The SIPLACE X4iS is a four-gantry SMT placement machine built for production lines where placement output is the main priority. Its layout combines two placement areas with four independently configured gantries, each carrying one placement head. In the m
The SIPLACE X4iS is a four-gantry SMT placement machine built for production lines where placement output is the main priority. Its layout combines two placement areas with four independently configured gantries, each carrying one placement head. In the maximum-speed configuration, four SIPLACE SpeedStar heads deliver a benchmark rating of up to 172,000 components per hour.
The X4iS can also use MultiStar and TwinStar heads when the production mix includes larger ICs, fine-pitch packages or special components. Placement output, component capability and feeder capacity depend on the installed heads, cameras, conveyor and optional equipment, so the configuration of an available machine must be checked before quotation.
The X4iS belongs to the SIPLACE X-Series S platform but uses a different machine layout from the standard X4S. Its example configuration positions four component trolleys at inner locations around the two placement areas. This arrangement is designed around short component travel paths and high placement performance.
| Machine Structure | Four gantries with one placement head on each gantry |
|---|---|
| Placement Areas | Two |
| Maximum Benchmark Rating | 172,000 components per hour with four SpeedStar heads |
| IPC 9850 Rating | 146,000 components per hour in the maximum-speed configuration |
| Placement Head Options | SpeedStar, MultiStar and TwinStar |
| Conveyor Options | Single conveyor or flexible dual conveyor |
| Reference Feeder Capacity | 148 positions for 8 mm SIPLACE X feeder modules |
The maximum rating applies only to an X4iS fitted with four SpeedStar heads. Mixed head combinations reduce the headline speed but expand the range of components that can be processed on the same machine.
| Placement Head Combination | IPC Rating | SIPLACE Benchmark | Production Focus |
|---|---|---|---|
| 4 × SpeedStar C&P20 P2 | 146,000 cph | 172,000 cph | Maximum output for small standard components |
| 2 × SpeedStar + 2 × MultiStar in low position | 112,950 cph | 133,000 cph | High output with a wider component mix |
| 2 × SpeedStar + 2 × MultiStar in high position | 107,000 cph | 126,000 cph | Mixed production with increased component clearance |
| 4 × MultiStar in low position | 79,900 cph | 94,000 cph | Flexible placement across a broader package range |
| 2 × SpeedStar + MultiStar and TwinStar | 93,675 cph | 111,750 cph | Standard components combined with special-component handling |
| 2 × SpeedStar + 2 × TwinStar | 81,350 cph | 97,250 cph | High-volume production that also includes large or complex components |
IPC and SIPLACE benchmark values are measured under defined test conditions. They should not be interpreted as guaranteed output for every PCB. Actual production speed changes with the component mix, feeder layout, board program, conveyor mode and equipment condition.
| Placement Head | Reference Component Range | Reference Accuracy | Typical Use |
|---|---|---|---|
| SpeedStar C&P20 P2 | 0201 metric to 8.2 × 8.2 mm, up to 4 mm high | ±34 µm at 3σ | Fast placement of chips and small standard components |
| MultiStar CPP | From 01005 up to 50 × 40 mm, depending on camera and installation position | Up to ±30 µm at 3σ | Standard components, ICs and mixed product ranges |
| TwinStar | Up to 200 × 110 mm with multiple measurement and applicable restrictions | Up to ±22 µm at 3σ | Large, fine-pitch, heavy and special components |
The 20-nozzle SpeedStar works on the Collect & Place principle. It collects multiple components during one cycle, optically centers them and then places them on the PCB. The original specification lists a component range beginning at 0.12 × 0.12 mm, corresponding to 0201 metric, and extending to 8.2 × 8.2 mm.
Its programmable placement force ranges from 0.5 N to 4.5 N. Touchless placement is also supported for production involving small or sensitive components.
MultiStar can switch between Collect & Place, Pick & Place and mixed operating modes. This makes it useful when a production program combines small components with larger IC packages and changing the physical placement head would interrupt production.
The supported component dimensions and height depend on the installed camera and whether the head is mounted in the high or low position. Larger packages and the maximum listed height require the appropriate configuration and may be subject to additional restrictions.
TwinStar is intended for fine-pitch packages, connectors, sockets, shields, bare dies, flip chips and other special components. With multiple camera measurements, the specification lists component dimensions up to 200 × 110 mm.
Component height can reach 25 mm. The listed maximum weight is 160 g, although more than 100 g requires reduced acceleration. Placement force can reach 30 N when the applicable odd-shaped-component package is installed.
The supported PCB format differs between the single conveyor, flexible dual conveyor and long-board configurations. The X4iS also has different dual-conveyor limits from the standard X4S, so the conveyor fitted to the available machine should be confirmed rather than inferred from the series name.
| Conveyor Configuration | Standard PCB Range | Long-Board Configuration |
|---|---|---|
| Single Conveyor | 50 × 50 mm to 450 × 685 mm | Up to 850 × 685 mm with conveyor extensions and the required license |
| Flexible Dual Conveyor | 50 × 50 mm to 380 × 320 mm with full functionality | Up to 760 × 320 mm |
| Dual Conveyor in Single-Conveyor Mode | 50 × 50 mm to 450 × 600 mm | Up to 760 × 510 mm |
| Standard PCB Thickness | 0.3 to 4.5 mm |
|---|---|
| Standard PCB Weight | Up to 3 kg on the single conveyor and up to 2 kg in the listed dual-conveyor modes |
| PCB Handling Edge | 3 mm component-free edge |
| Conveyor Interface | SMEMA or IPC-HERMES-9852, depending on machine generation and configuration |
| Width Adjustment | Automatic electrical adjustment |
Four SIPLACE X component trolleys can be docked to the X4iS. The reference capacity is 148 positions for 8 mm X feeder modules, slightly lower than the 160-position capacity listed for the X2S, X3S and standard X4S layout.
The component trolleys can be prepared away from the machine, allowing the next feeder setup to be completed while production continues. The original specification lists a trolley changeover time of less than one minute. Tape splicing can also be carried out without stopping the machine when compatible SmartFeeder modules are used.
The main machine quotation does not automatically include 148 feeders. Feeder modules, trolleys, tray systems and other supply equipment must be listed separately in the confirmed delivery scope.
The X-Series S platform combines digital component cameras with component, force and vacuum sensors. These functions check whether a component has been picked correctly, measure its position on the nozzle and monitor the programmed placement force.
PCB warpage can also be measured and compensated during placement. Which cameras, sensing functions and software options are active depends on the equipment and licenses installed on the individual machine.
| Configuration Item | Reason for Checking |
|---|---|
| Placement Head Combination | Defines the machine’s output, component range and production balance. |
| Head Installation Position | MultiStar component height and camera options vary between high and low positions. |
| Component Cameras | Camera type affects the measurable package dimensions and achievable accuracy. |
| Single or Flexible Dual Conveyor | Changes the available PCB format, transport mode and board weight limits. |
| Long-Board Equipment | The maximum board lengths require conveyor extensions and the corresponding option. |
| Feeders and Component Trolleys | They may be included with the machine or quoted separately. |
| Nozzles and Nozzle Changers | The installed nozzle inventory must match the component packages to be placed. |
| Software and Licenses | Optional processes and board-handling functions may depend on licensed software. |
GEEKVALUE can help source SIPLACE X4iS placement machines according to current availability. Because the machine was supplied in several head and conveyor configurations, pricing cannot be based on the model name alone.
Send us your required PCB dimensions, component range, production target, feeder requirements and destination country. We will confirm the available machine configuration, current photos, included accessories, condition, price and estimated delivery time before quotation.
Some market listings quote a theoretical figure of 200,000 components per hour. The reviewed SIPLACE X-Series S specification lists 172,000 cph as the benchmark value and 146,000 cph under IPC 9850 conditions for an X4iS fitted with four SpeedStar heads. Actual production output is lower or higher depending on the specific board program and operating conditions.
Both machines have four gantries, but their component-trolley and placement-area layouts differ. The X4iS is the higher-output arrangement in the reviewed specification, with a maximum benchmark rating of 172,000 cph compared with 150,000 cph for the standard X4S. Its reference feeder capacity is 148 rather than 160 positions for 8 mm X feeders.
Yes, when it has the appropriate head combination. SpeedStar is intended for small standard components, MultiStar covers a broader mixed range, and TwinStar extends the machine to large, heavy and special components.
Not automatically. The figure describes the maximum reference feeder positions available on four component trolleys. The quantity and type of feeders included with an available machine must be confirmed in the quotation.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
