Used Siemens SIPLACE HS50 chip mounter with four 12-nozzle heads, up to 50,000 CPH and 144 feeder tracks.
The Siemens SIPLACE HS50 SMT placement machine is a high-speed chip mounter developed for volume PCB assembly involving large quantities of small and medium-sized surface-mount components. Its four-gantry architecture and four 12-nozzle rotary placement heads provide benchmark placement performance of up to 50,000 components per hour.
GEEKVALUE supplies available used, inspected and refurbished SIPLACE HS50 machines according to the required conveyor format, placement-head condition, feeder package, software version and production application. Since the HS50 is a legacy SIPLACE platform, every quotation should be based on the actual machine serial number, manufacturing year, operating hours and installed configuration.
The SIPLACE HS50 was designed primarily as a high-speed component-placement module. It is commonly used to place resistors, capacitors, diodes, transistors, small integrated circuits and other tape-fed SMD components before larger or more complex parts are processed by a flexible placement machine.
Four independently controlled gantries operate within the machine. Each gantry is normally equipped with a 12-nozzle rotary Collect & Place head. This arrangement distributes the placement workload across four heads and reduces unnecessary movement between the feeder tables and PCB placement area.
Benchmark placement performance of up to 50,000 CPH
Four independently operating placement gantries
Four 12-nozzle rotary Collect & Place heads
Component range from approximately 0.6 × 0.3 mm to 18.7 × 18.7 mm
Up to 144 positions for 8 mm tape feeders
Up to four quick-change feeder tables or trolleys
Automatic component recognition and PCB position correction
Suitable for high-volume small-component placement
| Specification | Typical SIPLACE HS50 Configuration |
|---|---|
| Machine type | High-speed SMT chip placement machine |
| Benchmark placement rate | Up to 50,000 components per hour |
| Number of gantries | 4 |
| Placement heads | 4 × 12-nozzle rotary Collect & Place heads |
| Total nozzle positions | 48 across four placement heads |
| Component range | Approximately 0.6 × 0.3 mm to 18.7 × 18.7 mm |
| Placement accuracy | Approximately ±0.075 mm at 4 sigma, depending on machine condition and configuration |
| Feeder capacity | Up to 144 tracks for 8 mm tape feeders |
| Feeder tables | Up to four removable feeder tables or setup trolleys |
| PCB handling | Single-lane or application-specific transport, depending on installed configuration |
| Long-board support | Available on machines equipped with the relevant conveyor and long-board option |
| Component supply | Tape feeders and other compatible legacy SIPLACE component-supply systems |
| Typical application | High-volume placement of small and medium SMD components |
| Machine condition | Used, inspected or refurbished, subject to actual availability |
Configuration notice: The specifications above describe common SIPLACE HS50 machines. Conveyor dimensions, feeder compatibility, voltage, operating software, PCB capacity and installed options can vary according to machine year and previous production configuration. Final matching must be based on the actual machine label and inspection results.
The HS50 uses four separately controlled gantries to divide the placement program into multiple operating sequences. Each gantry collects components from its assigned feeder area and places them within an optimized section of the PCB.
When the component program and feeder positions are correctly balanced, the four-gantry design reduces head travel and helps maintain efficient placement cycles. The production software assigns components to the individual gantries according to feeder position, placement coordinates, nozzle requirements and estimated cycle time.
A poorly balanced program may cause one gantry to complete significantly more placements than the others. The remaining gantries then wait for the busiest head, reducing the total output of the machine. Production planning should therefore include both feeder optimization and placement-load balancing.
Number of components placed on each PCB
Distribution of placements between the four gantries
Distance between feeder locations and PCB coordinates
Number of different nozzle types required
Component pickup and inspection time
PCB size and panel arrangement
Conveyor loading and unloading time
Component rejection and pickup retry rates
Placement-head and feeder condition
Production-program optimization
The 50,000 CPH specification should therefore be treated as a benchmark value rather than a guaranteed production rate for every PCB. A realistic output estimate should be calculated from the actual board program, BOM and feeder arrangement.
Each HS50 gantry is normally fitted with a rotary placement head containing twelve nozzle positions. The head collects a group of components from the feeder table, inspects them with the component-vision system, corrects their position and rotation, and then places them onto the stationary PCB.
This Collect & Place principle allows the machine to process multiple components during one head cycle instead of returning to the feeder after every individual placement.
Multiple components can be collected during one operating sequence
Component position and rotation are checked before placement
Pickup offsets can be corrected by the vision system
Missing or incorrectly collected components can be detected
Shorter travel paths support high-speed production
Different nozzles can be installed for compatible component packages
The condition of all four placement heads should be evaluated before purchasing a used HS50. A machine may still power on even when one head has excessive nozzle-sleeve wear, vacuum leakage, unstable rotation or poor camera recognition.
The standard HS50 component range extends from approximately 0.6 × 0.3 mm components to devices measuring about 18.7 × 18.7 mm. The actual supported package depends on component height, nozzle availability, feeder type, vision settings and machine software.
Typical components processed by the HS50 include:
Chip resistors
Multilayer ceramic capacitors
Small diodes
SOT transistors
Resistor and capacitor arrays
Small-outline integrated circuits
Selected CSP and BGA packages within the supported size range
Small QFP and PLCC packages
LED and communication-board components
Other standard tape-fed SMD devices
Although the HS50 can process several package types, it remains primarily a high-speed chip mounter. Large connectors, tall components, heavy devices and irregular mechanical parts are normally assigned to a flexible placement machine with a suitable Pick & Place or specialty head.
A fully configured SIPLACE HS50 can provide up to 144 tracks for standard 8 mm tape feeders. The machine commonly uses four removable feeder tables or setup trolleys, allowing feeders to be prepared away from the production line before a product changeover.
The maximum 144-track figure applies when the feeder area is calculated using 8 mm tape positions. Wider feeders occupy multiple tracks, so the total number of physical feeders decreases when the production requires 12 mm, 16 mm, 24 mm or wider component tapes.
Number of feeder tables supplied with the machine
Number of included 8 mm feeders
Required quantities of wider tape feeders
Feeder model and generation
Compatibility with the installed feeder interface
Feeder calibration and maintenance condition
Condition of trolley wheels, locks and electrical connectors
Availability of reel holders and waste-tape containers
Spare feeder requirements
Feeders should not be assumed to be included with every used HS50. The quotation should separately identify the machine, feeder tables, tape feeders, nozzles, computer, transformer and spare parts.
The PCB transport configuration is one of the most important details to verify on a legacy HS50. Available machines may differ in rail arrangement, conveyor direction, fixed-rail position, PCB width capacity and installed long-board options.
Some used machines were originally configured for relatively narrow boards, while others were equipped for wider panels or longer PCBs. The model name “HS50” alone does not confirm the maximum board dimensions of a specific machine.
Minimum PCB length and width
Maximum PCB or panel dimensions
PCB thickness
Maximum assembled board weight
Required transport direction
Front-rail or rear-rail fixed configuration
Required production-line height
Upstream and downstream machine interfaces
Need for long-board production
Available edge clearance for board clamping
Before confirming an order, request photographs and measurements of the actual conveyor. A powered-on conveyor test should demonstrate PCB entry, board detection, width adjustment, clamping, release and transfer to the next machine.
The same legacy placement platform may be advertised under several names, including:
Siemens SIPLACE HS50
Siemens Dematic SIPLACE HS50
ASM SIPLACE HS50
SIPLACE HS-50
HS50 SMT chip mounter
Many HS50 machines were manufactured before the current ASM branding was used. The machine nameplate may therefore display Siemens or Siemens Dematic rather than ASM.
Model matching should be based on the complete machine nameplate, serial number, manufacturing year, software version, head configuration and conveyor arrangement instead of only the brand wording used in a sales listing.
| Comparison | SIPLACE HS50 | SIPLACE HS60 |
|---|---|---|
| Primary machine role | High-speed SMT chip placement | Higher-output SMT chip placement |
| Benchmark placement rate | Up to 50,000 CPH | Up to 60,000 CPH |
| Typical gantry configuration | 4 gantries | 4 gantries |
| Typical placement-head configuration | 4 × 12-nozzle rotary heads | 4 × 12-nozzle rotary heads |
| Maximum 8 mm feeder tracks | Up to 144 | Up to 144 |
| Selection priority | Lower acquisition cost and compatibility with existing HS50 lines | Higher benchmark placement output |
The HS60 provides a higher benchmark placement rate, but this does not automatically make it the better machine for every factory. A well-maintained HS50 with compatible feeders, software and spare-parts support may be more practical than an HS60 that requires extensive reconfiguration.
Customers should compare the actual machine condition, head hours, conveyor configuration, feeder package, software compatibility and available technical support rather than selecting only by the nominal CPH value.
The HS50 is commonly used as the high-speed placement section of a complete SMT line. It installs small and medium components before a flexible mounter processes larger ICs, connectors and special devices.
A typical line arrangement may include:
PCB loader
Solder paste printer
3D solder paste inspection system
Siemens SIPLACE HS50 high-speed mounter
Flexible SIPLACE placement machine
Reflow oven
Automatic optical inspection system
PCB unloader
The total production output is determined by the slowest process in the line. Adding an HS50 will not improve overall throughput when the printer, flexible mounter, reflow oven or inspection system remains the main bottleneck.
Before adding a used HS50 to an existing line, confirm mechanical line height, PCB flow direction, communication signals, feeder compatibility, production-software integration and available floor space.
A used HS50 should be evaluated as a complete production system. Machine age alone does not determine condition. Operating hours, placement counter, maintenance history, storage environment and previous production application can have a greater effect on reliability.
Complete machine model
Machine serial number
Manufacturing year
Total operating hours
Total placement counter
Original factory configuration
Current installed configuration
Software and station-computer version
Movement of all four gantries
X-axis and Y-axis noise
Gantry vibration during acceleration
Motor and encoder condition
Axis-drive alarm history
Ribbon cable and cable-chain condition
Machine homing and reference operation
Lubrication and guide-rail condition
Condition of all four 12-nozzle heads
Individual head placement counters
Nozzle-sleeve wear
Star rotation stability
Z-axis movement
Rotational-axis movement
Vacuum pressure and leakage
Pickup and placement repeatability
Component-camera image quality
Nozzle changer operation
PCB camera condition
Component camera condition on each gantry
Lighting stability
Fiducial recognition
Component-position correction
Camera communication alarms
Image calibration status
Conveyor rail movement
Automatic width adjustment
Belt and pulley condition
PCB entrance and exit sensors
Board clamping
Board support system
Fixed-rail position
Transport direction
Communication with surrounding machines
Number of feeder tables
Included feeder quantities
Feeder tape widths
Feeder pickup performance
Feeder-table locking mechanism
Nozzle types and quantities
Station computer and monitor
Software backup files
Operating manuals
Transformer and electrical accessories
Included spare parts
A complete inspection video should show machine startup, homing, movement of all four gantries, rotation of all four heads, feeder pickup, component recognition, PCB transport and a sample placement program.
Long-term operation of a legacy HS50 depends on preventive maintenance and access to compatible replacement parts. Components that commonly require inspection or service include:
Placement-head nozzle sleeves
Nozzles and nozzle holders
Vacuum valves and pneumatic components
Head rotation mechanisms
Component cameras and lighting units
PCB camera and fiducial lighting
Axis motors and encoders
Motor-drive modules
Flat ribbon cables
Machine sensors
Conveyor belts and pulleys
Station computer and storage devices
Control boards and power supplies
Feeder-table connectors
Preventive maintenance should include head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, conveyor adjustment, cable inspection and verification of software backups.
A used HS50 can be a practical solution for manufacturers that already operate legacy SIPLACE equipment and need additional small-component placement capacity without replacing the complete production line.
The machine may be suitable when:
The PCB contains a high number of small SMD components
The factory already owns compatible SIPLACE feeders
Existing technicians understand legacy SIPLACE operation
Replacement parts and repair support are available
The production line requires additional chip-placement capacity
A lower equipment investment is preferred
The existing software environment supports the machine
A newer SMT placement platform may be more suitable when the factory requires advanced traceability, very small metric components, higher placement accuracy, lower energy consumption, modern MES integration or long-term manufacturer lifecycle support.
Provide the following information so that the available machine can be matched to your production requirements:
Required machine quantity
Preferred machine year
Maximum PCB dimensions
Minimum PCB dimensions
Smallest component package
Largest component package
Target production output
Required feeder quantities
Required feeder tape widths
Existing SIPLACE machine models
Existing feeder models
Required conveyor direction
Factory voltage and frequency
Destination country
Required delivery schedule
Customers who are not certain whether the HS50 is suitable may provide a PCB BOM, placement file, board dimensions and target cycle time for preliminary equipment matching.
The HS50 has a benchmark placement performance of up to 50,000 components per hour. Actual production output depends on the PCB program, component distribution, feeder locations, head condition, conveyor timing and program optimization.
A common HS50 configuration has four gantries and four 12-nozzle rotary placement heads, providing a total of 48 nozzle positions across the machine.
The typical component range is approximately 0.6 × 0.3 mm to 18.7 × 18.7 mm. Actual compatibility also depends on component height, nozzle selection, feeder type, camera configuration and machine software.
The machine can provide up to 144 tracks for 8 mm tape feeders with the appropriate four-table configuration. Wider tape feeders occupy multiple track positions and reduce the total number of installed feeders.
PCB capacity depends on the installed conveyor and whether the machine has a long-board option. The maximum PCB dimensions should be verified by measuring and testing the actual machine before purchase.
The HS50 is mainly a high-speed chip mounter for small and medium components. Large connectors, tall parts and complex odd-shaped devices are normally assigned to a flexible placement machine.
The main published difference is benchmark placement output: up to 50,000 CPH for the HS50 and up to 60,000 CPH for the HS60. Both may use four gantries and four 12-nozzle heads, but actual machine condition and installed options remain important.
Not automatically. Feeders, feeder tables, nozzles, computers and spare parts may be included or quoted separately. Every accessory should be listed clearly in the quotation.
Test all four gantries, all placement heads, component cameras, PCB camera, vacuum system, nozzle changer, conveyor, feeder interfaces, station computer and machine communication. A powered-on placement test is strongly recommended.
It may be possible when the conveyor direction, line height, feeder system, software version, electrical requirements and machine communication are compatible. The complete line configuration should be reviewed before installation.
Send your required PCB size, component range, target output, feeder requirement, existing SIPLACE configuration and destination country. GEEKVALUE will check available Siemens SIPLACE HS50 machines and confirm the serial number, manufacturing year, head configuration, conveyor format, included accessories, inspection scope and delivery arrangement.
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