SMT Product Detail

ASM SIPLACE SX2 SMT Placement Machine | 86,500 CPH

Used ASM SIPLACE SX2 with two removable gantries, up to 86,500 CPH, 120 feeder slots and configurable placement heads.

SMT equipment and spare parts supply
Model and part number checking support
Stock, condition and quotation confirmation
ASM SIPLACE SX2 SMT Placement Machine | 86,500 CPH
Product Overview

The ASM SIPLACE SX2 chip mounter is a flexible two-gantry SMT placement machine designed for high-mix production, rapidly changing order volumes and demanding component applications. Its removable gantry concept allows manufacturers to adjust placement capacity without replacing or rebuilding the complete production line.

A high-speed SX2 equipped with two SpeedStar placement heads provides SIPLACE benchmark performance of up to 86,500 components per hour and IPC performance of up to 66,000 components per hour. Alternative configurations using MultiStar or TwinStar heads provide broader component handling, controlled placement force and support for large or odd-shaped components.

GEEKVALUE supplies available used, inspected and refurbished SIPLACE SX2 machines according to the installed gantries, placement heads, conveyor, feeder package, software version and machine condition. Explore the complete ASM SIPLACE SX Series to compare SX1 and SX2 machine configurations.

ASM SIPLACE SX2 SMT Placement Machine

ASM SIPLACE SX2 Machine Overview

The SIPLACE SX2 is the two-gantry configuration of the modular SX placement platform. Each gantry carries one placement head and can be configured according to the required component range, output and placement process.

A machine equipped with two SpeedStar heads is optimized for high-speed placement of small standard components. A SpeedStar and MultiStar combination balances speed and flexibility, while MultiStar and TwinStar configurations support larger ICs, connectors, tray-fed parts and odd-shaped components.

  • Two removable and independently controlled placement gantries

  • Maximum SIPLACE benchmark speed of up to 86,500 CPH

  • Maximum IPC placement speed of up to 66,000 CPH

  • SpeedStar, MultiStar and TwinStar placement-head options

  • Up to 120 positions for standard 8 mm feeders

  • Component spectrum from 0201 metric to approximately 200 × 125 × 50 mm

  • Best platform placement accuracy of approximately 22 μm at 3 sigma

  • Single-conveyor and flexible dual-conveyor options

  • Optional long-board capability up to approximately 1,525 × 560 mm

  • Support for tape, tray, stick, bowl and application-specific component supply

  • Suitable for high-mix, automotive, industrial, medical and communication electronics

ASM SIPLACE SX2 Technical Specifications

SpecificationTypical SIPLACE SX2 Platform Capability
Machine typeFlexible two-gantry SMT placement machine
Number of gantries2 removable placement gantries
Available placement headsSpeedStar CP20P2, MultiStar CPP and TwinStar TH
Maximum SIPLACE benchmark speedUp to approximately 86,500 CPH with two SpeedStar heads
Maximum IPC speedUp to approximately 66,000 CPH
Overall component spectrumApproximately 0201 metric to 200 × 125 × 50 mm, depending on the installed heads
Best published placement accuracyApproximately 22 μm at 3 sigma with the relevant TwinStar configuration
SpeedStar accuracyApproximately ±34 μm at 3 sigma
Maximum feeder capacityUp to 120 positions for 8 mm feeders
Minimum PCB sizeApproximately 50 × 50 mm
Dual-conveyor PCB sizeUp to approximately 450 × 275 mm per lane, depending on configuration
Maximum long-board formatUp to approximately 1,525 × 560 mm with the applicable transport module
Conveyor optionsSingle conveyor and flexible dual conveyor
Machine dimensionsApproximately 1.5 × 2.8 × 1.8 m
Component supplyTape feeders, trays, sticks, bowls and application-specific feeders
Typical production roleHigh-mix placement, variable-volume production and flexible special-component assembly

Configuration notice: The specifications above describe the complete SIPLACE SX platform and representative SX2 configurations. The speed, feeder capacity, component range, PCB dimensions and placement accuracy of a particular used machine depend on its installed heads, conveyor, feeders, software and optional process packages.

Capacity on Demand With Removable Gantries

The defining feature of the SIPLACE SX platform is its removable placement gantry. Instead of purchasing a fixed-capacity machine for every production line, manufacturers can add, remove or transfer compatible gantries according to changes in production demand.

An SX base machine can operate with one gantry as an SX1 or with two gantries as an SX2. Where compatible equipment and software are available, a gantry can be transferred from a line with excess capacity to another line that has become a production bottleneck.

Benefits of the Removable Gantry Concept

  • Increase placement capacity when production volume rises

  • Reduce excess equipment capacity during lower-volume periods

  • Transfer placement performance between compatible SX lines

  • Adjust equipment investment according to actual production demand

  • Support temporary production peaks and short-term projects

  • Rebalance lines when one placement process becomes a bottleneck

  • Change the production role of an existing SX machine

The gantry should not be treated as a simple mechanical accessory. Gantry transfer requires compatible machine hardware, software configuration, calibration and qualified technical work.

Understanding SX2 Placement-Speed Ratings

The maximum SX2 output depends on the installed head combination. A machine with two SpeedStar heads provides significantly more small-component output than a configuration using MultiStar and TwinStar heads.

Representative Head ConfigurationSIPLACE Benchmark SpeedTypical Production Role
SpeedStar + SpeedStarUp to approximately 86,500 CPHMaximum small-component placement output
SpeedStar + MultiStarUp to approximately 66,000 CPHHigh-speed placement with broader component flexibility
TwinStar + MultiStarUp to approximately 27,000 CPHFlexible placement of ICs, large and odd-shaped components
Actual production outputApplication-dependentDetermined by the PCB program, component mix and machine condition

The 86,500 CPH value is a SIPLACE benchmark rating for a two-SpeedStar configuration. It should not be described as guaranteed output for an SX2 equipped with different heads or running a complex production program.

Factors Affecting Actual SX2 Output

  • Placement head installed on each gantry

  • Number of components placed on each PCB

  • Distribution of placements between the two gantries

  • Feeder positions and component tape widths

  • PCB dimensions and panel format

  • Component dimensions and required rotations

  • Nozzle changes and special-tool changes

  • Tray, bowl or stick component supply

  • Vision and coplanarity inspection requirements

  • Placement-force and snap-in processes

  • Conveyor loading and unloading time

  • Pickup retries and component rejection rate

  • Placement-head, feeder and nozzle condition

  • Program optimization and complete SMT line balance

For a realistic capacity estimate, provide the PCB BOM, placement coordinates, panel dimensions and target cycle time instead of relying only on the maximum benchmark rating.

SIPLACE SpeedStar High-Speed Placement Head

The SpeedStar, also identified as the CP20P2 placement head on relevant machines, is a 20-segment Collect & Place head developed for high-speed processing of small standard components.

The head collects multiple components from the feeder area, checks their position and orientation with the digital vision system, and then places them onto the stationary PCB.

Typical component rangeApproximately 0201 metric to 8.2 × 8.2 × 4 mm
Maximum placement performanceUp to approximately 43,250 CPH per head
Published placement accuracyApproximately ±34 μm at 3 sigma
Operating principle20-segment Collect & Place
Primary production roleHigh-volume placement of small standard SMD components

Typical SpeedStar Components

  • Chip resistors

  • Multilayer ceramic capacitors

  • Small diodes

  • SOT transistors

  • Resistor and capacitor arrays

  • Small-outline IC packages

  • Small CSP and BGA packages

  • LED components

  • Other small tape-fed SMD packages

An SX2 equipped with two SpeedStar heads provides the maximum published SX2 output, but large connectors, tall components and complex odd-shaped parts require another head configuration.

SIPLACE MultiStar Flexible Placement Head

The MultiStar, also identified as the CPP head, is designed to cover a broad component range without requiring a physical head replacement between different production modes.

Through software, the MultiStar can switch between:

  • Collect & Place mode for smaller components

  • Pick & Place mode for larger components

  • Mixed mode for production programs containing different component types

Maximum component heightUp to approximately 15.5 mm
Maximum component weightUp to approximately 20 g
Placement modesCollect & Place, Pick & Place and mixed mode
Additional functionsAutomatic pin-one detection and LED centering on suitable configurations
Primary production roleMixed-component and high-mix SMT production

The MultiStar head is particularly useful when product changeovers are frequent and the PCB contains both small passive components and medium-sized IC packages.

SIPLACE TwinStar for Large and Odd-Shaped Components

The TwinStar, also identified as the TH placement head, is intended for large, heavy, tall, delicate and odd-shaped components. It can use vacuum nozzles or application-specific mechanical grippers according to the component design.

Maximum platform component dimensionsSelected components up to approximately 200 × 125 mm
Maximum component heightUp to approximately 50 mm
Maximum component weightUp to approximately 240 g
Best published placement accuracyApproximately 22 μm at 3 sigma
Special functionsSnap-in detection and improved THT component placement
Primary production roleLarge, heavy and odd-shaped component placement

The maximum component dimensions do not mean that every component measuring 200 × 125 mm can automatically be processed. Final compatibility depends on component weight, height, pickup surface, center of gravity, tooling, camera field, feeder presentation and PCB clearance.

Typical TwinStar Applications

  • Large connectors

  • Large BGA and QFP packages

  • Coils and transformers

  • Sockets and switches

  • Mechanical electronic components

  • Tray-fed power devices

  • Components requiring controlled insertion force

  • Selected through-hole or pin-in-paste components

  • Parts requiring snap-in detection

Odd-Shaped Component and OSC Process Package

The SX platform can be configured with an odd-shaped component process package for parts that cannot be handled reliably by ordinary vacuum pickup and standard vision settings.

Depending on the installed package, available functions may include:

  • High-resolution component imaging

  • Combined 3D component inspection

  • Detection of damaged or missing pin tops

  • On-board checks of selected critical positions

  • Snap-in and insertion-height detection

  • Application-specific grippers and nozzles

  • Automatic adjustment of movement acceleration

  • Placement-force control from touchless placement to high-force insertion

Later SX process configurations can control placement force from approximately 0.5 N to 100 N, allowing the same platform to handle sensitive LEDs and robust connector applications.

120 Feeder Positions and Flexible Component Supply

The SIPLACE SX2 supports up to 120 positions for standard 8 mm feeders in a maximum-capacity configuration. This provides sufficient material capacity for many high-mix PCB programs.

Wider tape feeders occupy multiple 8 mm positions. Certain head and special component configurations may also reduce the available feeder capacity. For example, representative TwinStar and MultiStar configurations may provide approximately 90 feeder positions.

Available Component-Supply Methods

  • 8 mm SIPLACE X feeders

  • 12 mm, 16 mm and wider tape feeders

  • Matrix tray systems

  • Waffle-pack tray systems

  • Stick magazine feeders

  • Vibratory component feeders

  • Bowl feeders

  • Bulk-case feeders

  • Third-party feeders through compatible open interfaces

  • Application-specific component-supply modules

Feeder Package Information to Confirm

  • Number of feeder carts or component tables included

  • Number of included 8 mm feeders

  • Quantity and width of larger tape feeders

  • Feeder model and part numbers

  • Feeder firmware and software compatibility

  • Feeder calibration and pickup condition

  • Cart communication and docking condition

  • Reel holders and waste-tape containers

  • Tray, bowl or stick feeder requirements

  • Required spare feeder quantity

Feeders and component carts are not automatically included with every used SX2. The quotation should clearly list the machine, gantries, heads, feeders, carts, nozzles and special component-supply systems.

Single-Conveyor and Flexible Dual-Conveyor Production

The SIPLACE SX2 can be equipped with a single conveyor or a flexible dual conveyor. The correct transport system depends on PCB dimensions, production volume and the configuration of surrounding SMT equipment.

Flexible Dual-Conveyor Production

The dual conveyor is suitable for smaller and medium-width PCBs. Representative platform information describes PCB formats up to approximately 450 × 275 mm per lane.

Depending on the software and installed transport system, the dual conveyor may support:

  • Synchronous production on both lanes

  • Asynchronous production

  • The same product on two lanes

  • Different products on separate lanes

  • Reduced waiting time between PCB transfers

Single-Conveyor and Long-Board Production

Single-conveyor configurations support wider boards. With an applicable ASM Smart Transport Module or long-board system, the platform can process boards up to approximately 1,525 × 560 mm.

This long-board specification is an optional platform capability. It should not be assigned automatically to every SX2.

PCB Information Required Before Selection

  • Minimum PCB length and width

  • Maximum PCB or panel dimensions

  • PCB thickness

  • Maximum assembled-board weight

  • Single-lane or dual-lane requirement

  • Same or different product on each lane

  • Required PCB transport direction

  • Fixed conveyor-rail position

  • Required production-line height

  • PCB edge-clearance requirement

  • Long-board transport requirement

  • PCB support and warpage-control requirement

  • Communication interface with surrounding machines

Request photographs, measurements and a powered-on conveyor test before confirming the maximum PCB size of a used SX2.

Smart Vision and Process-Control Functions

The SIPLACE SX uses digital cameras, sensors and software-controlled correction to maintain placement reliability across a wide component spectrum.

Depending on machine generation and installed options, available functions may include:

  • Component presence detection

  • Vacuum monitoring during pickup and placement

  • Component position and rotation correction

  • PCB fiducial recognition

  • Automatic placement-height guidance

  • Pin-one detection

  • LED centering

  • Snap-in detection

  • High-resolution and 3D component inspection

  • PCB and on-board feature inspection

  • Automatic feeder-pitch recognition

  • Nozzle identification

  • Automatic nozzle-condition monitoring and cleaning

  • Barcode-controlled material verification

  • Process traceability and factory-software integration

Optional functions must be checked on the actual machine. The SX2 model designation alone does not confirm that every camera, sensor, software license or special process package is installed.

Small-Component Placement Requirements

A SpeedStar-equipped SX2 can process very small metric components, but reliable production requires the complete head, nozzle, feeder, software and process package.

A suitable setup may require:

  • Compatible CP20P2 SpeedStar placement head

  • High-resolution component camera

  • Correct micro-component nozzles

  • Compatible and calibrated 8 mm X feeders

  • Correct station and programming software

  • Stable feeder pickup-position calibration

  • Suitable carrier-tape pocket quality

  • Stable PCB clamping and support

  • Accurate solder-paste printing

  • Controlled factory temperature and humidity

When purchasing an SX2 specifically for very small components, request a representative pickup and placement test before shipment.

Typical SIPLACE SX2 Applications

The SX2 is particularly suitable for manufacturers whose product mix, order volume and component requirements change frequently.

  • Automotive electronic modules

  • Industrial automation equipment

  • Medical electronic assemblies

  • Telecommunications and network equipment

  • Power-electronics products

  • High-mix EMS manufacturing

  • New-product introduction and pilot production

  • Large and long PCB assembly

  • Connector and odd-shaped component placement

  • Mixed SMD and pin-in-paste assembly

  • Production lines with variable capacity requirements

  • Replacement or expansion of an existing SX line

ASM SIPLACE SX1 vs SX2

ComparisonSIPLACE SX1SIPLACE SX2
Placement gantries1 removable gantry2 removable gantries
Maximum benchmark speedUp to approximately 43,250 CPHUp to approximately 86,500 CPH
Maximum IPC speedUp to approximately 33,000 CPHUp to approximately 66,000 CPH
Maximum feeder positionsUp to 120 × 8 mm positionsUp to 120 × 8 mm positions
Head positionsOne configurable headTwo configurable heads
Typical positioningFlexible production, NPI and specialized placementHigher-capacity high-mix and mixed-head production
Capacity adjustmentCan receive or transfer a compatible gantryCan operate with or transfer removable gantries

The main difference between SX1 and SX2 is gantry quantity. Their actual component range, speed and production role depend on the placement heads installed on those gantries.

SIPLACE SX Is Not the Same as SIPLACE X S

The names SIPLACE SX and SIPLACE X S may look similar, but they identify different machine platforms.

ComparisonSIPLACE SXSIPLACE X S / XS
Main model namesSX1 and SX2X2 S, X3 S, X4 S and X4i S
Primary positioningFlexible high-mix production and Capacity on DemandMaximum high-volume placement performance
Gantry conceptRemovable and transferable gantriesTwo-, three- or four-gantry high-volume configurations
Main selection priorityProduct diversity, capacity adjustment and special componentsMaximum speed and volume-production performance
Correct series linkSIPLACE SX SeriesSIPLACE X S / XS Series

An SX2 should not be published using specifications from an X2 S. The complete machine nameplate must be checked because the model names are frequently confused in used-equipment listings.

Used ASM SIPLACE SX2 Inspection Checklist

A used SX2 should be evaluated as a complete modular placement system. A successful power-on test alone does not confirm that both gantries, heads, cameras and process options are ready for stable production.

1. Machine Identification

  • Complete SIPLACE SX2 model designation

  • Machine serial number

  • Manufacturing year

  • Total operating hours

  • Total placement counter

  • Original factory configuration

  • Current installed configuration

  • Station-software version

  • Programming-software compatibility

2. Gantry Identification

  • Number of installed gantries

  • Gantry identification and serial numbers

  • Head installed on each gantry

  • Gantry operating hours

  • Installation and transfer history

  • Gantry calibration records

  • Mechanical locking and rail condition

  • Communication and electrical connections

3. Linear-Axis and Motion Inspection

  • X-axis and Y-axis movement on both gantries

  • Noise and vibration during acceleration

  • Machine homing and reference operation

  • Linear motor and encoder condition

  • Axis-drive alarm history

  • Cable-chain and trailing-cable condition

  • Lubrication and guide condition

  • Gantry alignment and calibration

4. Placement-Head Inspection

  • Exact SpeedStar, MultiStar or TwinStar head model

  • Head serial number and operating hours

  • Placement counter

  • Nozzle-segment and sleeve wear

  • Z-axis and rotational-axis movement

  • Vacuum pressure and leakage

  • Component and force sensors

  • Nozzle changer operation

  • Special gripper operation where installed

  • Pickup and placement repeatability

5. Camera and Vision Inspection

  • Component camera on both gantries

  • High-resolution camera availability

  • PCB-camera image quality

  • Lighting-system operation

  • Component-shape recognition

  • Fiducial recognition

  • Pickup-position correction

  • Pin-top and 3D inspection where installed

  • Camera calibration status

6. Conveyor Inspection

  • Single or flexible dual conveyor

  • Synchronous and asynchronous operation

  • Automatic width adjustment

  • Conveyor belts and pulleys

  • PCB entrance and exit sensors

  • Board clamping and PCB support

  • Long-board transport module

  • Maximum measured PCB dimensions

  • Communication with surrounding equipment

7. Feeder and Component-Cart Inspection

  • Number of included component carts

  • Number and type of included feeders

  • Feeder tape-width combinations

  • Feeder indexing and pickup performance

  • Feeder firmware and machine compatibility

  • Cart docking and locking condition

  • Communication-unit operation

  • Reel holders and waste-tape containers

  • Automatic feeder-pitch detection

8. Tray and Special Component Supply

  • Tray changer or waffle-pack system

  • Bowl and vibratory feeder availability

  • Stick feeder availability

  • Third-party feeder interface

  • Special grippers and nozzles

  • OSC process-package availability

  • Snap-in detection

  • High-force placement function

9. Included Equipment

  • Station computers and monitors

  • Machine-software backups

  • Product and configuration files

  • Nozzles and nozzle magazines

  • Feeder carts and feeders

  • Tray and special component-supply equipment

  • Transformer or voltage-conversion equipment

  • Operating and maintenance manuals

  • Calibration tools

  • Included spare parts

A complete inspection video should show machine startup, homing, operation of both gantries, every installed placement head, feeder pickup, component recognition, nozzle changing, PCB transport and an actual placement program.

Common SIPLACE SX2 Maintenance Areas

The modular SX platform requires preventive maintenance of both the base machine and every installed gantry.

  • SpeedStar placement-head segments

  • MultiStar head assemblies

  • TwinStar Z-axis and rotational assemblies

  • Nozzle sleeves and nozzle holders

  • Nozzles and automatic nozzle changers

  • Vacuum valves, generators and filters

  • Placement-force and component sensors

  • Component cameras and lighting modules

  • PCB camera and fiducial lighting

  • Linear motors and encoders

  • Axis drives and control boards

  • Gantry mounting rails and locking systems

  • Trailing cables and cable chains

  • Cooling fans and machine filters

  • Conveyor belts, pulleys and sensors

  • PCB support and long-board transport systems

  • Component-cart docking interfaces

  • SIPLACE X feeder modules

  • Station computers and storage devices

Recommended maintenance includes placement-head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, axis inspection, conveyor adjustment, filter replacement and verification of machine-software backups.

Who Should Consider a Used SIPLACE SX2?

A used SX2 may be suitable for manufacturers that need flexible placement capacity and already operate, or plan to operate, an SX-based high-mix production line.

The machine may be practical when:

  • Product volumes change frequently

  • The factory produces many PCB variants

  • Two placement gantries provide the required capacity

  • The PCB contains both small and large components

  • Odd-shaped or high-force placement is required

  • The factory already owns compatible SIPLACE X feeders

  • An existing SX1 must be expanded to an SX2 configuration

  • A damaged SX2 must be replaced without redesigning the line

  • Existing technicians understand SIPLACE SX operation

  • A used-equipment investment is preferred over a new platform

A newer machine may be more suitable when the project requires a current manufacturer warranty, the latest factory-software environment or process functions not installed on the available used SX2.

Information Required for an SX2 Quotation

  • Required SX1 or SX2 configuration

  • Required number of gantries

  • Preferred manufacturing year

  • Preferred machine condition

  • Required SpeedStar, MultiStar or TwinStar head combination

  • Target production output

  • Minimum component package

  • Maximum component dimensions

  • Maximum component height and weight

  • Odd-shaped component requirement

  • Required placement force

  • PCB dimensions and thickness

  • Single- or dual-conveyor requirement

  • Long-board transport requirement

  • Required feeder quantities and tape widths

  • Tray, bowl or stick feeder requirement

  • Existing SIPLACE equipment and feeder inventory

  • Factory voltage and frequency

  • Compressed-air availability

  • Destination country

  • Required delivery schedule

For special components, provide the component drawing, dimensions, weight, pickup-surface photograph, feeder presentation and required insertion or placement force.

Frequently Asked Questions

What is the ASM SIPLACE SX2 used for?

The SX2 is a two-gantry flexible SMT placement machine used for high-mix production, high-speed chip placement and assembly of ICs, connectors and selected odd-shaped components.

How many gantries does the SIPLACE SX2 have?

The SX2 normally has two removable placement gantries. An SX base machine operating with one gantry is identified as an SX1 configuration.

What is the placement speed of the SIPLACE SX2?

A high-speed SX2 with two SpeedStar heads provides up to approximately 86,500 CPH SIPLACE benchmark performance and 66,000 CPH IPC performance.

Is 86,500 CPH the actual speed of every SX2?

No. The 86,500 CPH value applies to a representative two-SpeedStar configuration. MultiStar, TwinStar and mixed-head configurations have different performance.

Which placement heads can be installed on an SX2?

Common head options include SpeedStar CP20P2 for high speed, MultiStar CPP for flexible mixed-component production and TwinStar TH for large or odd-shaped components.

What component sizes can the SX2 process?

The complete platform spectrum extends from approximately 0201 metric to selected components around 200 × 125 × 50 mm. The actual range depends on the two installed heads and tooling.

How many feeders can be installed?

The platform supports up to 120 positions for standard 8 mm feeders. Some flexible or special-component configurations may provide fewer feeder positions.

Can the SX2 process long PCBs?

Yes. Machines equipped with the appropriate Smart Transport Module or long-board system can process boards up to approximately 1,525 × 560 mm.

Does the SX2 support dual-lane production?

Yes. The flexible dual conveyor can support synchronous and asynchronous PCB transport, depending on the installed configuration and software.

Can the SX2 place odd-shaped components?

Yes. TwinStar and OSC package configurations can support large, heavy, tall and odd-shaped components with special tooling, vision, snap-in detection and controlled placement force.

What is Capacity on Demand?

Capacity on Demand refers to the removable SX gantry concept. Compatible gantries can be added, removed or transferred between SX lines to adjust placement capacity.

Is the SIPLACE SX2 the same as the SIPLACE X2 S?

No. SX2 belongs to the flexible SIPLACE SX platform. X2 S belongs to the separate high-volume SIPLACE X-Series S platform.

Are feeders included with a used SX2?

Not automatically. Feeders, component carts, nozzles, tray systems and spare parts may be included or quoted separately. Every included item should be listed clearly.

What should be tested before purchasing a used SX2?

Test both gantries, every installed placement head, cameras, sensors, nozzle changers, conveyor, feeders, component carts, station computers and all required special process functions.

Request ASM SIPLACE SX2 Availability

Send your required head configuration, PCB dimensions, component range, target output, feeder requirement, conveyor type and destination country. GEEKVALUE will check available ASM SIPLACE SX2 machines and confirm the serial number, manufacturing year, installed gantries, placement heads, conveyor, software, included accessories, inspection scope and delivery arrangement.

View the complete ASM SIPLACE SX Series placement machine range, or explore compatible SIPLACE X feeders, placement heads and SMT nozzles.

Request a Quote

Send Your Part Number, Photo or Machine Model

If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.

Get Quote