The Siemens SIPLACE D2 is a dual-gantry SMT placement machine designed for chip, standard SMD and IC assembly. Each gantry carries either a 12-nozzle Collect & Place head or a 6-nozzle Collect & Place head, allowing the machine to be configured around pla
The Siemens SIPLACE D2 is a dual-gantry SMT placement machine designed for chip, standard SMD and IC assembly. Each gantry carries either a 12-nozzle Collect & Place head or a 6-nozzle Collect & Place head, allowing the machine to be configured around placement output, component range or a balance of both.
The D2 and D2i are separate product models and should not be described with interchangeable specifications. The information below is based specifically on the SIPLACE D2 technical specification. The installed heads, cameras, conveyor, feeders, software and optional packages still need to be confirmed for the machine available at the time of inquiry.
Both D2 gantries work between stationary component supply areas and the PCB placement area. The heads collect several components during a cycle, inspect their position with the digital vision system and place them at the programmed board coordinates.
Three documented head combinations are available. A dual CP12 arrangement provides the highest reference output. Combining CP12 and CP6 extends the practical IC range, while a dual CP6 configuration places greater emphasis on larger packages.
| Head Configuration | IPC 9850 Rate | SIPLACE Nominal Rate | Theoretical Maximum | Configuration Focus |
|---|---|---|---|---|
| 2 × CP12 | 27,200 cph | 31,000 cph | 40,500 cph | Highest reference output for chips and standard components |
| CP12 + CP6 | 20,900 cph | 23,000 cph | 32,000 cph | Balanced chip speed and IC package flexibility |
| 2 × CP6 | 16,500 cph | 19,500 cph | 23,000 cph | Production containing a larger proportion of IC packages |
These three speed figures represent different measurement conditions. The theoretical maximum is calculated under favorable conditions and is not the expected output of a normal production program. Actual throughput changes with board layout, component mix, feeder positions, rotations, transport time, program optimization and equipment condition.
| Placement Head | Reference Component Capability | Maximum Height | Maximum Weight | Reference X/Y Accuracy |
|---|---|---|---|---|
| 12-Nozzle Collect & Place Head | Small chips through packages up to 18.7 × 18.7 mm, depending on camera and option package | 6 mm | 2 g | ±50 µm at 3σ |
| 6-Nozzle Collect & Place Head | 0201 to 27 × 27 mm, subject to package geometry and vision conditions | 8.5 mm | 5 g | ±52.5 µm at 3σ |
Both heads use programmable placement force from 2.4 N to 5.0 N. The CP12 is intended primarily for small and standard components, while the CP6 provides additional clearance and capacity for larger IC packages.
The usable component spectrum also depends on the component camera, nozzle selection, package tolerances and software. A machine equipped only with CP12 heads should not be described with the 27 × 27 mm CP6 limit.
The SIPLACE D2 platform supports 01005 placement when a compatible CP12 head and the required 01005 option package are installed. Dedicated nozzles, suitable feeder modules and supporting software are also part of the production setup.
The presence of the D2 model name does not prove that an individual machine is ready for 01005 production. The installed component cameras, nozzles, feeders and software version should be checked together before the machine is selected for ultra-small component placement.
The D2 was available with a single conveyor or a flexible dual conveyor. The dual conveyor can process two boards synchronously or asynchronously and may also operate as one wider single transport path.
| Conveyor Arrangement | Standard PCB Range | Maximum with Required Options |
|---|---|---|
| Single Conveyor | 50 × 50 mm to 460 × 460 mm | Up to 610 × 508 mm |
| Flexible Dual Conveyor | 50 × 50 mm to 460 × 216 mm | Up to 610 × 242 mm |
| Dual Conveyor in Single-Conveyor Mode | 50 × 50 mm to 460 × 380 mm | Up to 610 × 430 mm |
| Standard PCB Thickness | 0.3 to 4.5 mm |
|---|---|
| Maximum PCB Weight | 3 kg |
| Component-Free Board Edge | 3 mm |
| Reference PCB Changeover Time | Less than 2.5 seconds |
| Line Interface | SMEMA or Siemens interface, depending on configuration |
| Width Adjustment | Automatic electrical adjustment |
The largest PCB formats require the corresponding wide-board and long-board options. Conveyor type, fixed rail position, transport direction and interface should be checked before the D2 is integrated into an existing production line.
The D2 uses movable component changeover tables that can be prepared away from the placement area. The next feeder setup can therefore be assembled while the current production job remains on the machine.
| Component Changeover Tables | Two |
|---|---|
| Feeder Locations per Table | Up to 15 |
| Maximum Reference Capacity | 90 tracks using 3 × 8 mm S feeder modules |
| Supported Feeding Methods | Tape feeders, stick magazines, bulk feeders, dipping modules and compatible special feeders |
| Reference Table Changeover Time | Less than one minute |
The 90-track value describes the maximum feeder capacity of the platform. It does not mean that a machine is supplied with 90 individual feeders. Changeover tables, feeders, nozzles and other accessories should be confirmed separately in the quotation.
The SIPLACE D2 uses digital component imaging and sensors to monitor pickup and placement. The system checks whether a component is present on the nozzle, measures its position and corrects detected pickup offsets before placement.
Vacuum and force monitoring support component pickup, release and controlled placement. PCB height and warpage compensation help the heads maintain the programmed placement conditions when the board surface is not completely level.
The exact cameras, sensors and software functions may differ between machines. Their presence should be verified from the configuration of the equipment being offered.
A D2 with two CP12 heads is most relevant to boards containing a high proportion of chips and standard SMD packages. The CP12 and CP6 combination is better suited to a mixed product where chip placement must be combined with larger IC packages.
The documented D2 component range ends at 27 × 27 mm with the applicable CP6 configuration. Production involving tall connectors, heavy components or large odd-shaped parts may require another placement platform with a dedicated Pick & Place or special-component head.
| Item | Why It Matters |
|---|---|
| Head Combination | Defines placement output and the maximum component range. |
| Component Cameras | Affect the smallest supported packages and vision capability. |
| 01005 Option Package | Requires suitable hardware, nozzles, feeders and software. |
| Conveyor Configuration | Determines PCB dimensions, lane mode and line integration. |
| Wide-Board and Long-Board Options | The maximum board formats are not available on every D2. |
| Feeders and Changeover Tables | These may be included with the machine or quoted separately. |
| Nozzles and Software | Must match the intended component range and production process. |
GEEKVALUE can assist with sourcing SIPLACE D2 placement machines according to current availability. Machines carrying the same model name may have different head combinations, cameras, conveyors, feeder equipment, software and accessory packages.
Send us your PCB dimensions, smallest and largest components, required output, feeder requirements and destination country. We will confirm the available configuration, quotation scope, price and estimated delivery time before an order is placed.
No. It is the theoretical maximum for the dual CP12 configuration. The corresponding SIPLACE nominal rate is 31,000 cph and the IPC 9850 rate is 27,200 cph. Actual production output depends on the board and operating conditions.
No. A compatible CP12 head, the required 01005 package, suitable nozzles, feeder modules and supporting software must be installed.
They are separate SIPLACE models with their own technical documentation and possible configuration differences. D2i data should not be used automatically to describe a D2 machine.
No. The figure refers to the maximum track capacity when compatible 3 × 8 mm S feeder modules are used. The actual feeder quantity and included accessories must be listed in the quotation.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
