The SIPLACE D1i is a single-gantry SMT pick and place machine from the SIPLACE D-series. Its modular design allows the gantry to operate with one or two placement heads, giving manufacturers a choice between standard SMD placement, larger component handli
The SIPLACE D1i is a single-gantry SMT pick and place machine from the SIPLACE D-series. Its modular design allows the gantry to operate with one or two placement heads, giving manufacturers a choice between standard SMD placement, larger component handling and mixed-component production.
Placement heads, conveyor type, feeder capacity and optional packages can differ between machines. The information below describes the original D1i platform specifications. The configuration, condition, included accessories, current price and delivery time of an available machine should be confirmed before quotation.
The D1i combines a stationary PCB placement area with stationary component supply tables. The placement heads collect components from the feeder area, optically center them and place them onto the PCB. Depending on the production task, the machine can use a 12-nozzle Collect & Place head, a 6-nozzle Collect & Place head or a Pick & Place head.
A standard SIPLACE D1i can be configured with two heads on one gantry. The single-head version is identified in the original documentation as the SIPLACE D1iS. A second head could also be added to a compatible single-head machine using an upgrade kit.
| Configuration | Placement Heads | Primary Use |
|---|---|---|
| Dual-head configuration | 12-nozzle Collect & Place head + Pick & Place head | Standard SMD placement combined with large, fine-pitch or special components |
| Dual-head configuration | 6-nozzle Collect & Place head + Pick & Place head | Mixed production requiring IC handling and flexible special-component placement |
| Single-head configuration | 12-nozzle Collect & Place head | Higher-speed placement of standard components |
| Single-head configuration | 6-nozzle Collect & Place head | Placement of standard components and larger IC packages |
| Single-head configuration | Pick & Place head | Fine-pitch, special, large and complex components |
The Collect & Place heads pick up several components during each cycle before moving to the PCB. The Pick & Place head handles one component at a time and supports more demanding packages, including fine-pitch components, BGAs, special components, bare dies and flip-chips. Actual capability depends on the camera, nozzle and software configuration installed on the machine.
| Placement Head | IPC 9850 Rate | SIPLACE Benchmark Rate | Theoretical Rate | Reference Component Capability |
|---|---|---|---|---|
| 12-Nozzle Collect & Place | 13,000 components/hour | 15,000 components/hour | 20,000 components/hour | Standard SMDs; 01005 capability requires the appropriate optional package |
| 6-Nozzle Collect & Place | 8,400 components/hour | 9,800 components/hour | 11,500 components/hour | Components from 0201 up to 27 × 27 mm, subject to package and vision conditions |
| Pick & Place | 2,600 components/hour | 2,800 components/hour | 3,500 components/hour | Large and special components up to 200 × 125 mm with restrictions |
These figures are reference rates for the individual placement heads under defined test conditions. They are not guaranteed production output. Actual throughput depends on the installed head combination, component mix, PCB layout, feeder arrangement, program optimization and equipment condition.
| Machine Platform | Single-gantry SMT placement machine |
|---|---|
| Placement Heads | One or two heads, depending on configuration |
| Available Head Types | 12-nozzle Collect & Place, 6-nozzle Collect & Place and Pick & Place |
| Overall Component Range | 01005 with the required package, up to 200 × 125 mm with restrictions |
| Best Listed X/Y Accuracy | ±30 μm at 3σ or ±40 μm at 4σ, depending on head and camera configuration |
| Maximum Feeding Capacity | 90 tracks using 3 × 8 mm S feeder modules |
| Conveyor Options | Single conveyor or flexible dual conveyor |
| Maximum PCB Format | Up to 610 × 508 mm with the required long-board and wide-board configuration |
| PCB Thickness | 0.3–4.5 mm; other thicknesses were available on request |
| Maximum PCB Weight | 3 kg |
| Production-Line Interface | SMEMA or Siemens interface, depending on configuration |
The SIPLACE D1i platform was prepared for 01005 placement, but this capability should not be assumed for every available machine. It requires a compatible 12-nozzle Collect & Place head and the optional 01005 package.
The original package included dedicated nozzles and components for low-force placement. Compatible feeder modules, camera equipment and suitable software versions were also required. Before purchasing a D1i for 01005 production, the installed hardware, software and feeder configuration should be checked together.
The D1i was available with either a single conveyor or a flexible dual conveyor. In dual-conveyor mode, two PCBs can be processed synchronously as a common panel or asynchronously, allowing one board to enter the placement area while the other track is being processed.
| Conveyor Setup | Standard PCB Format | Maximum Format with Options |
|---|---|---|
| Single Conveyor | 50 × 50 mm to 460 × 460 mm | Up to 610 × 508 mm with long-board and wide-board options |
| Flexible Dual Conveyor | 50 × 50 mm to 460 × 216 mm per reference configuration | Up to 610 × 242 mm with the applicable options |
| Dual Conveyor in Single-Conveyor Mode | 50 × 50 mm to 460 × 380 mm | Up to 610 × 430 mm with the applicable options |
The conveyor installed on the available machine should be confirmed before matching it to a production line. PCB width, transport direction, interface type and conveyor height can affect integration with adjacent SMT equipment.
SIPLACE component changeover tables can be prepared beside the machine or in an external setup area. This allows feeders and component reels to be prepared while production continues, reducing the interruption required when changing products.
Supported feeding arrangements described for the platform include tape feeders, waffle-pack trays, stick magazine feeders, bulk-component feeders, DIP modules and application-specific feeder modules. A waffle-pack changer was also available as an option. Feeders, changeover tables and tray equipment are not necessarily included with every used machine and should be listed separately in the quotation.
The D1i uses digital vision equipment to locate and inspect components before placement. Depending on the head configuration, the system can include standard, high-resolution, fine-pitch or flip-chip cameras.
Vacuum, component and force sensors are used to check component pickup, nozzle position and placement force. The system can also compensate for height differences during pickup and PCB surface variation during placement. The exact cameras and optional inspection functions installed on an available machine must be confirmed individually.
| Item | Why It Should Be Confirmed |
|---|---|
| Placement Head Combination | Determines the balance between placement rate and component-handling capability. |
| 01005 Hardware and Software | The model is prepared for 01005, but the required optional package may not be installed. |
| Camera and Nozzle Configuration | Affects package recognition, component size limits and placement accuracy. |
| Conveyor Type | Determines the supported PCB dimensions and production-line connection method. |
| Feeders and Changeover Tables | These may be included with the machine or quoted separately. |
| Waffle-Pack or Tray Equipment | Tray-handling equipment was optional and is not present on every configuration. |
| Software Version | Should be checked for production requirements, option compatibility and integration with an existing SIPLACE line. |
| Machine Condition and Accessories | Actual photos, condition, included parts and delivery scope should match the final quotation. |
GEEKVALUE provides sourcing and quotation support for SIPLACE D1i SMT placement machines according to current availability. Available equipment may differ in production year, head combination, conveyor setup, software version, machine condition and included feeders or accessories.
Send us your destination country and any known requirements for PCB size, component range, conveyor configuration and feeders. We will confirm the available machine information, actual photos, configuration, price and estimated delivery time before quotation.
No. The D1i platform was prepared for 01005 placement, but a compatible 12-nozzle Collect & Place head, the optional 01005 package, suitable feeders and the required software are needed. These items should be checked on the available machine.
No. A D1i may have two placement heads, while the D1iS configuration uses one head. The head types and installed combination should be confirmed from the actual machine configuration.
Feeders, nozzles, changeover tables and tray-handling equipment may be included or offered separately. The quotation should clearly identify all accessories included in the delivery scope.
Useful information includes the destination country, PCB dimensions, component range, required conveyor type and any feeder or tray requirements. When the exact configuration is not known, contact us with the available production information for further discussion.
If you are not sure whether this product matches your machine, send us the model, label photo or old part picture for checking.
