The Siemens SIPLACE F5 HM SMT placement machine is a flexible placement system developed for large integrated circuits, fine-pitch packages, flip chips, bare dies and odd-shaped components. Unlike a dedicated high-speed chip mounter, the F5 HM combines a
The Siemens SIPLACE F5 HM SMT placement machine is a flexible placement system developed for large integrated circuits, fine-pitch packages, flip chips, bare dies and odd-shaped components. Unlike a dedicated high-speed chip mounter, the F5 HM combines a high-speed Collect & Place head with a high-accuracy Pick & Place head on one X/Y gantry.
This head combination allows the machine to process both standard tape-fed SMD components and complex devices that require higher placement accuracy, programmable placement force, special nozzles, grippers or tray-based component supply. It can operate as a standalone placement machine or as the flexible end-of-line mounter in a complete legacy SIPLACE production line.
GEEKVALUE supplies available used, inspected and refurbished SIPLACE F5 HM machines according to the installed head configuration, conveyor type, feeder tables, tray system, software version and production requirements. Because individual machines may have different options, the complete machine label and installed hardware must be confirmed before quotation.
The SIPLACE F5 HM was designed to combine placement flexibility, component-range coverage and high-accuracy processing in one machine. Its single X/Y gantry carries two separate placement heads with different operating characteristics.
One side of the gantry is equipped with either a 12-nozzle or 6-nozzle Collect & Place head. The other side carries a Pick & Place head for large, delicate, fine-pitch or irregular components.
One X/Y placement gantry
Two placement heads on the same gantry
Choice of 12-nozzle or 6-nozzle Collect & Place head
Dedicated high-accuracy Pick & Place head
Component range from approximately 0.6 × 0.3 mm to 55 × 55 mm
Support for selected components with an edge length up to approximately 92 mm
Maximum component height up to approximately 20 mm with the Pick & Place head
Up to 118 tracks for 8 mm tape feeders
Single-conveyor and dual-conveyor configurations
Optional Flip Chip, Bare Die and odd-shaped component capabilities
| Specification | Typical SIPLACE F5 HM Configuration |
|---|---|
| Machine type | Flexible and high-accuracy SMT placement machine |
| Number of gantries | 1 X/Y gantry |
| Head configuration | 12-nozzle or 6-nozzle Collect & Place head plus Pick & Place head |
| 12-nozzle head speed | Up to 11,000 CPH benchmark performance |
| 6-nozzle head speed | Up to 8,500 CPH benchmark performance |
| Pick & Place head speed | Up to 1,800 CPH benchmark performance |
| Overall component range | Approximately 0.6 × 0.3 mm to 55 × 55 mm, depending on installed head and vision module |
| Maximum component height | Up to approximately 20 mm with the Pick & Place head |
| Maximum component weight | Up to approximately 25 g with the Pick & Place head |
| Best specified placement accuracy | Up to ±40 μm at 4 sigma with the Pick & Place Head and Flip Chip vision option |
| Single-conveyor PCB size | Approximately 50 × 50 mm to 508 × 460 mm |
| Optional long-board length | Up to approximately 610 mm |
| Dual-conveyor PCB size | Approximately 50 × 50 mm to 460 × 216 mm per lane |
| Feeder capacity | Up to 118 tracks for 8 mm tape feeders |
| Component supply | Tape, bulk-case, stick, manual tray, waffle-pack and application-specific feeders |
| Operating system | Microsoft Windows and RMOS, depending on machine generation |
| Rated power | Approximately 1.9 kW |
| Compressed air | Approximately 5.5–10 bar and 300 Nl/min |
| Typical production role | Flexible placement of ICs, fine-pitch packages, flip chips, bare dies and odd-shaped components |
Configuration notice: The values above describe common factory configurations. Actual component range, accuracy, PCB capacity and placement performance depend on the installed heads, vision modules, nozzles, grippers, conveyor and software options. Final matching must be based on the actual machine configuration.
The SIPLACE F5 HM should not be evaluated in the same way as a dedicated high-speed chip mounter. Machines such as the SIPLACE HS50 and HS60 focus primarily on placing a large number of small components. The F5 HM is designed to complete components that require more flexibility, accuracy or specialized handling.
Its main advantage is the ability to combine two placement principles within one machine:
Collect & Place: Multiple components are collected, inspected and placed during one operating sequence.
Pick & Place: Components are collected and placed individually with higher control over force, rotation and component handling.
This combination allows the F5 HM to process both production-volume SMD packages and demanding components that may not be suitable for a conventional rotary placement head.
The installed head configuration is the most important detail to confirm when purchasing a used SIPLACE F5 HM. Machines with the same model name may have different component ranges and placement capabilities.
The 12-nozzle Collect & Place head is intended for relatively small components and higher placement output. Twelve vacuum nozzles are arranged around a rotating head assembly.
During operation, the head collects several components from the feeder table, moves them through the component-vision system and places them onto the stationary PCB.
| Component range | Approximately 0.6 × 0.3 mm to 18.7 × 18.7 mm |
|---|---|
| Maximum component height | Approximately 6 mm |
| Maximum component weight | Approximately 2 g |
| Benchmark placement rate | Up to 11,000 CPH |
| Placement accuracy | Approximately ±90 μm at 4 sigma |
| Programmable placement force | Approximately 2.4–5.0 N |
This configuration is suitable when the machine must place a combination of small passive components, small IC packages and standard tape-fed SMD devices.
The 6-nozzle Collect & Place head is intended for larger components while retaining a multi-nozzle collection principle. It is particularly relevant for PLCC, QFP and other medium-sized IC packages.
| Standard component range | Approximately 1.6 × 0.8 mm to 32 × 32 mm |
|---|---|
| Maximum component height | Approximately 8.5 mm |
| Maximum component weight | Approximately 5 g |
| Benchmark placement rate | Up to 8,500 CPH |
| Standard placement accuracy | Approximately ±70 μm at 4 sigma |
| Programmable placement force | Approximately 2.4–5.0 N |
The 6-nozzle head can also be equipped with a DCA vision module. In this configuration, it can process selected components from approximately 0.6 × 0.3 mm to 13 × 13 mm and achieve accuracy of approximately ±60 μm at 4 sigma.
The DCA configuration was developed for applications such as high-speed Flip Chip and Bare Die placement. However, the presence of a 6-nozzle head does not automatically mean the machine includes the DCA vision package.
The Pick & Place head handles larger, heavier, delicate or irregular components individually. It provides programmable placement force, high rotational resolution and compatibility with special nozzles and mechanical grippers.
| Standard component range | Approximately 1.6 × 0.8 mm to 55 × 55 mm |
|---|---|
| Maximum specified edge length | Up to approximately 92 mm for selected components |
| Maximum component height | Approximately 20 mm |
| Maximum component weight | Approximately 25 g |
| Benchmark placement rate | Up to 1,800 CPH |
| Standard placement accuracy | Approximately ±50 μm at 4 sigma |
| Flip Chip placement accuracy | Approximately ±40 μm at 4 sigma with the FC vision package |
| Programmable placement force | Approximately 1–10 N |
The Pick & Place head may use vacuum nozzles, component-specific tooling or grippers. A gripper can handle selected parts that do not have a suitable flat surface for vacuum pickup.
The F5 HM can be configured with either a 6-nozzle or 12-nozzle Collect & Place head, but changing between these head types is not a simple operator-level adjustment.
A head conversion may require:
The correct replacement placement head
A compatible head-reconfiguration kit
A matching automatic nozzle changer
Station-software reconfiguration
Mechanical and optical recalibration
Work by a trained SIPLACE technician
For this reason, customers should select a machine that already has the required head configuration whenever possible. The quotation should show clear internal photographs of both installed heads and their identification labels.
During placement, both the PCB and component feeder tables remain stationary. The conveyor moves the PCB into the placement area, where the board is positioned and recognized by the PCB camera.
While the PCB is entering the machine, the Collect & Place head can begin collecting components. Once the PCB position has been confirmed, the head moves to the board and completes its assigned placements. The Pick & Place head then processes the large, fine-pitch or special components assigned to it.
This operating principle provides several practical advantages:
The PCB remains fixed during component placement
Feeder pickup positions remain stable
Components can be optically inspected before placement
Tapes can be spliced while the machine continues operating
Feeders can be refilled without moving the component table
Large and small components can be processed in the same machine
A common SIPLACE F5 HM configuration provides up to 118 tracks for 8 mm tape feeders. The machine has stationary component-supply areas on both sides.
The left side normally includes a quick-change component table. Depending on the machine configuration, the right side may contain:
A second quick-change feeder table
A narrow feeder table with a Waffle Pack Changer
Manual tray locations
Application-specific component-supply equipment
The maximum feeder count is affected by tape width. Wider feeders occupy more than one 8 mm track, so the actual number of feeder units depends on the component BOM.
8 mm, 12 mm, 16 mm and wider tape feeders
Bulk-case feeders
Stick magazine feeders
Manual JEDEC tray locations
Waffle Pack Changer
Surf Tape feeder for selected bare dies
Application-specific OEM feeders
Before ordering a used machine, confirm whether the component tables, feeders, tray system, reel holders and waste-tape containers are included. These items should be listed separately in the quotation.
The SIPLACE F5 HM can be supplied with different conveyor arrangements. A common single-conveyor machine supports PCBs from approximately 50 × 50 mm to 508 × 460 mm. Machines equipped with the relevant long-board option may support PCB lengths up to approximately 610 mm.
A common dual-conveyor configuration supports PCB sizes from approximately 50 × 50 mm to 460 × 216 mm per lane.
The actual conveyor must be inspected because legacy machines may have been modified or configured for a particular production line.
Minimum and maximum PCB length
Minimum and maximum PCB width
PCB thickness
Maximum assembled-board weight
Single-conveyor or dual-conveyor production
Transport direction
Fixed conveyor-rail position
Production-line height
Edge clearance for board clamping
Long-board option requirement
The F5 HM can be configured for Flip Chip and Bare Die applications, but these capabilities depend on optional hardware and software. They should never be assumed from the machine model alone.
The DCA package uses an alternative vision module with the 6-nozzle Collect & Place head. It was developed for smaller dies and fine-pitch components requiring higher recognition accuracy.
A DCA-equipped head can achieve approximately ±60 μm accuracy at 4 sigma and process selected Flip Chips with bump pitches down to approximately 200 μm.
The Pick & Place head can be equipped with a higher-resolution Flip Chip vision module. In this configuration, specified placement accuracy reaches approximately ±40 μm at 4 sigma.
The FC configuration supports selected components from approximately 1 × 1 mm to 20 × 20 mm, subject to bump layout, component definition, tooling and vision conditions.
Some F5 HM machines may include an integrated flux dispenser near the Pick & Place head. The dispenser applies a controlled amount of low-viscosity flux to the placement position before a Flip Chip is installed.
Because this is an optional system, customers requiring flux dispensing should verify:
Whether the dispenser is physically installed
Controller and software condition
Injector and dispensing-needle condition
Flux reservoir condition
Position calibration
Available spare and consumable parts
The Pick & Place head can process selected odd-shaped components through special nozzles or mechanical grippers. This may include components that cannot be handled reliably by a standard vacuum nozzle.
Possible applications include:
Large connectors
Coils and inductive components
Mechanical electronic devices
Selected sockets and switches
Components with an irregular upper surface
Components supplied in trays or waffle packs
Large fine-pitch IC packages
Selected bare dies and Flip Chips
Every odd-shaped component should be evaluated individually. Component dimensions alone are not sufficient to confirm compatibility. Weight, center of gravity, pickup surface, lead shape, required force, feeder presentation and nozzle design must also be considered.
The Siemens SIPLACE F5 HM is primarily suitable for flexible and precision placement tasks rather than maximum small-component output.
Industrial control PCB assembly
Automotive electronic modules
Telecommunications equipment
Medical electronic assemblies
Large IC and fine-pitch package placement
Flip Chip and Bare Die projects
Mixed-component PCB production
High-mix, lower-volume manufacturing
Legacy SIPLACE line expansion
End-of-line flexible placement
The F5 HM was often used together with high-speed SIPLACE machines. In this line arrangement, the machines perform different production roles.
| Machine | Primary Role | Typical Component Assignment |
|---|---|---|
| SIPLACE HS50 | High-speed chip placement | Small passive components and standard small SMD packages |
| SIPLACE HS60 | Higher-output chip placement | Large quantities of small and medium tape-fed components |
| SIPLACE F5 HM | Flexible and high-accuracy placement | Large ICs, fine-pitch devices, trays, Flip Chips and odd-shaped components |
A typical line may use one or more HS50 or HS60 machines for small-component placement, followed by an F5 HM for the remaining complex components.
The line must be balanced according to the actual PCB program. An F5 HM can become the bottleneck when the PCB contains a large number of individually placed components handled by the slower Pick & Place head.
A used F5 HM should be inspected according to its intended production application. A basic power-on test is not sufficient when the project requires high-accuracy IC, Flip Chip or odd-shaped component placement.
Complete machine model
Serial number
Manufacturing year
Total operating hours
Total placement counter
Original and current configuration
Station-computer version
RMOS and machine-software version
12-nozzle or 6-nozzle Collect & Place head
Pick & Place head identification
DCA vision module availability
Flip Chip vision module availability
Head placement counters
Head maintenance and repair history
Nozzle changer type and capacity
X-axis and Y-axis movement
Gantry noise and vibration
Motor and encoder condition
Reference and homing operation
Cable and cable-chain condition
Axis-drive alarm history
Guide and lubrication condition
Nozzle-segment rotation
Nozzle-sleeve wear
Z-axis movement
Vacuum pressure and leakage
Nozzle changer operation
Component pickup stability
Vision and rejection functions
Placement repeatability
Z-axis and D-axis operation
Rotational-position accuracy
Vacuum and gripper operation
Programmable placement-force control
Nozzle changer operation
Component-camera condition
Special nozzle availability
Sample large-component placement
PCB camera condition
Component vision for both heads
Lighting modules
Fiducial recognition
Package-definition recognition
Pickup-position correction
Camera calibration
PCB entry and exit
Automatic width adjustment
Conveyor belts and pulleys
Board sensors
PCB clamping and support
Single- or dual-conveyor operation
Long-board operation where required
Communication with surrounding equipment
Left and right component-table configuration
Number of included tape feeders
Waffle Pack Changer condition
Manual tray configuration
Stick and bulk feeder availability
Feeder-table locks and connectors
Reel-holder and scrap-bin condition
The inspection video should show machine startup, homing, both placement heads, component recognition, feeder pickup, nozzle changing, PCB transport and a sample placement program.
Long-term operation depends on preventive maintenance and access to legacy SIPLACE spare parts. Important service areas include:
Collect & Place head segments
Nozzle sleeves and nozzle holders
Pick & Place head Z- and D-axis assemblies
Nozzles and special grippers
Vacuum valves and pneumatic components
Component cameras and lighting modules
PCB camera and fiducial lighting
X/Y motors and encoders
Axis drives and control boards
Ribbon cables and machine wiring
Conveyor belts and sensors
Feeder-table electrical interfaces
Station computer and storage devices
Waffle Pack Changer and tray-handling components
Preventive maintenance should include head cleaning, nozzle inspection, vacuum testing, camera calibration, axis inspection, conveyor adjustment, feeder calibration and software backup verification.
A used SIPLACE F5 HM may be suitable for factories that already operate legacy SIPLACE equipment and need additional flexible placement capability.
The machine may be a practical option when:
The PCB contains large or fine-pitch IC packages
Components are supplied in both tape and tray formats
Odd-shaped components require special tooling
The factory already owns compatible SIPLACE feeders
Existing technicians understand legacy SIPLACE systems
Replacement heads and spare parts remain available
The machine will be integrated with an HS50, HS60 or another legacy platform
The investment budget does not support a newer flexible mounter
A newer placement platform may be more suitable when the project requires current factory-software integration, modern traceability, very high line output, lower energy consumption or long-term manufacturer lifecycle support.
Provide the following information so that the machine configuration can be matched to your application:
Required machine quantity
Preferred machine condition
Required 6-nozzle or 12-nozzle Collect & Place head
Need for DCA or Flip Chip vision
Minimum and maximum component size
Maximum component height and weight
Component package types
Required placement accuracy
PCB dimensions and thickness
Single- or dual-conveyor requirement
Required tape-feeder quantities
Need for trays or Waffle Pack Changer
Need for special nozzles or grippers
Current SIPLACE line configuration
Factory voltage and compressed-air supply
Destination country
Required delivery schedule
For unusual components, send the component drawing, package dimensions, weight, pickup-surface image, feeder presentation and required placement force for preliminary evaluation.
The SIPLACE F5 HM is mainly used for flexible placement of large ICs, fine-pitch packages, Flip Chips, Bare Dies, tray-fed parts and odd-shaped components. It is often positioned after a high-speed chip mounter in a complete SMT line.
The F5 HM has one X/Y gantry. The gantry carries two placement heads: a 6-nozzle or 12-nozzle Collect & Place head and a high-accuracy Pick & Place head.
The benchmark rate is up to 11,000 CPH for the 12-nozzle head, 8,500 CPH for the 6-nozzle head and 1,800 CPH for the Pick & Place head. Actual machine output depends on the component mix and board program.
A 12-nozzle head can process components down to approximately 0.6 × 0.3 mm when properly configured. A suitable 0201 kit, nozzle, feeder, vision setup and machine condition may be required.
The standard Pick & Place head supports components up to approximately 55 × 55 mm, with selected component geometries having an edge length of up to approximately 92 mm. Component weight, height and tooling must also be checked.
Yes, but Flip Chip capability requires the appropriate DCA or FC vision package, compatible head, nozzle, feeder and software configuration. Some machines may also include an optional flux dispenser.
A common F5 HM configuration supports up to 118 tracks for 8 mm tape feeders. Wider feeders, manual trays and a Waffle Pack Changer reduce the available tape-feeder capacity.
Yes. Depending on its configuration, the machine can use manual trays or an optional Waffle Pack Changer for JEDEC trays, dies, ICs and other tray-supplied components.
The HS60 is mainly a high-speed chip mounter, while the F5 HM is a flexible placement machine for larger, more accurate and more complex components. The two machines can be used together in the same production line.
Not automatically. Feeders, component tables, Waffle Pack Changers, nozzles and grippers may be included or quoted separately. The quotation should identify every included accessory.
Test both placement heads, the X/Y gantry, vision modules, nozzle changers, vacuum system, programmable force control, conveyor, feeder tables, station computer and all required optional systems. A sample placement test using representative components is recommended.
Send your PCB dimensions, component range, package types, placement-accuracy requirement, feeder demand and current SIPLACE line configuration. GEEKVALUE will check available Siemens SIPLACE F5 HM machines and confirm the head configuration, vision modules, conveyor, feeder tables, included accessories, inspection scope and delivery arrangement.
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