The Siemens SIPLACE X4 is a four-gantry SMT placement machine developed for production lines that need high placement output without being limited to one component category. Each gantry carries one placement head, and the four positions can be configured
The Siemens SIPLACE X4 is a four-gantry SMT placement machine developed for production lines that need high placement output without being limited to one component category. Each gantry carries one placement head, and the four positions can be configured with high-speed Collect & Place heads, flexible IC heads or SIPLACE TwinHead technology.
A machine fitted with four C&P20 heads has the highest documented output, while mixed head configurations extend the X4 to larger ICs, fine-pitch packages and special components. The actual production role of an available machine therefore depends on its installed heads, cameras, conveyor, feeder tables, nozzles and software.
The X4 has two placement areas with two gantries assigned to each area. Components remain stationary in the feeder area while the heads collect, inspect and place them on a stationary PCB. This arrangement reduces unnecessary component and board movement during the placement cycle.
Four placement-head technologies are documented for the original X-Series platform: C&P20, C&P12, C&P6 and TwinHead. Different combinations allow the same machine platform to be configured either as a high-speed chip placer or as a mixed-component mounter.
| Machine Structure | Four gantries across two placement areas |
|---|---|
| Placement Head Options | C&P20, C&P12, C&P6 and TwinHead |
| Maximum IPC 9850 Rating | 81,000 components per hour |
| Maximum SIPLACE Benchmark | 90,000 components per hour |
| Theoretical Maximum | 124,000 components per hour |
| Overall Documented Component Range | 01005 to 200 × 125 mm, depending on heads, cameras and options |
| Maximum X Feeder Capacity | 160 positions for 8 mm SIPLACE X feeder modules |
| PCB Conveyor Options | Single conveyor or flexible dual conveyor |
The maximum speed values apply to an X4 equipped with four C&P20 heads under defined test or calculation conditions. They are not interchangeable with normal factory output, which also depends on the PCB program, component mix, feeder positions, rotations, transport time and equipment condition.
Changing even one placement head affects both the reference speed and the component spectrum. The following examples show how the X4 changes from a chip-focused configuration to a more flexible mixed-component platform.
| Head Combination | IPC 9850 | SIPLACE Benchmark | Theoretical Maximum | Configuration Focus |
|---|---|---|---|---|
| 4 × C&P20 | 81,000 cph | 90,000 cph | 124,000 cph | Maximum reference output for small standard components |
| 2 × C&P20 + 2 × C&P12 | 65,000 cph | 71,400 cph | 102,500 cph | High chip output with additional IC capability |
| 2 × C&P20 + C&P12 + C&P6 | 60,300 cph | 65,300 cph | 94,000 cph | Mixed production with a wider standard-component range |
| 2 × C&P20 + C&P12 + TwinHead | 57,500 cph | 63,800 cph | 89,000 cph | High-speed placement combined with fine-pitch or special components |
| 4 × C&P12 | 49,000 cph | 52,800 cph | 81,500 cph | Standard SMD and IC placement without C&P20 heads |
| 4 × TwinHead | 14,600 cph | 15,000 cph | 26,000 cph | Fine-pitch, large, heavy and special-component placement |
These are selected examples rather than the complete list of possible X4 combinations. An accurate quotation should identify all four installed heads instead of describing the machine only by its highest published speed.
| Placement Head | Reference Component Range | Height and Weight | Reference X/Y Accuracy | Typical Role |
|---|---|---|---|---|
| C&P20 | 01005 to 6 × 6 mm | Up to 4 mm and 1 g | ±41 µm at 3σ | High-speed placement of chips and small standard components |
| C&P12 with Standard Camera | 0402 to 18.7 × 18.7 mm | Up to 6 mm and 2 g | ±45 µm at 3σ | Standard SMDs, ICs, BGAs, QFPs and similar packages |
| C&P12 with High-Resolution Camera | 0201 with the required package, up to 18.7 × 18.7 mm | Up to 6 mm and 2 g | ±41 µm at 3σ | Small components combined with broader IC placement |
| C&P6 | 0201 to 27 × 27 mm | Up to 8.5 mm and 5 g | ±45 µm at 3σ | Larger IC packages and mixed-component production |
| TwinHead with Fine-Pitch Camera | Fine-pitch packages, BGAs, connectors, sockets and special components | Up to 25 mm and 100 g with the applicable setup | ±26 µm at 3σ | Large, heavy and mechanically demanding components |
| TwinHead with Flip-Chip Camera | 0201, bare dies, flip chips and compatible special packages | Depends on camera, nozzle and component geometry | ±22 µm at 3σ | High-accuracy semiconductor and specialized component placement |
The maximum TwinHead component size is documented as 200 × 125 mm under restricted conditions. Actual limits depend on the camera, whether one or two nozzles are used, the available gripper and whether a Collect & Place head shares the same placement area.
The X-Series platform supports 01005 placement with the C&P20 head, its high-resolution camera, dedicated 01005 nozzles and compatible SIPLACE X feeder modules. The original documentation also specifies suitable station software and SIPLACE Pro versions for this process.
An X4 fitted only with C&P12, C&P6 or TwinHead technology should not automatically be advertised as 01005-ready. The installed heads, nozzle inventory, feeders and software must be checked together.
The X4 can use a single conveyor or a flexible dual conveyor. The dual conveyor supports synchronous operation, asynchronous operation and a single-conveyor mode for wider boards.
| Conveyor Arrangement | Standard PCB Range | Maximum with Long-Board Option |
|---|---|---|
| Single Conveyor | 50 × 50 mm to 450 × 535 mm | Up to 610 × 535 mm |
| Flexible Dual Conveyor | 50 × 50 mm to 450 × 250 mm | Up to 610 × 250 mm |
| Dual Conveyor in Single-Conveyor Mode | 50 × 50 mm to 450 × 450 mm | Up to 610 × 450 mm |
| Standard PCB Thickness | 0.3 to 4.5 mm |
|---|---|
| Maximum PCB Weight | 3 kg |
| Conveyor Width Adjustment | Automatic electrical adjustment |
| Dual-Conveyor Modes | Synchronous, asynchronous or single-conveyor operation |
| Production-Line Interface | SMEMA or Siemens interface, depending on configuration |
The maximum board lengths require the corresponding long-board equipment. Conveyor type, fixed rail position, transport direction and interface should be confirmed before an X4 is connected to an existing line.
Four SIPLACE X component changeover tables can provide up to 160 positions for 8 mm X feeder modules. The tables can be prepared outside the placement machine, allowing the next feeder setup to be assembled without stopping the current production run.
Legacy SIPLACE HF changeover tables and S-series feeder modules can also be used when the correct docking equipment is installed. In that arrangement, the documented maximum is 180 tracks using 3 × 8 mm S feeder modules.
| Feeder Arrangement | Reference Capacity | Important Condition |
|---|---|---|
| SIPLACE X Changeover Tables | 160 positions for 8 mm X feeder modules | Four tables with up to 40 positions per table |
| SIPLACE HF Changeover Tables | Up to 180 tracks with 3 × 8 mm S feeder modules | Requires compatible docking equipment |
| Matrix Tray Changer | Tray-fed ICs and special components | Optional and limited to specified table positions |
| Alternative Feeding | Waffle packs, sticks, labels and application-specific feeders | Requires the corresponding adapter or peripheral equipment |
SIPLACE HF changeover tables and the Matrix Tray Changer cannot be combined with the C&P20 head in the documented configuration. The 160-position or 180-track figures describe machine capacity and do not mean that the same number of feeders is included with an available machine.
The X-Series heads use digital component imaging and several monitoring functions to control pickup and placement. Depending on the head, these include component-presence sensing, vacuum monitoring, placement-force measurement and PCB warpage checking.
The camera measures the position of the component on the nozzle, allowing pickup offsets to be corrected before placement. Force sensing can compensate for differences in pickup height and uneven PCB surfaces, while vacuum monitoring checks whether the component was picked and released correctly.
| Nominal Apparent Power | 4.7 kVA |
|---|---|
| Reference Active Power | 2.7 kW |
| Operating Air Pressure | Approximately 4.8 bar |
| Available Supply Versions | 200, 208, 230, 380, 400 or 415 VAC, depending on regional configuration |
Electrical version, compressed-air consumption and physical setup dimensions vary with the installed heads and machine configuration. Facility requirements should be checked against the identification and documentation of the machine being offered.
An X4 with four C&P20 heads is primarily a high-speed chip placer. A machine combining C&P20 with C&P12 or C&P6 offers a broader SMD and IC range while retaining relatively high output. TwinHead becomes important when the product includes fine-pitch devices, connectors, shields, sockets, bare dies or other special components.
This means that two SIPLACE X4 machines can serve very different production roles despite carrying the same model name. Comparing only the machine price or maximum published speed can lead to an unsuitable purchase.
| Item | Why It Must Be Checked |
|---|---|
| All Four Placement Heads | Define the reference output, component range and production role. |
| Component Cameras | Affect minimum package size, measurable dimensions and placement accuracy. |
| 01005 Equipment | Requires C&P20 heads, dedicated nozzles, compatible feeders and software. |
| Conveyor Configuration | Determines PCB dimensions, lane operation and connection with adjacent equipment. |
| Feeder Table Type | X and HF tables support different feeders and have different head restrictions. |
| Feeders and Tray Equipment | May be included with the machine or quoted separately. |
| Nozzles and Grippers | Must match the customer’s actual component packages and pickup surfaces. |
| Software and Interfaces | Affect option support, programming and integration with the existing line. |
GEEKVALUE can assist with sourcing SIPLACE X4 placement machines according to current availability. Available equipment may differ substantially in head configuration, cameras, conveyor, feeder tables, software, machine condition and included accessories.
Send us your PCB dimensions, smallest and largest components, required output, feeder requirements and destination country. We will confirm the available configuration, current machine photos, included equipment, price and estimated delivery time before quotation.
The reviewed original X4 specification does not list 160,000 cph. For an X4 fitted with four C&P20 heads, it lists 81,000 cph under IPC 9850 conditions, a 90,000 cph SIPLACE benchmark and a theoretical maximum of 124,000 cph.
No. The documented 01005 process uses the C&P20 head, dedicated nozzles, compatible SIPLACE X feeder modules and supporting software. These items must be verified on the available machine.
Yes, when it has an appropriate mixed head configuration. C&P20 handles the smallest high-volume components, while TwinHead extends the machine to fine-pitch, large, heavy and special packages.
No. The number refers to the maximum positions for 8 mm X feeder modules across four changeover tables. The actual quantity and type of feeders included must be listed in the quotation.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
