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ASM Siemens SIPLACE D4 SMT Chip Mounter | 66,000 CPH

Used ASM Siemens SIPLACE D4 chip mounter with four C&P12 heads, up to 66,000 CPH and 144 feeder tracks.

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ASM Siemens SIPLACE D4 SMT Chip Mounter | 66,000 CPH
Product Overview

The ASM Siemens SIPLACE D4 SMT chip mounter is a four-gantry high-speed placement machine developed for volume production involving large quantities of small and medium-sized surface-mount components. A typical high-output configuration uses four 12-nozzle Collect & Place heads to combine rapid component pickup, optical inspection and accurate placement within one machine platform.

The SIPLACE D4 is positioned at the high-capacity end of the original D Series. It is primarily used as a chip-placement machine rather than a flexible odd-shaped component mounter. Its main production role is to install resistors, capacitors, diodes, transistors, small IC packages and other tape-fed SMD components before larger or more complex devices are processed by a flexible placement machine.

GEEKVALUE supplies available used, inspected and refurbished SIPLACE D4 machines according to the machine generation, placement-head condition, conveyor configuration, feeder package, software version and production requirements. Explore the complete ASM Siemens SIPLACE D Series to compare D1, D1i, D2, D2i, D3, D3i, D4 and D4i placement platforms.

ASM Siemens SIPLACE D4 SMT Chip Mounter

ASM Siemens SIPLACE D4 Machine Overview

The SIPLACE D4 uses four independently operating X/Y gantries. Each gantry is normally equipped with one 12-nozzle Collect & Place head, giving the machine four placement heads and a total of 48 nozzle positions.

During operation, each head collects multiple components from its assigned feeder area. The components are checked by the vision system, corrected for pickup position and rotation, and then placed onto the stationary PCB.

By distributing the component program across four separate gantries, the D4 can achieve considerably higher output than single- or dual-gantry D Series machines.

  • Four independently controlled placement gantries

  • Four 12-nozzle Collect & Place heads

  • Up to 48 component pickups across four heads per collection cycle

  • Published IPC placement performance of up to 57,000 CPH

  • SIPLACE benchmark performance of up to 66,000 CPH

  • Theoretical maximum output of up to 81,500 CPH

  • Component range up to approximately 18.7 × 18.7 mm

  • Optional or configuration-dependent 01005 placement capability

  • Up to 144 tracks for 8 mm S feeder modules

  • Single-conveyor and flexible dual-conveyor options

  • Suitable for medium- and high-volume PCB assembly

ASM SIPLACE D4 Technical Specifications

SpecificationTypical SIPLACE D4/D4i High-Speed Configuration
Machine typeFour-gantry high-speed SMT chip mounter
Number of gantries4
Placement-head configuration4 × 12-nozzle Collect & Place heads
Total nozzle positions48 across four heads
IPC placement rateUp to approximately 57,000 CPH
SIPLACE benchmark rateUp to approximately 66,000 CPH
Theoretical maximum rateUp to approximately 81,500 CPH
Component rangeApproximately 0.6 × 0.3 mm to 18.7 × 18.7 mm; 01005 capability depends on the installed package
Maximum component heightApproximately 6 mm with the C&P12 head
Placement accuracyApproximately ±50 μm at 3 sigma and ±67 μm at 4 sigma
Angular accuracyApproximately ±0.53° at 3 sigma and ±0.71° at 4 sigma
Feeder capacityUp to 144 tracks with 3 × 8 mm S feeder modules
Component changeover tablesUp to four removable component tables
Standard single-conveyor PCB sizeApproximately 50 × 50 mm to 368 × 460 mm
Wide-board configurationUp to approximately 368 × 508 mm
Long-board configurationUp to approximately 610 × 460 mm
Long- and wide-board configurationUp to approximately 610 × 508 mm
Standard dual-conveyor PCB sizeApproximately 50 × 50 mm to 368 × 216 mm per lane
PCB thicknessApproximately 0.3–4.5 mm; other thicknesses require confirmation
Maximum PCB weightApproximately 3 kg
Component supplyTape feeders, stick magazines, bulk-case feeders and selected application-specific modules
Typical production roleHigh-speed placement of small and medium tape-fed SMD components

Configuration notice: D4 and D4i machines are frequently grouped together in used-equipment listings, but the exact performance, smallest supported component, conveyor dimensions, software version and installed options may differ. Final matching must be based on the actual machine nameplate, serial number and powered-on inspection.

Four-Gantry High-Speed Placement Architecture

The four-gantry design is the main feature that separates the SIPLACE D4 from the lower-capacity D Series models. Rather than assigning the entire placement program to one or two heads, the machine divides the work between four independently controlled placement systems.

Each gantry operates within an optimized production area. The programming software distributes component part numbers and PCB coordinates according to feeder position, placement quantity, nozzle requirement and estimated cycle time.

A properly balanced program allows the four heads to complete their placement tasks at approximately the same time. If one gantry has significantly more work than the others, the remaining heads may wait for the busiest gantry and total machine output will decrease.

Factors That Affect Actual D4 Output

  • Total number of components placed on each PCB

  • Distribution of placements between the four gantries

  • Component feeder locations

  • Distance between feeder pickup and PCB placement coordinates

  • Number of component package types

  • Nozzle requirements and nozzle changes

  • Component inspection and rotation requirements

  • PCB dimensions and panel format

  • Conveyor loading and unloading time

  • Pickup retries and component rejection rate

  • Feeder and placement-head condition

  • Production-program optimization

The published 81,500 CPH figure represents a theoretical maximum under highly favorable conditions. It should not be treated as the guaranteed output of every D4 machine or PCB program.

Understanding D4 Placement-Speed Values

SIPLACE specifications may show several different placement-rate values for the same machine. These numbers describe different test conditions and should not be used interchangeably.

Speed TypePublished D4/D4i ValueMeaning
IPC valueUp to 57,000 CPHMeasured under standardized IPC test conditions intended to support comparison between different machine platforms.
SIPLACE benchmark valueUp to 66,000 CPHMeasured under defined SIPLACE machine-acceptance and benchmark conditions.
Theoretical maximumUp to 81,500 CPHCalculated under the most favorable component, feeder, travel and operating conditions.
Actual production outputApplication-dependentDetermined by the real BOM, PCB program, feeder layout, machine condition and line balance.

When calculating required production capacity, use the actual board cycle time instead of dividing the number of placements by the theoretical CPH value.

How the 12-Nozzle Collect & Place Head Works

Each D4 gantry normally carries a C&P12 head with twelve nozzle positions arranged around a rotating placement star. The head collects a group of components from the stationary feeder table before moving to the PCB.

While the head travels toward the board, the digital component camera checks each collected component. The system can measure pickup offset, verify component presence, correct rotation and reject components that do not satisfy the programmed recognition criteria.

The head then places the components onto the stationary PCB according to the programmed coordinates.

Advantages of the C&P12 Placement Principle

  • Multiple components are collected during one operating cycle

  • Pickup position can be corrected before placement

  • Component rotation can be verified and adjusted

  • Missing or incorrectly picked components can be detected

  • Vacuum and force sensors support process monitoring

  • Shorter travel paths support higher machine output

  • The stationary PCB reduces the risk of components shifting after placement

Because the D4 depends on four placement heads working together, the condition of every head affects total machine performance. A machine may continue running even when one head has excessive sleeve wear, vacuum leakage or unstable camera recognition, but its production efficiency and placement quality may be significantly reduced.

Component Range and Suitable Applications

The C&P12 head is designed mainly for small and medium standard components. Depending on the installed camera, nozzle and software configuration, the machine can process components from small chip packages up to approximately 18.7 × 18.7 mm.

Typical component types include:

  • Chip resistors

  • Multilayer ceramic capacitors

  • Small diodes

  • SOT transistors

  • Resistor and capacitor arrays

  • Small-outline integrated circuits

  • Selected CSP and BGA packages

  • Small QFP and PLCC devices

  • LED components

  • Other standard tape-fed SMD packages

The D4 is not normally selected as the only placement machine when a PCB contains large connectors, tall components, heavy devices or complex odd-shaped parts. These components are generally assigned to a flexible placement machine equipped with a C&P6, Pick & Place or special-purpose head.

01005 Component Placement Requirements

Some D4 and later D4i configurations are promoted with 01005 placement capability. However, the model name alone does not prove that a particular used machine can reliably process 01005 components.

A complete 01005 process may require:

  • Compatible 12-nozzle Collect & Place heads

  • High-resolution digital component cameras

  • Special low-force placement sleeves

  • Type 905 or other application-specific nozzles

  • Compatible high-precision S feeder modules

  • Correct station-software version

  • Compatible SIPLACE Pro programming software

  • Calibrated placement heads and feeder pickup positions

  • Controlled component packaging and tape-pocket quality

  • Stable factory temperature, humidity and cleanliness

For an original D4 without a verified 01005 package, approximately 0.6 × 0.3 mm components should be treated as a safer baseline. A sample pickup and placement test should be completed before promising stable 01005 production.

Feeder Capacity and Changeover Tables

The SIPLACE D4 can be equipped with four removable component changeover tables. Each table provides up to twelve feeder-module locations, with each location approximately 30 mm wide.

When all four tables are fitted with 3 × 8 mm S feeder modules, the machine can provide up to 144 individual 8 mm tape tracks.

The actual number of physical feeders will be lower when wider component tapes are required. Feeders for 12 mm, 16 mm, 24 mm, 32 mm or wider tapes occupy additional track positions.

Feeder and Table Items to Confirm

  • Number of component changeover tables included

  • Number of 3 × 8 mm S feeder modules

  • Number of wider tape feeders

  • Feeder model and software compatibility

  • Feeder calibration and pickup condition

  • Table communication-unit condition

  • Table wheels, docking pins and locking mechanisms

  • Reel holders and second-level reel holders

  • Tape cutters and waste containers

  • Spare feeder requirements

Feeders and changeover tables should not be assumed to be included with every used-machine quotation. The commercial offer should identify the machine, tables, feeders, nozzles and spare parts separately.

Single-Conveyor and Dual-Conveyor Options

The SIPLACE D4 may be equipped with a single conveyor or a flexible dual conveyor. The installed conveyor affects PCB width, production mode and compatibility with the surrounding SMT equipment.

Single-Conveyor Configuration

A standard single-conveyor configuration commonly supports PCBs from approximately 50 × 50 mm to 368 × 460 mm.

Available options can extend the capacity to:

  • Approximately 368 × 508 mm with the wide-board configuration

  • Approximately 610 × 460 mm with the long-board option

  • Approximately 610 × 508 mm with long- and wide-board options combined

Flexible Dual-Conveyor Configuration

A standard flexible dual conveyor commonly supports boards from approximately 50 × 50 mm to 368 × 216 mm on each lane.

Depending on the installed options, the dual conveyor may support:

  • Boards up to approximately 368 × 242 mm per lane

  • Long boards up to approximately 610 × 216 mm per lane

  • Long and wider boards up to approximately 610 × 242 mm per lane

  • Operation as one wider conveyor for boards up to approximately 368 × 380 mm

The flexible dual conveyor may run synchronously or asynchronously, depending on the machine configuration and software. This can help reduce non-productive conveyor waiting time and support different PCB products on the two lanes.

PCB Information Required Before Machine Selection

  • Minimum and maximum PCB length

  • Minimum and maximum PCB width

  • PCB thickness

  • Maximum panel weight

  • Single-lane or dual-lane production requirement

  • Same or different product on each lane

  • Required conveyor direction

  • Fixed conveyor-rail position

  • Production-line height

  • Board-edge clearance

  • Long-board or wide-board requirement

  • SMEMA or Siemens communication requirement

Digital Vision and Placement Process Control

The SIPLACE digital vision system identifies components according to their programmed shape and optical characteristics. Multiple illumination settings help the camera recognize different component surfaces, leads and package outlines.

The placement process may also use several monitoring functions:

  • Component sensor: Checks whether a component is present at the nozzle before and after pickup and placement.

  • Vacuum sensor: Monitors whether the component has been collected and released correctly.

  • Force sensor: Monitors the programmed placement force and can compensate for height differences.

  • PCB camera: Recognizes PCB fiducials and calculates board-position correction.

  • Vision inspection: Checks component position, rotation and package shape before placement.

  • Barcode verification: Helps prevent incorrect feeder setups when the required option is installed.

When inspecting a used machine, these functions should be tested under operating conditions rather than evaluated only through external photographs.

ASM D4, Siemens D4 and SIPLACE D4i Identification

The machine may be described in equipment listings as:

  • Siemens SIPLACE D4

  • Siemens Dematic SIPLACE D4

  • ASM SIPLACE D4

  • SIPLACE D4i

  • D4 SMT chip mounter

  • D4 pick and place machine

Many D Series machines were manufactured during the Siemens or Siemens Dematic period. Later documentation and replacement-part listings may use ASM branding.

The brand wording used by the seller does not confirm the exact machine generation. Before ordering, verify:

  • Complete model on the machine nameplate

  • D4 or D4i designation

  • Machine serial number

  • Manufacturing year

  • Station-software release

  • SIPLACE Pro version

  • Installed component cameras

  • 01005 or 0201 package configuration

  • Conveyor and feeder-table configuration

SIPLACE D4 vs D2 and D4i

ComparisonSIPLACE D2SIPLACE D4SIPLACE D4i
Gantry count244
Primary roleBalanced speed and flexibilityHigh-speed chip placementLater high-speed D Series configuration
Typical head configurationC&P12 and/or C&P64 × C&P124 × C&P12
Feeder capacityUp to approximately 90 × 8 mm tracksUp to approximately 144 × 8 mm tracksUp to approximately 144 × 8 mm tracks
Component focusSmall and medium components with greater head flexibilityHigh-volume standard component placementHigh-volume placement with later software and option packages
Model verificationCheck installed head combinationCheck exact D4 configurationCheck software, camera and 01005 package

The D2 can provide greater head-configuration flexibility, while the D4 prioritizes maximum D Series chip-placement capacity. D4 and D4i listings must be checked carefully because sellers may use the names interchangeably.

Using the SIPLACE D4 in an SMT Production Line

The D4 is commonly installed as the high-speed placement section of a complete SMT production line. It processes the majority of small tape-fed components before a flexible mounter completes the larger and more complex packages.

A typical line may include:

  1. PCB loader

  2. Solder paste printer

  3. Solder paste inspection system

  4. SIPLACE D4 high-speed chip mounter

  5. SIPLACE D1, D2, F5 HM or another flexible placement machine

  6. Reflow oven

  7. Automatic optical inspection system

  8. PCB unloader

The total output of the production line is determined by its slowest process. Installing a D4 will not automatically increase line output when the printer, flexible mounter, conveyor, reflow oven or inspection system remains the main bottleneck.

Before adding a D4 to an existing line, confirm:

  • PCB transport direction

  • Conveyor height

  • SMEMA or Siemens communication interface

  • Feeder and component-table compatibility

  • SIPLACE Pro and line-computer compatibility

  • Electrical voltage and frequency

  • Compressed-air capacity

  • Available line length and service clearance

  • Operator access on both sides of the machine

Used SIPLACE D4 Inspection Checklist

A used D4 should be evaluated as a complete high-speed placement system. A machine that powers on is not necessarily ready for stable volume production.

1. Machine Identification

  • Complete model designation

  • D4 or D4i confirmation

  • Machine serial number

  • Manufacturing year

  • Total operating hours

  • Total placement counter

  • Original and current configuration

  • Station-software version

  • SIPLACE Pro version

2. Gantry and Axis Inspection

  • Movement of all four gantries

  • X- and Y-axis noise

  • Vibration during acceleration and deceleration

  • Machine homing and reference operation

  • Motor and encoder condition

  • Axis-drive alarm history

  • Trailing cables and cooling-air hoses

  • Linear guide and lubrication condition

  • Gantry calibration and alignment

3. Placement-Head Inspection

  • Condition of all four C&P12 heads

  • Head identification labels

  • Individual head placement counters

  • Nozzle-sleeve wear

  • Placement-star rotation

  • Z-axis movement

  • Vacuum pressure and leakage

  • Component-sensor operation

  • Force-sensor operation

  • Nozzle changer operation

  • Pickup and placement repeatability

4. Camera and Vision Inspection

  • Component camera type on every gantry

  • High-resolution camera availability

  • PCB camera image quality

  • Lighting-level operation

  • Component-shape recognition

  • Fiducial recognition

  • Pickup-position correction

  • Camera calibration status

  • Vision dump and rejection functions

5. Conveyor Inspection

  • Single or flexible dual conveyor

  • Automatic width adjustment

  • Conveyor belts and pulleys

  • PCB entrance and exit sensors

  • Board clamping and support

  • Long-board operation where required

  • Wide-board operation where required

  • Synchronous and asynchronous dual-lane operation

  • Communication with surrounding equipment

6. Feeder and Changeover-Table Inspection

  • Number of component changeover tables

  • Number and type of included feeders

  • Feeder pickup and indexing performance

  • Table communication units

  • Table docking and locking condition

  • Reel-holder condition

  • Tape-cutter operation

  • Waste-container condition

  • Splice-detection option where required

7. 01005 Package Inspection

  • High-resolution component cameras

  • Required nozzles and sleeves

  • Compatible feeder modules

  • Station-software version

  • SIPLACE Pro compatibility

  • 01005 package license or configuration records

  • Sample 01005 pickup and placement test

8. Included Equipment

  • Station computers and monitors

  • Machine-software backup

  • Programming and product files

  • Nozzle magazines and nozzles

  • Component changeover tables

  • Feeders and reel holders

  • Transformer or conversion kit

  • Operating and maintenance manuals

  • Service tools

  • Included spare parts

A complete inspection video should show startup, homing, movement of all four gantries, rotation of all four placement heads, feeder pickup, component recognition, nozzle changing, PCB transport and an actual sample placement program.

Common SIPLACE D4 Maintenance Areas

The D4 is a high-speed mechanical and electronic system. Long-term production reliability depends on preventive maintenance and the availability of compatible replacement parts.

Important maintenance areas include:

  • C&P12 placement-head segments

  • Nozzle sleeves and nozzle holders

  • Nozzles and nozzle magazines

  • Placement-star brakes and turning stations

  • Vacuum generators and filters

  • Component sensors and force sensors

  • Component cameras and lighting units

  • PCB camera and fiducial lighting

  • X/Y motors and encoders

  • Axis drives and control boards

  • Trailing cables and cooling-air hoses

  • Compressed-air filters

  • Cooling fans and machine filters

  • Conveyor belts, pulleys and sensors

  • Component-table docking connectors

  • Feeder modules and tape cutters

  • Station computers and storage devices

Preventive maintenance should include head cleaning, nozzle inspection, vacuum testing, camera calibration, feeder calibration, conveyor adjustment, axis inspection, filter replacement and verification of current software backups.

Who Should Consider a Used SIPLACE D4?

A used SIPLACE D4 may be suitable for manufacturers that already operate legacy SIPLACE equipment and require additional high-speed chip-placement capacity.

The machine may be a practical option when:

  • The PCB contains a large number of small tape-fed components

  • The factory already owns compatible SIPLACE S feeders

  • Existing technicians understand D Series equipment

  • Replacement heads and spare parts are available

  • The existing production software supports the machine

  • A damaged D4 must be replaced without redesigning the complete line

  • The production line requires more small-component capacity

  • A lower equipment investment is preferred over a new platform

A newer placement platform may be more suitable when the project requires modern MES connectivity, newer feeder technology, very small components without legacy upgrade work, lower energy consumption or long-term original-manufacturer lifecycle support.

Information Required for a SIPLACE D4 Quotation

Provide the following information so that the available machine can be matched to your production requirement:

  • Required D4 or D4i model

  • Preferred machine condition

  • Required manufacturing year

  • Minimum component package

  • Maximum component package

  • Need for 01005 production

  • PCB dimensions and thickness

  • Single- or dual-conveyor requirement

  • Target production output

  • Required feeder quantities

  • Required feeder tape widths

  • Need for component changeover tables

  • Existing SIPLACE machine models

  • Existing feeder models

  • Factory voltage and frequency

  • Available compressed-air supply

  • Destination country

  • Required delivery schedule

Customers who are not certain whether the D4 can achieve the required cycle time may send a PCB BOM, placement file, component list, PCB dimensions and target output for preliminary production matching.

Frequently Asked Questions

What is the ASM Siemens SIPLACE D4 used for?

The SIPLACE D4 is a four-gantry high-speed SMT chip mounter used primarily for volume placement of resistors, capacitors, diodes, transistors, small ICs and other tape-fed SMD components.

How many placement heads does the SIPLACE D4 have?

A typical D4 high-speed configuration has four gantries and four 12-nozzle Collect & Place heads, providing 48 nozzle positions across the complete machine.

What is the placement speed of the SIPLACE D4?

Published later D4/D4i values include up to approximately 57,000 CPH under IPC conditions, 66,000 CPH under SIPLACE benchmark conditions and 81,500 CPH as a theoretical maximum. Actual output depends on the PCB program and machine configuration.

Can the SIPLACE D4 place 01005 components?

Selected D4 and D4i configurations can process 01005 components, but the machine requires the appropriate high-resolution camera, nozzles, sleeves, feeder modules and software. The capability must be tested on the actual machine.

What component size can the D4 handle?

The typical C&P12 component range extends up to approximately 18.7 × 18.7 mm with a maximum component height of around 6 mm. The smallest supported component depends on the installed package.

How many feeders can be installed on a D4?

The D4 can provide up to 144 individual 8 mm tracks when equipped with four changeover tables and 3 × 8 mm S feeder modules. Wider tape feeders reduce the total installed feeder quantity.

Does the SIPLACE D4 support dual-lane production?

Yes. Machines may be equipped with a flexible dual conveyor that supports synchronous, asynchronous or wider single-conveyor operation. The installed conveyor must be confirmed on the actual machine.

What is the difference between the SIPLACE D2 and D4?

The D2 is a two-gantry platform that may use different C&P head combinations, while the D4 is normally a four-gantry, four-C&P12 high-speed chip mounter with higher feeder capacity and placement output.

What is the difference between D4 and D4i?

The D4i is a later D Series generation associated with updated software, vision and option packages. Because used-equipment listings often mix the names, the model plate and installed configuration should always be checked.

Are feeders included with a used SIPLACE D4?

Not automatically. Feeders, component changeover tables, nozzles, reel holders and spare parts may be included or quoted separately. Every included item should be listed in the quotation.

What should be tested before purchasing a used D4?

Test all four gantries, all four placement heads, component cameras, PCB camera, vacuum and force sensors, nozzle changers, conveyor, feeder tables, feeders, station computers and required software functions. A sample placement test is strongly recommended.

Request ASM Siemens SIPLACE D4 Availability

Send your required machine generation, PCB dimensions, component range, target output, feeder quantity, conveyor requirement and destination country. GEEKVALUE will check available ASM Siemens SIPLACE D4 machines and confirm the serial number, manufacturing year, head condition, camera configuration, conveyor type, included accessories, inspection scope and delivery arrangement.

View the complete SIPLACE D Series placement machine range, or explore compatible SIPLACE SMT feeders, placement heads and SMT nozzles.

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