The SIPLACE D3 is a three-gantry SMT placement machine designed for production programs that combine standard SMDs, IC packages and larger or more complex components. Its three gantries can be equipped with 12-nozzle Collect & Place heads, 6-nozzle Collec
The SIPLACE D3 is a three-gantry SMT placement machine designed for production programs that combine standard SMDs, IC packages and larger or more complex components. Its three gantries can be equipped with 12-nozzle Collect & Place heads, 6-nozzle Collect & Place heads or SIPLACE TwinHead technology.
The model name alone does not define the machine’s placement speed or component range. These depend on the installed head combination, component cameras, conveyor system, feeder equipment and optional packages. The configuration and condition of the available SIPLACE D3 will be confirmed before quotation.
The SIPLACE D3 uses three independently configured gantries across two placement areas. Collect & Place heads collect several components during each cycle and are primarily used for standard SMD and IC placement. TwinHead works on the Pick & Place principle and extends the machine to fine-pitch packages, connectors, shields and other special components.
A D3 equipped with three 12-nozzle heads prioritizes placement output. Replacing one or more of these heads with a 6-nozzle head or TwinHead reduces the maximum reference speed but increases the range of components that can be processed on the same machine.
| Machine Structure | Three placement gantries and two placement areas |
|---|---|
| Placement Head Options | 12-nozzle Collect & Place, 6-nozzle Collect & Place and TwinHead |
| Maximum IPC 9850 Rating | 37,600 components per hour |
| Maximum SIPLACE Benchmark | 40,400 components per hour |
| Theoretical Maximum | 61,000 components per hour |
| Documented Component Range | 0201 to 200 × 125 mm, depending on the installed heads and options |
| Maximum Reference Feeding Capacity | 180 tracks using 3 × 8 mm S feeder modules |
The IPC, benchmark and theoretical values represent different measurement conditions. The theoretical value is not the expected output of a normal production program. Actual throughput is affected by the head combination, component mix, feeder positions, PCB layout, rotations, transport time and machine condition.
| Head Combination | IPC 9850 | SIPLACE Benchmark | Theoretical Maximum | Production Focus |
|---|---|---|---|---|
| 3 × C&P12 | 37,600 cph | 40,400 cph | 61,000 cph | Maximum reference output for standard SMD and IC placement |
| 2 × C&P12 + C&P6 | 33,200 cph | 36,200 cph | 52,500 cph | High output with additional capability for larger IC packages |
| 2 × C&P12 + TwinHead | 28,800 cph | 31,400 cph | 47,000 cph | Standard components combined with large or special components |
| C&P12 + C&P6 + TwinHead | 24,100 cph | 25,300 cph | 38,500 cph | Mixed-component production requiring three different head functions |
| C&P12 + 2 × TwinHead | 21,300 cph | 23,800 cph | 33,500 cph | Production with a higher proportion of complex components |
| 3 × TwinHead | 11,600 cph | 12,500 cph | 19,500 cph | Fine-pitch, large and odd-shaped component placement |
| Placement Head | Reference Component Capability | Height and Weight | Reference Accuracy | Typical Role |
|---|---|---|---|---|
| C&P12 with Camera Type 28 | 0402 to 18.7 × 18.7 mm | Up to 6 mm and 2 g | ±45 µm at 3σ | Standard SMDs and compatible IC packages |
| C&P12 with Camera Type 29 | 0201 with the required package, up to 18.7 × 18.7 mm | Up to 6 mm and 2 g | ±41 µm at 3σ | Small components combined with standard IC placement |
| C&P6 with Camera Type 29 | 0201 to 27 × 27 mm | Up to 8.5 mm and 5 g | ±45 µm at 3σ | Larger IC packages and mixed-component boards |
| TwinHead with Fine-Pitch Camera | Fine-pitch packages, BGAs, connectors, sockets and special components | Up to 25 mm and 100 g with the applicable configuration | ±26 µm at 3σ | Large, heavy and mechanically demanding components |
| TwinHead with Optional Flip-Chip Camera | 0201, bare dies, flip chips, shields and other compatible packages | Depends on camera, nozzle and component geometry | ±22 µm at 3σ | High-accuracy and specialized component placement |
TwinHead can process components up to 200 × 125 mm under restricted conditions. The maximum dimensions depend on whether one or two nozzles are used and whether a Collect & Place head shares the same placement area. Camera type, nozzle, gripper and software also affect the usable component range.
TwinHead is intended for production programs that cannot be completed using chip heads alone. Depending on the installed equipment, it can handle packages such as BGAs, QFPs, sockets, plugs, shields, bare dies, flip chips and application-specific components.
| Maximum Listed Component Size | Up to 200 × 125 mm with restrictions |
|---|---|
| Maximum Component Height | 25 mm; greater heights were subject to application review |
| Maximum Weight with Standard Nozzles | 100 g |
| Standard Programmable Placement Force | 1 N to 15 N |
| Optional High-Force Range | 2 N to 30 N with the applicable high-force head |
These maximum values should not be treated as universal limits for every SIPLACE D3. The customer’s component drawing, package geometry, pickup surface, weight and required placement force should be checked against the installed head and handling tools.
The SIPLACE D3 was available with a single conveyor or a flexible dual conveyor. The dual conveyor supports synchronous and asynchronous production and can also operate as one wider single conveyor.
| Conveyor Arrangement | Standard PCB Range | Maximum with Required Options |
|---|---|---|
| Single Conveyor | 50 × 50 mm to 450 × 460 mm | Up to 610 × 508 mm |
| Flexible Dual Conveyor | 50 × 50 mm to 450 × 216 mm | Up to 610 × 250 mm |
| Dual Conveyor in Single-Conveyor Mode | 50 × 50 mm to 450 × 380 mm | Up to 610 × 450 mm |
| Standard PCB Thickness | 0.3 to 4.5 mm |
|---|---|
| Maximum PCB Weight | 3 kg |
| Component-Free Handling Edge | 3 mm |
| Reference PCB Changeover Time | Less than 2.5 seconds |
| Production-Line Interface | SMEMA or Siemens interface, depending on configuration |
| Width Adjustment | Automatic electrical adjustment |
Maximum board dimensions require the corresponding wide-board and long-board options. Conveyor type, fixed rail position, transport direction and interface should be confirmed before integrating the machine into an existing SMT line.
The D3 uses movable component changeover tables that can be prepared outside the machine while another product is running. This reduces the line interruption required when changing feeder setups.
| Component Changeover Tables | Up to four tables |
|---|---|
| Feeder Locations per Table | Up to 15 locations |
| Maximum Reference Capacity | 180 tracks with 3 × 8 mm S feeder modules |
| Reference Table Changeover Time | Less than one minute |
| Supported Feeding Methods | Tape feeders, stick magazines, bulk cases, DIP modules, waffle-pack trays and application-specific feeder modules |
| Optional Tray Equipment | Matrix tray changer or waffle-pack changer, depending on configuration |
The 180-track figure describes the maximum platform capacity. It does not mean that an available machine includes 180 feeders. Feeder tables, individual feeders, tray systems, nozzles and other accessories must be confirmed in the quotation.
The SIPLACE D3 is most relevant when one placement machine must cover several component categories. A C&P-focused configuration is suitable for boards dominated by standard SMDs and ICs, while a machine containing TwinHead technology can add connectors, shields, sockets and other complex packages.
For production focused almost entirely on very small chips, a fixed high-speed configuration may provide a simpler capacity profile. When large, tall or high-force components are involved, the value of the D3 depends on the exact TwinHead, camera and tooling installed.
| Item | Why It Must Be Checked |
|---|---|
| Placement Head Combination | Defines the reference output and the component types the machine can process. |
| Component Camera Types | Affect minimum package size, maximum dimensions and placement accuracy. |
| TwinHead Equipment | Large-component, flip-chip and high-force functions require suitable hardware. |
| Conveyor Configuration | Determines PCB dimensions, track operation and compatibility with adjacent equipment. |
| Feeders and Changeover Tables | These may be included with the machine or supplied separately. |
| Nozzles and Grippers | The tooling must match the shape, pickup surface and weight of the customer’s components. |
| Software and Interfaces | Software generation and available licenses affect programming and line integration. |
| Machine Condition | Current photos, configuration and included accessories should match the final quotation. |
GEEKVALUE can assist with sourcing SIPLACE D3 placement machines according to current availability. Available machines may have different placement heads, cameras, conveyors, feeder tables, software versions and accessory packages.
Send us your PCB dimensions, smallest and largest components, required output, feeder requirements and destination country. We will confirm the available configuration, current machine photos, condition, included equipment, price and estimated delivery time before quotation.
No. The original specification identifies 61,000 cph as the theoretical maximum for a D3 fitted with three C&P12 heads. The corresponding SIPLACE benchmark is 40,400 cph and the IPC 9850 rating is 37,600 cph. Actual output depends on the production program and machine configuration.
The reviewed SIPLACE D3 specification lists 0201 as the smallest documented component size when the required package is installed. 01005 capability should not be claimed for a D3 unless separate documentation confirms that it is supported by the specific machine, head, feeder and software configuration.
No. This upper limit applies to TwinHead under restricted conditions and requires suitable cameras, nozzles or grippers. The maximum may also be reduced when TwinHead shares a placement area with a Collect & Place head.
No. The number refers to the maximum track capacity when four tables use 3 × 8 mm S feeder modules. The actual feeder quantity and all included accessories must be confirmed in the quotation.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
