nozzle changes and special-tool changes
Tray, bowl or stick component supply
Vision and coplanarity inspection requirements
Placement-force and snap-in processes
Conveyor loading and unloading time
Pickup retries and component rejection rate
Placement-head, feeder and nozzle condition
Program optimization and complete SMT line balance
For a realistic capacity estimate, provide the PCB BOM, placement coordinates, panel dimensions and target cycle time instead of relying only on the maximum benchmark rating.
The SpeedStar, also identified as the CP20P2 placement head on relevant machines, is a 20-segment Collect & Place head developed for high-speed processing of small standard components.
The head collects multiple components from the feeder area, checks their position and orientation with the digital vision system, and then places them onto the stationary PCB.
| Typical component range | Approximately 0201 metric to 8.2 × 8.2 × 4 mm |
|---|---|
| Maximum placement performance | Up to approximately 43,250 CPH per head |
| Published placement accuracy | Approximately ±34 μm at 3 sigma |
| Operating principle | 20-segment Collect & Place |
| Primary production role | High-volume placement of small standard SMD components |
Chip resistors
Multilayer ceramic capacitors
Small diodes
SOT transistors
Resistor and capacitor arrays
Small-outline IC packages
Small CSP and BGA packages
LED components
Other small tape-fed SMD packages
An SX2 equipped with two SpeedStar heads provides the maximum published SX2 output, but large connectors, tall components and complex odd-shaped parts require another head configuration.
The MultiStar, also identified as the CPP head, is designed to cover a broad component range without requiring a physical head replacement between different production modes.
Through software, the MultiStar can switch between:
Collect & Place mode for smaller components
Pick & Place mode for larger components
Mixed mode for production programs containing different component types
| Maximum component height | Up to approximately 15.5 mm |
|---|---|
| Maximum component weight | Up to approximately 20 g |
| Placement modes | Collect & Place, Pick & Place and mixed mode |
| Additional functions | Automatic pin-one detection and LED centering on suitable configurations |
| Primary production role | Mixed-component and high-mix SMT production |
The MultiStar head is particularly useful when product changeovers are frequent and the PCB contains both small passive components and medium-sized IC packages.
The TwinStar, also identified as the TH placement head, is intended for large, heavy, tall, delicate and odd-shaped components. It can use vacuum nozzles or application-specific mechanical grippers according to the component design.
| Maximum platform component dimensions | Selected components up to approximately 200 × 125 mm |
|---|---|
| Maximum component height | Up to approximately 50 mm |
| Maximum component weight | Up to approximately 240 g |
| Best published placement accuracy | Approximately 22 μm at 3 sigma |
| Special functions | Snap-in detection and improved THT component placement |
| Primary production role | Large, heavy and odd-shaped component placement |
The maximum component dimensions do not mean that every component measuring 200 × 125 mm can automatically be processed. Final compatibility depends on component weight, height, pickup surface, center of gravity, tooling, camera field, feeder presentation and PCB clearance.
Large connectors
Large BGA and QFP packages
Coils and transformers
Sockets and switches
Mechanical electronic components
Tray-fed power devices
Components requiring controlled insertion force
Selected through-hole or pin-in-paste components
Parts requiring snap-in detection
The SX platform can be configured with an odd-shaped component process package for parts that cannot be handled reliably by ordinary vacuum pickup and standard vision settings.
Depending on the installed package, available functions may include:
High-resolution component imaging
Combined 3D component inspection
Detection of damaged or missing pin tops
On-board checks of selected critical positions
Snap-in and insertion-height detection
Application-specific grippers and nozzles
Automatic adjustment of movement acceleration
Placement-force control from touchless placement to high-force insertion
Later SX process configurations can control placement force from approximately 0.5 N to 100 N, allowing the same platform to handle sensitive LEDs and robust connector applications.
The SIPLACE SX2 supports up to 120 positions for standard 8 mm feeders in a maximum-capacity configuration. This provides sufficient material capacity for many high-mix PCB programs.
Wider tape feeders occupy multiple 8 mm positions. Certain head and special component configurations may also reduce the available feeder capacity. For example, representative TwinStar and MultiStar configurations may provide approximately 90 feeder positions.
8 mm SIPLACE X feeders
12 mm, 16 mm and wider tape feeders
Matrix tray systems
Waffle-pack tray systems
Stick magazine feeders
Vibratory component feeders
Bowl feeders
Bulk-case feeders
Third-party feeders through compatible open interfaces
Application-specific component-supply modules
Number of feeder carts or component tables included
Number of included 8 mm feeders
Quantity and width of larger tape feeders
Feeder model and part numbers
Feeder firmware and software compatibility
Feeder calibration and pickup condition
Cart communication and docking condition
Reel holders and waste-tape containers
Tray, bowl or stick feeder requirements
Required spare feeder quantity
Feeders and component carts are not automatically included with every used SX2. The quotation should clearly list the machine, gantries, heads, feeders, carts, nozzles and special component-supply systems.
The SIPLACE SX2 can be equipped with a single conveyor or a flexible dual conveyor. The correct transport system depends on PCB dimensions, production volume and the configuration of surrounding SMT equipment.
The dual conveyor is suitable for smaller and medium-width PCBs. Representative platform information describes PCB formats up to approximately 450 × 275 mm per lane.
Depending on the software and installed transport system, the dual conveyor may support:
Synchronous production on both lanes
Asynchronous production
The same product on two lanes
Different products on separate lanes
Reduced waiting time between PCB transfers
Single-conveyor configurations support wider boards. With an applicable ASM Smart Transport Module or long-board system, the platform can process boards up to approximately 1,525 × 560 mm.
This long-board specification is an optional platform capability. It should not be assigned automatically to every SX2.
Minimum PCB length and width
Maximum PCB or panel dimensions
PCB thickness
Maximum assembled-board weight
Single-lane or dual-lane requirement
Same or different product on each lane
Required PCB transport direction
Fixed conveyor-rail position
Required production-line height
PCB edge-clearance requirement
Long-board transport requirement
PCB support and warpage-control requirement
Communication interface with surrounding machines
Request photographs, measurements and a powered-on conveyor test before confirming the maximum PCB size of a used SX2.
The SIPLACE SX uses digital cameras, sensors and software-controlled correction to maintain placement reliability across a wide component spectrum.
Depending on machine generation and installed options, available functions may include:
Component presence detection
Vacuum monitoring during pickup and placement
Component position and rotation correction
PCB fiducial recognition
Automatic placement-height guidance
Pin-one detection
LED centering
Snap-in detection
High-resolution and 3D component inspection
PCB and on-board feature inspection
Automatic feeder-pitch recognition
Nozzle identification
Automatic nozzle-condition monitoring and cleaning
Barcode-controlled material verification
Process traceability and factory-software integration
Optional functions must be checked on the actual machine. The SX2 model designation alone does not confirm that every camera, sensor, software license or special process package is installed.
A SpeedStar-equipped SX2 can process very small metric components, but reliable production requires the complete head, nozzle, feeder, software and process package.
A suitable setup may require:
Compatible CP20P2 SpeedStar placement head
High-resolution component camera
Correct micro-component nozzles
Compatible and calibrated 8 mm X feeders
Correct station and programming software
Stable feeder pickup-position calibration
Suitable carrier-tape pocket quality
Stable PCB clamping and support
Accurate solder-paste printing
Controlled factory temperature and humidity
When purchasing an SX2 specifically for very small components, request a representative pickup and placement test before shipment.
The SX2 is particularly suitable for manufacturers whose product mix, order volume and component requirements change frequently.
Automotive electronic modules
Industrial automation equipment
Medical electronic assemblies
Telecommunications and network equipment
Power-electronics products
High-mix EMS manufacturing
New-product introduction and pilot production
Large and long PCB assembly
Connector and odd-shaped component placement
Mixed SMD and pin-in-paste assembly
Production lines with variable capacity requirements
Replacement or expansion of an existing SX line
| Comparison | SIPLACE SX1 | SIPLACE SX2 |
|---|---|---|
| Placement gantries | 1 removable gantry | 2 removable gantries |
| Maximum benchmark speed | Up to approximately 43,250 CPH | Up to approximately 86,500 CPH |
| Maximum IPC speed | Up to approximately 33,000 CPH | Up to approximately 66,000 CPH |
| Maximum feeder positions | Up to 120 × 8 mm positions | Up to 120 × 8 mm positions |
| Head positions | One configurable head | Two configurable heads |
| Typical positioning | Flexible production, NPI and specialized placement | Higher-capacity high-mix and mixed-head production |
| Capacity adjustment | Can receive or transfer a compatible gantry | Can operate with or transfer removable gantries |
The main difference between SX1 and SX2 is gantry quantity. Their actual component range, speed and production role depend on the placement heads installed on those gantries.
The names SIPLACE SX and SIPLACE X S may look similar, but they identify different machine platforms.
| Comparison | SIPLACE SX | SIPLACE X S / XS |
|---|---|---|
| Main model names | SX1 and SX2 | X2 S, X3 S, X4 S and X4i S |
| Primary positioning | Flexible high-mix production and Capacity on Demand | Maximum high-volume placement performance |
| Gantry concept | Removable and transferable gantries | Two-, three- or four-gantry high-volume configurations |
| Main selection priority | Product diversity, capacity adjustment and special components | Maximum speed and volume-production performance |
| Correct series link | SIPLACE SX Series | SIPLACE X S / XS Series |
An SX2 should not be published using specifications from an X2 S. The complete machine nameplate must be checked because the model names are frequently confused in used-equipment listings.
A used SX2 should be evaluated as a complete modular placement system. A successful power-on test alone does not confirm that both gantries, heads, cameras and process options are ready for stable production.
Complete SIPLACE SX2 model designation
Machine serial number
Manufacturing year
Total operating hours
Total placement counter
Original factory configuration
Current installed configuration
Station-software version
Programming-software compatibility
Number of installed gantries
Gantry identification and serial numbers
Head installed on each gantry
Gantry operating hours
Installation and transfer history
Gantry calibration records
Mechanical locking and rail condition
Communication and electrical connections
X-axis and Y-axis movement on both gantries
Noise and vibration during acceleration
Machine homing and reference operation
Linear motor and encoder condition
Axis-drive alarm history
Cable-chain and trailing-cable condition
Lubrication and guide condition
Gantry alignment and calibration
Exact SpeedStar, MultiStar or TwinStar head model
Head serial number and operating hours
Placement counter
Nozzle-segment and sleeve wear
Z-axis and rotational-axis movement
Vacuum pressure and leakage
Component and force sensors
Nozzle changer operation
Special gripper operation where installed
Pickup and placement repeatability
Component camera on both gantries
High-resolution camera availability
PCB-camera image quality
Lighting-system operation
Component-shape recognition
Fiducial recognition
Pickup-position correction
Pin-top and 3D inspection where installed
Camera calibration status
Single or flexible dual conveyor
Synchronous and asynchronous operation
Automatic width adjustment
Conveyor belts and pulleys
PCB entrance and exit sensors
Board clamping and PCB support
Long-board transport module
Maximum measured PCB dimensions
Communication with surrounding equipment
Number of included component carts
Number and type of included feeders
Feeder tape-width combinations
Feeder indexing and pickup performance
Feeder firmware and machine compatibility
Cart docking and locking condition
Communication-unit operation
Reel holders and waste-tape containers
Automatic feeder-pitch detection
Tray changer or waffle-pack system
Bowl and vibratory feeder availability
Stick feeder availability
Third-party feeder interface
Special grippers and nozzles
OSC process-package availability
Snap-in detection
High-force placement function
Station computers and monitors
Machine-software backups
Product and configuration files
Nozzles and nozzle magazines
Feeder carts and feeders
Tray and special component-supply equipment
Transformer or voltage-conversion equipment
Operating and maintenance manuals
Calibration tools
Included spare parts
A complete inspection video should show machine startup, homing, operation of both gantries, every installed placement head, feeder pickup, component recognition, nozzle changing, PCB transport and an actual placement program.
The modular SX platform requires preventive maintenance of both the base machine and every installed gantry.
SpeedStar placement-head segments
MultiStar head assemblies
TwinStar Z-axis and rotational assemblies
Nozzle sleeves and nozzle holders
Nozzles and automatic nozzle changers
Vacuum valves, generators and filters
Placement-force and component sensors
Component cameras and lighting modules
PCB camera and fiducial lighting
Linear motors and encoders
Axis drives and control boards
Gantry mounting rails and locking systems
Trailing cables and cable chains
Cooling fans and machine filters
Conveyor belts, pulleys and sensors
PCB support and long-board transport systems
Component-cart docking interfaces
SIPLACE X feeder modules
Station computers and storage devices
Recommended maintenance includes placement-head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, axis inspection, conveyor adjustment, filter replacement and verification of machine-software backups.
A used SX2 may be suitable for manufacturers that need flexible placement capacity and already operate, or plan to operate, an SX-based high-mix production line.
The machine may be practical when:
Product volumes change frequently
The factory produces many PCB variants
Two placement gantries provide the required capacity
The PCB contains both small and large components
Odd-shaped or high-force placement is required
The factory already owns compatible SIPLACE X feeders
An existing SX1 must be expanded to an SX2 configuration
A damaged SX2 must be replaced without redesigning the line
Existing technicians understand SIPLACE SX operation
A used-equipment investment is preferred over a new platform
A newer machine may be more suitable when the project requires a current manufacturer warranty, the latest factory-software environment or process functions not installed on the available used SX2.
Required SX1 or SX2 configuration
Required number of gantries
Preferred manufacturing year
Preferred machine condition
Required SpeedStar, MultiStar or TwinStar head combination
Target production output
Minimum component package
Maximum component dimensions
Maximum component height and weight
Odd-shaped component requirement
Required placement force
PCB dimensions and thickness
Single- or dual-conveyor requirement
Long-board transport requirement
Required feeder quantities and tape widths
Tray, bowl or stick feeder requirement
Existing SIPLACE equipment and feeder inventory
Factory voltage and frequency
Compressed-air availability
Destination country
Required delivery schedule
For special components, provide the component drawing, dimensions, weight, pickup-surface photograph, feeder presentation and required insertion or placement force.
The SX2 is a two-gantry flexible SMT placement machine used for high-mix production, high-speed chip placement and assembly of ICs, connectors and selected odd-shaped components.
The SX2 normally has two removable placement gantries. An SX base machine operating with one gantry is identified as an SX1 configuration.
A high-speed SX2 with two SpeedStar heads provides up to approximately 86,500 CPH SIPLACE benchmark performance and 66,000 CPH IPC performance.
No. The 86,500 CPH value applies to a representative two-SpeedStar configuration. MultiStar, TwinStar and mixed-head configurations have different performance.
Common head options include SpeedStar CP20P2 for high speed, MultiStar CPP for flexible mixed-component production and TwinStar TH for large or odd-shaped components.
The complete platform spectrum extends from approximately 0201 metric to selected components around 200 × 125 × 50 mm. The actual range depends on the two installed heads and tooling.
The platform supports up to 120 positions for standard 8 mm feeders. Some flexible or special-component configurations may provide fewer feeder positions.
Yes. Machines equipped with the appropriate Smart Transport Module or long-board system can process boards up to approximately 1,525 × 560 mm.
Yes. The flexible dual conveyor can support synchronous and asynchronous PCB transport, depending on the installed configuration and software.
Yes. TwinStar and OSC package configurations can support large, heavy, tall and odd-shaped components with special tooling, vision, snap-in detection and controlled placement force.
Capacity on Demand refers to the removable SX gantry concept. Compatible gantries can be added, removed or transferred between SX lines to adjust placement capacity.
No. SX2 belongs to the flexible SIPLACE SX platform. X2 S belongs to the separate high-volume SIPLACE X-Series S platform.
Not automatically. Feeders, component carts, nozzles, tray systems and spare parts may be included or quoted separately. Every included item should be listed clearly.
Test both gantries, every installed placement head, cameras, sensors, nozzle changers, conveyor, feeders, component carts, station computers and all required special process functions.
Send your required head configuration, PCB dimensions, component range, target output, feeder requirement, conveyor type and destination country. GEEKVALUE will check available ASM SIPLACE SX2 machines and confirm the serial number, manufacturing year, installed gantries, placement heads, conveyor, software, included accessories, inspection scope and delivery arrangement.
View the complete ASM SIPLACE SX Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.